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74AHC2G241GD,125

Description
buffers & line drivers dual buffer/line driver 3-S
Categorylogic    logic   
File Size195KB,17 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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74AHC2G241GD,125 Overview

buffers & line drivers dual buffer/line driver 3-S

74AHC2G241GD,125 Parametric

Parameter NameAttribute value
Source Url Status Check Date2013-06-14 00:00:00
Brand NameNXP Semiconduc
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeSON
package instruction3 X 2 MM, 0.50 MM HEIGHT, PLASTIC, SOT-996-2, UTLP-8
Contacts8
Manufacturer packaging codeSOT996-2
Reach Compliance Codecompli
Is SamacsysN
Base Number Matches1
74AHC2G241; 74AHCT2G241
Dual buffer/line driver; 3-state
Rev. 3 — 13 May 2013
Product data sheet
1. General description
The 74AHC2G241; 74AHCT2G241 is a high-speed Si-gate CMOS device.
The 74AHC2G241; 74AHCT2G241 is a dual non-inverting buffer/line driver with 3-state
outputs. The 3-state outputs are controlled by the output enable inputs 1OE and 2OE. A
HIGH level at pin 1OE causes output 1Y to assume a high-impedance OFF-state. A LOW
level at pin 2OE causes output 2Y to assume a high-impedance OFF-state.
Schmitt-trigger action at all inputs makes the circuit highly tolerant for slower input rise
and fall times.
2. Features and benefits
Symmetrical output impedance
High noise immunity
ESD protection:
HBM JESD22-A114E: exceeds 2000 V
MM JESD22-A115-A: exceeds 200 V
CDM JESD22-C101C: exceeds 1000 V
Low power dissipation
Balanced propagation delays
Multiple package options
Specified from
40 C
to +85
C
and from
40 C
to +125
C
3. Ordering information
Table 1.
Ordering information
Package
Temperature range
74AHC2G241DP
74AHCT2G241DP
74AHC2G241DC
74AHCT2G241DC
74AHC2G241GD
74AHCT2G241GD
40 C
to +125
C
XSON8
40 C
to +125
C
VSSOP8
40 C
to +125
C
Name
TSSOP8
Description
plastic thin shrink small outline package; 8 leads;
body width 3 mm; lead length 0.5 mm
Version
SOT505-2
Type number
plastic very thin shrink small outline package; 8 leads; SOT765-1
body width 2.3 mm
plastic extremely thin small outline package; no leads; SOT996-2
8 terminals; body 3
2
0.5 mm

74AHC2G241GD,125 Related Products

74AHC2G241GD,125 74AHC2G241DC,125 74AHC2G241DP,125
Description buffers & line drivers dual buffer/line driver 3-S buffers & line drivers dual buf/driver 3-S buffers & line drivers dual buf/driver 3-S
Brand Name NXP Semiconduc NXP Semiconduc NXP Semiconduc
Is it Rohs certified? conform to conform to conform to
Maker NXP NXP NXP
Parts packaging code SON SSOP TSSOP
package instruction 3 X 2 MM, 0.50 MM HEIGHT, PLASTIC, SOT-996-2, UTLP-8 2.30 MM, PLASTIC, MO-187, SOT-765-1, VSSOP-8 3 MM WIDTH, PLASTIC, SOT-505-2, TSSOP-8
Contacts 8 8 8
Manufacturer packaging code SOT996-2 SOT765-1 SOT505-2
Reach Compliance Code compli compli compli
Is Samacsys N N N
Base Number Matches 1 1 1
Control type - ENABLE LOW/HIGH ENABLE LOW/HIGH
series - AHC/VHC/H/U/V AHC/VHC/H/U/V
JESD-30 code - R-PDSO-G8 S-PDSO-G8
JESD-609 code - e4 e4
length - 2.3 mm 3 mm
Load capacitance (CL) - 50 pF 50 pF
Logic integrated circuit type - BUS DRIVER BUS DRIVER
MaximumI(ol) - 0.008 A 0.008 A
Humidity sensitivity level - 1 1
Number of digits - 1 1
Number of functions - 2 2
Number of ports - 2 2
Number of terminals - 8 8
Maximum operating temperature - 125 °C 125 °C
Minimum operating temperature - -40 °C -40 °C
Output characteristics - 3-STATE 3-STATE
Output polarity - TRUE TRUE
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - VSSOP TSSOP
Encapsulate equivalent code - TSSOP8,.12,20 TSSOP8,.16
Package shape - RECTANGULAR SQUARE
Package form - SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packing - TAPE AND REEL TAPE AND REEL
Peak Reflow Temperature (Celsius) - 260 260
power supply - 2/5.5 V 2/5.5 V
Prop。Delay @ Nom-Su - 9.5 ns 9.5 ns
propagation delay (tpd) - 14.5 ns 14.5 ns
Certification status - Not Qualified Not Qualified
Maximum seat height - 1 mm 1.1 mm
Maximum supply voltage (Vsup) - 5.5 V 5.5 V
Minimum supply voltage (Vsup) - 2 V 2 V
Nominal supply voltage (Vsup) - 5 V 5 V
surface mount - YES YES
technology - CMOS CMOS
Temperature level - AUTOMOTIVE AUTOMOTIVE
Terminal surface - NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD
Terminal form - GULL WING GULL WING
Terminal pitch - 0.5 mm 0.65 mm
Terminal location - DUAL DUAL
Maximum time at peak reflow temperature - 30 30
width - 2 mm 3 mm

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