3.2 mm x 5.0 mm Ceramic Package SMD Oscillator
ISM82 Series
Product Features:
Wide Temperature Range (-55º to +125ºC)
Frequency Stability option ±50 ppm over the full operating temperature range.
Low Phase Noise
RoHS Compliant
Frequency
Output Level
CMOS
Duty Cycle
Rise / Fall Time
Output Load
Frequency Stability
1.000 MHz to 125.000 MHz
Logic ‘0’ = 10% of Vcc max
Logic ‘1’ = 90% of Vcc min
Specify 50% ±10% or ±5% See Table in Part Number Guide
5 nS Max. for 10% to 90% of waveform
15 pF
5.00±.20
IYWW
FREQ
3.20±.20
1.30
max
2.54
See Frequency Stability Table (Includes room temperature tolerance
and stability over operating temperature)
±3 ppm max
5 mS Max.
See Input Voltage Table, tolerance ±5 %
50 mA Max.
-55
C to +125
C
-55
C to +125
C
1 pS RMS max
Standby
100 nS Max. N.C. or
≥
70% Vcc = Enable.
≤
30% Vcc = Disable
20 µA
1.20
1.20
4
1
3
2
1.20
2.54
2.20
Aging (Initial First
Year)
Start-up Time
Supply Voltage
Current
Operating
Storage
Phase Jitter:
(12kHz – 20MHz)
Tri-State (Pin 1)
Function
Enable / Disable Time
Current, Standby Mode
1.40
Recommended
Land Pattern
Pin Connection
Enable / Disable
Pin 1
or NC
Pin 2
Ground
Output
Pin 3
Pin 4
Vcc
Part Number Guide
Input
Package
Voltage
1 = 1 .8 V
2 = 2.7 V
3 = 3.3 V
6 = 2.5 V
7 = 3.0 V
Sample Part Number:
Operating
Temperature
7
= -55ºc to +125ºc
Symmetry
(Duty Cycle)
5 = 45 / 55 max
6 = 40 / 60 max
Output
3 = 15pF
6 = 30pF *
ISM82-3756BH-20.000
Stability (in
Enable /
Frequency
ppm)
Disable
B = ±50 ppm
C= ±100 ppm
H = Enable
O = N/C
20.000
ISM82
*Oscillator
may not meet 5% symmetry over temperature range with 30 pF load.
NOTE:
A 0.01 µF bypass capacitor is recommended between Vcc (pin 4) and GND (pin 2) to minimize power supply noise.
ILSI America Phone 775-851-8880
●
Fax 775-851-8882
●email:
e-mail@ilsiamerica.com
●
www.ilsiamerica.com
Specifications subject to change without notice
Rev: 10/20/14_A3
Page 1 of 2
3.2 mm x 5.0 mm Ceramic Package SMD Oscillator
Pb Free Solder Reflow Profile:
Typical Application:
ISM82 Series
*Units are backward compatible with 240º C reflow processes
Package Information:
MSL = N.A. (Package does not contain plastic; storage life is unlimited under normal room conditions.)
Termination = e4 (Au over Ni over W base metallization).
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
1000
16 +/-.3
8 +/-.2
7.5 +/-.2
17.5 +/-1
50 / 60 / 80
180 / 250
Environmental Specifications:
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking:
Line 1: ILSI and Date Code (YWW)
Line 2: Frequency
Proprietary and Confidential
This document contains proprietary information, and such information may not be disclosed to others for any purpose nor used for
manufacturing purpose without the written permission o ILSI America.
Rev: 10/20/14_A3
Page 2 of 2
ILSI America Phone 775-851-8880
●
Fax 775-851-8882
●email:
e-mail@ilsiamerica.com
●
www.ilsiamerica.com
Specifications subject to change without notice
Microcontroller MCU
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