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D25AP1002K371%BN

Description
Fixed Resistor, Metal Glaze/thick Film, 0.25W, 2370ohm, 200V, 1% +/-Tol, -100,100ppm/Cel, 1206,
CategoryPassive components    The resistor   
File Size121KB,7 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Environmental Compliance
Download Datasheet Parametric View All

D25AP1002K371%BN Overview

Fixed Resistor, Metal Glaze/thick Film, 0.25W, 2370ohm, 200V, 1% +/-Tol, -100,100ppm/Cel, 1206,

D25AP1002K371%BN Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid895292067
Reach Compliance Codeunknown
Country Of OriginIsrael
ECCN codeEAR99
YTEOL7.65
structureChip
JESD-609 codee4
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package height0.55 mm
Package length3.2 mm
Package formSMT
Package width1.6 mm
method of packingTR, Blister, 13 Inch
Rated power dissipation(P)0.25 W
resistance2370 Ω
Resistor typeFIXED RESISTOR
seriesD-AP
size code1206
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient100 ppm/°C
Terminal surfaceSilver/Palladium (Ag/Pd)
Tolerance1%
Operating Voltage200 V
D AP, CRCW-AP
Vishay Draloric
Thick Film, Rectangular Chip Resistors
for Conductive Gluing
FEATURES
AgPd-Terminations for conductive gluing
Stability
ΔR/R
= 1 % for 1000 h at 70 °C
Metal glaze on high quality ceramic
Compliant to RoHS directive 2002/95/EC
Halogen-free according to IEC 61249-2-21
definition
STANDARD ELECTRICAL SPECIFICATIONS
SIZE
MODEL
INCH
METRIC
RATED
DISSIPATION
P
70
W
0.063
LIMITING
ELEMENT
VOLTAGE
U
max.
AC/DC
50
TEMPERATURE
COEFFICIENT
ppm/K
TOLERANCE
%
±1
±5
±1
±5
±1
±5
±1
±5
±1
±5
±1
±5
±1
±5
±1
±5
RESISTANCE
RANGE
Ω
100R to 10M
10R to 10M
18R to 10M
3R6 to 10M
18R to 10M
3R6 to 10M
18R to 10M
3R6 to 10M
18R to 10M
3R6 to 10M
18R to 2M2
3R6 to 2M2
18R to 10M
3R6 to 10M
18R to 10M
3R6 to 10M
SERIES
E24; E96
E24
E24; E96
E24
E24; E96
E24
E24; E96
E24
E24; E96
E24
E24; E96
E24
E24; E96
E24
E24; E96
E24
D10 AP
0402
RR 1005M
D11 AP
0603
RR 1608M
D12 AP
0805
RR 2012M
D25 AP
1206
RR 3216M
CRCW1210-AP
1210
RR 3225M
CRCW1218-AP
1218
RR 3246M
CRCW2010-AP
2010
RR 5025M
CRCW2512-AP
2512
RR 6332M
± 100
± 200
Zero-Ohm-Resistor:
R
max.
< 200 mΩ,
I
max.
= 0.5 A
± 100
0.10
75
± 200
Zero-Ohm-Resistor:
R
max.
< 200 mΩ,
I
max.
= 0.7 A
± 100
0.125
150
± 200
Zero-Ohm-Resistor:
R
max.
< 200 mΩ,
I
max.
= 0.8 A
± 100
0.25
200
± 200
Zero-Ohm-Resistor:
R
max.
< 200 mΩ,
I
max.
= 1.0 A
± 100
0.50
200
± 200
Zero-Ohm-Resistor:
R
max.
< 200 mΩ,
I
max.
= 1.5 A
± 100
1.0
200
± 200
Zero-Ohm-Resistor:
R
max.
< 200 mΩ,
I
max.
= 2.0 A
± 100
0.75
400
± 200
Zero-Ohm-Resistor:
R
max.
< 200 mΩ,
I
max.
= 1.8 A
± 100
1.0
500
± 200
Zero-Ohm-Resistor:
R
max.
< 200 mΩ,
I
max.
= 2.0 A
Notes
These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over
operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional time.
Marking and packaging: See datasheet "Surface Mount Resistor Marking" (document number 20020)
Power rating depends on the max. temperature at the joint point, the component placement density and the substrate material.
TECHNICAL SPECIFICATIONS
PARAMETER
Rated dissipation
P
70 (1)
Limiting element voltage
U
max.
AC/DC
Insulation voltage
U
ins.
(1 min)
Insulation resistance
Category temperature
range
Failure rate
Weight
(1)
UNIT D10 AP D11 AP D12 AP D25 AP CRCW1210-AP CRCW1218-AP CRCW2010-AP CRCW2512-AP
W
0.063
0.1
0.125
0.25
0.5
1.0
0.75
1.0
V
V
Ω
°C
h
-1
mg
0.65
2
5.5
10
16
50
> 75
75
> 100
150
> 200
200
> 300
200
> 300
> 10
9
- 55 to + 155
< 0.1 x 10
- 9
29.5
25.5
40.5
200
> 300
400
> 300
500
> 300
Note
The power dissipation on the resistors generates a temperature rise against the local ambient, depending on the heat flow support of the
printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 155 °C is not exceed.
Document Number: 20038
Revision: 29-Oct-10
For technical questions, contact:
thickfilmchip@vishay.com
www.vishay.com
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