74LVC2G241DC,125 datasheet, PDF

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74LVC2G241DC,125: Descriptionbuffers & line drivers 3.3V 2 buf/ldrvr; Categorylogic logic; File Size291KB，23 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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74LVC2G241DC,125 Overview

buffers & line drivers 3.3V 2 buf/ldrvr

74LVC2G241DC,125 Parametric

Parameter Name	Attribute value
Brand Name	NXP Semiconduc
Is it Rohs certified?	conform to
Maker	NXP
Parts packaging code	SSOP
package instruction	2.30 MM, PLASTIC, MO-187, SOT-765-1, VSSOP-8
Contacts	8
Manufacturer packaging code	SOT765-1
Reach Compliance Code	compli
Other features	OUTPUT ENABLE ACTIVE HIGH FOR ONE FUNCTION
Control type	ENABLE LOW/HIGH
series	LVC/LCX/Z
JESD-30 code	R-PDSO-G8
JESD-609 code	e4
length	2.3 mm
Logic integrated circuit type	BUS DRIVER
MaximumI(ol)	0.024 A
Humidity sensitivity level	1
Number of digits	1
Number of functions	2
Number of ports	2
Number of terminals	8
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Output characteristics	3-STATE
Output polarity	TRUE
Package body material	PLASTIC/EPOXY
encapsulated code	VSSOP
Encapsulate equivalent code	TSSOP8,.12,20
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
method of packing	TAPE AND REEL
Peak Reflow Temperature (Celsius)	260
power supply	3.3 V
Prop。Delay @ Nom-Su	5.4 ns
propagation delay (tpd)	11 ns
Certification status	Not Qualified
Maximum seat height	1 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	1.65 V
Nominal supply voltage (Vsup)	2.7 V
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal surface	NICKEL PALLADIUM GOLD
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	2 mm

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74LVC2G241

Dual buffer/line driver; 3-state

Rev. 13 — 8 April 2013

Product data sheet

1. General description

The 74LVC2G241 is a dual non-inverting buffer/line driver with 3-state outputs. The

3-state outputs are controlled by the output enable inputs 1OE and 2OE:

•

A HIGH level at pin 1OE causes output 1Y to assume a high-impedance OFF-state.

•

A LOW level at pin 2OE causes output 2Y to assume a high-impedance OFF-state.

Schmitt trigger action at all inputs makes the circuit highly tolerant of slower input rise and

fall times.

Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of the

74LVC2G241 as a translator in a mixed 3.3 V and 5 V environment.

This device is fully specified for partial power-down applications using I

OFF

. The I

OFF

circuitry disables the output, preventing a damaging backflow current through the device

when it is powered down.

2. Features and benefits



Wide supply voltage range from 1.65 V to 5.5 V

5 V tolerant input/output for interfacing with 5 V logic

High noise immunity

Complies with JEDEC standard:



JESD8-7 (1.65 V to 1.95 V)



JESD8-5 (2.3 V to 2.7 V)



JESD8-B/JESD36 (2.7 V to 3.6 V)

ESD protection:



HBM JESD22-A114F exceeds 2000 V



MM JESD22-A115-A exceeds 200 V

24

mA output drive (V

= 3.0 V)

CMOS low power consumption

Latch-up performance exceeds 250 mA

Direct interface with TTL levels

Inputs accept voltages up to 5 V

Multiple package options

Specified from

40 C

to +85

C

and

40 C

to +125

C



74LVC2G241DC,125 Related Products

	74LVC2G241DC,125	74LVC2G241GT,115	74LVC2G241GD,125	74LVC2G241GM,125
Description	buffers & line drivers 3.3V 2 buf/ldrvr	buffers & line drivers 3.3V buf/ldrvr 5V	buffers & line drivers buffer/LN driver 2ch non-inverting 8-pin	buffers & line drivers 3.3V dual buf/ldrvr
Brand Name	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc
Is it Rohs certified?	conform to	conform to	conform to	conform to
Parts packaging code	SSOP	SON	SON	QFN
package instruction	2.30 MM, PLASTIC, MO-187, SOT-765-1, VSSOP-8	1 X 1.95 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-833-1, SON-8	3 X 2 MM, 0.50 MM HEIGHT, PLASTIC, SOT-996-1, XSON-8	1.60 X 1.60 MM, 0.50 MM HEIGHT, PLASTIC, MO-255, SOT-902-1, XQFN-8
Contacts	8	8	8	8
Manufacturer packaging code	SOT765-1	SOT833-1	SOT996-2	SOT902-2
Reach Compliance Code	compli	compli	compli	compli
Other features	OUTPUT ENABLE ACTIVE HIGH FOR ONE FUNCTION	OUTPUT ENABLE ACTIVE HIGH FOR ONE FUNCTION	OUTPUT ENABLE ACTIVE HIGH FOR ONE FUNCTION	OUTPUT ENABLE ACTIVE HIGH FOR ONE FUNCTION
Control type	ENABLE LOW/HIGH	ENABLE LOW/HIGH	ENABLE LOW/HIGH	ENABLE LOW/HIGH
series	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z
JESD-30 code	R-PDSO-G8	R-PDSO-N8	R-PDSO-N8	S-PQCC-N8
JESD-609 code	e4	e3	e4	e4
length	2.3 mm	1.95 mm	3 mm	1.6 mm
Logic integrated circuit type	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER
MaximumI(ol)	0.024 A	0.024 A	0.024 A	0.024 A
Humidity sensitivity level	1	1	1	1
Number of digits	1	1	1	1
Number of functions	2	2	2	2
Number of ports	2	2	2	2
Number of terminals	8	8	8	8
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE
Output polarity	TRUE	TRUE	TRUE	TRUE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	VSSOP	VSON	VSON	VQCCN
Encapsulate equivalent code	TSSOP8,.12,20	SOLCC8,.04,20	SOLCC8,.11,20	LCC8,.06SQ,20
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE
Package form	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE, VERY THIN PROFILE	CHIP CARRIER, VERY THIN PROFILE
method of packing	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL
Peak Reflow Temperature (Celsius)	260	260	260	260
power supply	3.3 V	3.3 V	3.3 V	3.3 V
Prop。Delay @ Nom-Su	5.4 ns	5.4 ns	5.4 ns	5.4 ns
propagation delay (tpd)	11 ns	11 ns	11 ns	11 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1 mm	0.5 mm	0.5 mm	0.5 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	1.65 V	1.65 V	1.65 V	1.65 V
Nominal supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
Terminal surface	NICKEL PALLADIUM GOLD	Tin (Sn)	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD
Terminal form	GULL WING	NO LEAD	NO LEAD	NO LEAD
Terminal pitch	0.5 mm	0.5 mm	0.5 mm	0.55 mm
Terminal location	DUAL	DUAL	DUAL	QUAD
Maximum time at peak reflow temperature	30	30	30	30
width	2 mm	1 mm	2 mm	1.6 mm
Maker	NXP	-	NXP	NXP

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