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74HCT241DB,118

Description
buffers & line drivers octal buffer 3-state
Categorylogic    logic   
File Size50KB,9 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
Download Datasheet Parametric Compare View All

74HCT241DB,118 Overview

buffers & line drivers octal buffer 3-state

74HCT241DB,118 Parametric

Parameter NameAttribute value
Brand NameNXP Semiconduc
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeSSOP2
package instructionPLASTIC, SSOP-20
Contacts20
Manufacturer packaging codeSOT339-1
Reach Compliance Codeunknow
Other featuresOUTPUT ENABLE ACTIVE HIGH FOR ONE FUNCTION
seriesHCT
JESD-30 codeR-PDSO-G20
JESD-609 codee4
length7.2 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeBUS DRIVER
Humidity sensitivity level1
Number of digits4
Number of functions2
Number of ports2
Number of terminals20
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Output characteristics3-STATE
Output polarityTRUE
Package body materialPLASTIC/EPOXY
encapsulated codeSSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Celsius)260
propagation delay (tpd)33 ns
Certification statusNot Qualified
Maximum seat height2 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceNICKEL PALLADIUM GOLD
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width5.3 mm
INTEGRATED CIRCUITS
DATA SHEET
For a complete data sheet, please also download:
The IC06 74HC/HCT/HCU/HCMOS Logic Family Specifications
The IC06 74HC/HCT/HCU/HCMOS Logic Package Information
The IC06 74HC/HCT/HCU/HCMOS Logic Package Outlines
74HC/HCT241
Octal buffer/line driver; 3-state
Product specification
File under Integrated Circuits, IC06
September 1993

74HCT241DB,118 Related Products

74HCT241DB,118 74HC241DB,112 74HCT241DB,112 272P-R56-JT10
Description buffers & line drivers octal buffer 3-state buffers & line drivers octal buffer 3-state buffers & line drivers octal buffer 3-state Fixed Resistor, Wire Wound, 10W, 0.56ohm, 600V, 5% +/-Tol, 10ppm/Cel,
Reach Compliance Code unknow compli compliant compliant
series HCT HC/UH HCT 200
Number of terminals 20 20 20 2
Maximum operating temperature 125 °C 125 °C 125 °C 350 °C
Minimum operating temperature -40 °C -40 °C -40 °C -55 °C
Package shape RECTANGULAR RECTANGULAR RECTANGULAR CYLINDRICAL PACKAGE
Package form SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH Axial
technology CMOS CMOS CMOS WIRE WOUND
Brand Name NXP Semiconduc NXP Semiconduc NXP Semiconductor -
Is it Rohs certified? conform to conform to conform to -
Maker NXP NXP NXP -
Parts packaging code SSOP2 SSOP2 SSOP2 -
package instruction PLASTIC, SSOP-20 SSOP, SSOP20,.3 SSOP, SSOP20,.3 -
Contacts 20 20 20 -
Manufacturer packaging code SOT339-1 SOT339-1 SOT339-1 -
Other features OUTPUT ENABLE ACTIVE HIGH FOR ONE FUNCTION OUTPUT ENABLE ACTIVE HIGH FOR ONE FUNCTION OUTPUT ENABLE ACTIVE HIGH FOR ONE FUNCTION -
JESD-30 code R-PDSO-G20 R-PDSO-G20 R-PDSO-G20 -
JESD-609 code e4 e4 e4 -
length 7.2 mm 7.2 mm 7.2 mm -
Load capacitance (CL) 50 pF 50 pF 50 pF -
Logic integrated circuit type BUS DRIVER BUS DRIVER BUS DRIVER -
Humidity sensitivity level 1 1 1 -
Number of digits 4 4 4 -
Number of functions 2 2 2 -
Number of ports 2 2 2 -
Output characteristics 3-STATE 3-STATE 3-STATE -
Output polarity TRUE TRUE TRUE -
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY -
encapsulated code SSOP SSOP SSOP -
Peak Reflow Temperature (Celsius) 260 260 260 -
propagation delay (tpd) 33 ns 30 ns 33 ns -
Certification status Not Qualified Not Qualified Not Qualified -
Maximum seat height 2 mm 2 mm 2 mm -
Maximum supply voltage (Vsup) 5.5 V 6 V 5.5 V -
Minimum supply voltage (Vsup) 4.5 V 2 V 4.5 V -
Nominal supply voltage (Vsup) 5 V 5 V 5 V -
surface mount YES YES YES -
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE -
Terminal surface NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD -
Terminal form GULL WING GULL WING GULL WING -
Terminal pitch 0.65 mm 0.65 mm 0.65 mm -
Terminal location DUAL DUAL DUAL -
Maximum time at peak reflow temperature 30 30 30 -
width 5.3 mm 5.3 mm 5.3 mm -
method of packing - TUBE TUBE TR
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