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74HC30PW,118

Description
logic gates 8-input nand gate
Categorylogic    logic   
File Size114KB,16 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
Download Datasheet Parametric Compare View All

74HC30PW,118 Overview

logic gates 8-input nand gate

74HC30PW,118 Parametric

Parameter NameAttribute value
Brand NameNXP Semiconduc
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeTSSOP
Contacts14
Manufacturer packaging codeSOT402-1
Reach Compliance Codecompli
seriesHC/UH
JESD-30 codeR-PDSO-G14
JESD-609 codee4
length5 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeNAND GATE
MaximumI(ol)0.004 A
Humidity sensitivity level1
Number of functions1
Number of entries8
Number of terminals14
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP14,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packingTAPE AND REEL
Peak Reflow Temperature (Celsius)260
power supply2/6 V
Prop。Delay @ Nom-Su39 ns
propagation delay (tpd)39 ns
Certification statusNot Qualified
Schmitt triggerNO
Maximum seat height1.1 mm
Maximum supply voltage (Vsup)6 V
Minimum supply voltage (Vsup)2 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceNICKEL PALLADIUM GOLD
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width4.4 mm
Base Number Matches1
74HC30; 74HCT30
8-input NAND gate
Rev. 6 — 27 December 2012
Product data sheet
1. General description
The 74HC30; 74HCT30 is an 8-input NAND gate. Inputs include clamp diodes. This
enables the use of current limiting resistors to interface inputs to voltages in excess of
V
CC
.
2. Features and benefits
Complies with JEDEC standard JESD7A
Input levels:
For 74HC30: CMOS level
For 74HCT30: TTL level
ESD protection:
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V
Multiple package options
Specified from
40 C
to +85
C
and from
40 C
to +125
C
3. Ordering information
Table 1.
Ordering information
Package
Temperature range Name
74HC30N
74HCT30N
74HC30D
74HCT30D
74HC30DB
74HCT30DB
74HC30PW
74HCT30PW
40 C
to +125
C
TSSOP14
40 C
to +125
C
SSOP14
40 C
to +125
C
SO14
plastic small outline package; 14 leads;
body width 3.9 mm
plastic shrink small outline package; 14 leads; body
width 5.3 mm
plastic thin shrink small outline package; 14 leads;
body width 4.4 mm
SOT108-1
SOT337-1
SOT402-1
40 C
to +125
C
DIP14
Description
plastic dual in-line package; 14 leads (300 mil)
Version
SOT27-1
Type number

74HC30PW,118 Related Products

74HC30PW,118 74HCT30DB,112 74HCT30N,652 74HCT30PW,118 74HC30D,653
Description logic gates 8-input nand gate logic gates 8-input nand gate logic gates 8-input nand gate logic gates 8-input nand gate logic gates 8-input nand gate
Brand Name NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconductor
Is it Rohs certified? conform to conform to conform to conform to conform to
Maker NXP NXP NXP NXP NXP
Parts packaging code TSSOP SSOP1 DIP TSSOP SOIC
Contacts 14 14 14 14 14
Manufacturer packaging code SOT402-1 SOT337-1 SOT27-1 SOT402-1 SOT108-1
Reach Compliance Code compli compli compli compli compliant
series HC/UH HCT HCT HCT HC/UH
JESD-30 code R-PDSO-G14 R-PDSO-G14 R-PDIP-T14 R-PDSO-G14 R-PDSO-G14
JESD-609 code e4 e4 e4 e4 e4
length 5 mm 6.2 mm 19.025 mm 5 mm 8.65 mm
Load capacitance (CL) 50 pF 50 pF 50 pF 50 pF 50 pF
Logic integrated circuit type NAND GATE NAND GATE NAND GATE NAND GATE NAND GATE
MaximumI(ol) 0.004 A 0.004 A 0.004 A 0.004 A 0.004 A
Number of functions 1 1 1 1 1
Number of entries 8 8 8 8 8
Number of terminals 14 14 14 14 14
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP SSOP DIP TSSOP SOP
Encapsulate equivalent code TSSOP14,.25 SSOP14,.3 DIP14,.3 TSSOP14,.25 SOP14,.25
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Peak Reflow Temperature (Celsius) 260 260 260 260 260
power supply 2/6 V 5 V 5 V 5 V 2/6 V
propagation delay (tpd) 39 ns 42 ns 42 ns 42 ns 39 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Schmitt trigger NO NO NO NO NO
Maximum seat height 1.1 mm 2 mm 4.2 mm 1.1 mm 1.75 mm
Maximum supply voltage (Vsup) 6 V 5.5 V 5.5 V 5.5 V 6 V
Minimum supply voltage (Vsup) 2 V 4.5 V 4.5 V 4.5 V 2 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V
surface mount YES YES NO YES YES
technology CMOS CMOS CMOS CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal surface NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD
Terminal form GULL WING GULL WING THROUGH-HOLE GULL WING GULL WING
Terminal pitch 0.65 mm 0.65 mm 2.54 mm 0.65 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 30 30 30 30 30
width 4.4 mm 5.3 mm 7.62 mm 4.4 mm 3.9 mm
Base Number Matches 1 1 1 1 1
Humidity sensitivity level 1 1 - 1 1
method of packing TAPE AND REEL TUBE - TAPE AND REEL TAPE AND REEL
Prop。Delay @ Nom-Su 39 ns 42 ns 42 ns 42 ns -

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