C512Z272F2G5CA7301 datasheet, PDF

Datasheet> All Categories > Passive components> capacitor> C512Z272F2G5CA7301

C512Z272F2G5CA7301: DescriptionCeramic Capacitor, Ceramic, 200V, 1% +Tol, 1% -Tol, BP, -/+30ppm/Cel TC, 0.0027uF, 4814,; CategoryPassive components capacitor; File Size3MB，24 Pages; ManufacturerKEMET; Websitehttp://www.kemet.com

Download Datasheet Parametric View All

C512Z272F2G5CA7301 Overview

Ceramic Capacitor, Ceramic, 200V, 1% +Tol, 1% -Tol, BP, -/+30ppm/Cel TC, 0.0027uF, 4814,

C512Z272F2G5CA7301 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Objectid	941774947
package instruction	, 4814
Reach Compliance Code	not_compliant
ECCN code	EAR99
YTEOL	6
capacitance	0.0027 µF
Capacitor type	CERAMIC CAPACITOR
dielectric materials	CERAMIC
high	12.19 mm
JESD-609 code	e0
length	12.19 mm
negative tolerance	1%
Number of terminals	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package form	Radial
method of packing	TR
positive tolerance	1%
Rated (DC) voltage (URdc)	200 V
Guideline	MIL-PRF-123
series	C512Z(BP,200)
size code	4814
Temperature characteristic code	BP
Temperature Coefficient	30ppm/Cel ppm/°C
Terminal surface	Tin/Lead (Sn60Pb40)
Terminal pitch	10.16 mm
width	3.56 mm

C512Z272F2G5CA7301 Preview

CERAMIC HIGH RELIABILITY CAPACITORS

CERAMIC HIGH RELIABILITY PRODUCTS

Ceramic Chips, Radial Molded

KEMET Electronics Corporation has been known for

many years as the leader in the ceramic high relia-

bility products. KEMET produces high reliability

monolithic ceramic capacitors under tightly-con-

trolled manufacturing procedures. These capacitors

achieve “State of the Art” performance by virtue of

careful materials selection, conservative design

rules, motivational training of employees, and

scrupulous inspection of all processes as well as the

finished product. KEMET not only manufactures its

own high reliability ceramic capacitor (GR900),

KEMET also manufactures MIL-PRF-123 product

which is built to the highest military standard in the

industry today.

BASIC REQUIREMENTS FOR KEMET’S

HIGH RELIABILITY

PRODUCTS ARE AS FOLLOWS:

1. Selected Raw Materials:

All raw materials are

selected for characteristics known to produce the

finest quality capacitors exhibiting the best electrical

parameters and physical integrity. Materials trace-

ability is maintained throughout the manufacturing

process.

2. Batch Homogeneity:

Production is under batch

control. Each batch is homogeneous with respect to

materials, design and processing conditions.

3. Clean Room Processing:

All processes sensitive

to particulate contamination take place in a clean

room environment.

4. Special Designs:

Special design considerations

such as dielectric thickness are strictly enforced.

Only C0G (BP) and X7R (BX) temperature charac-

teristics are made.

5. Destructive Physical Analysis (DPA, or

Cross-Sectioning):

All batches are sampled using

EIA-469 as a minimum requirement. The samples

remain on file and DPA Reports are shipped with the

capacitors.

6. C-SAM (C-Mode Surface Acoustical

Microscopy):

Optional 100% screening may be per-

formed using ultrasonic energy to detect voids or

delaminations. Screened lots must pass a final sample

DPA.

7. Batch Performance Monitoring:

All production

batches are tested to generate electrical characteris-

tics. Batches which show anomalous characteristics

are rejected.

8. Special Customer Requirements:

Many special

requirements such as serialization, DPA samples,

X-Ray plates, and special packaging can be accom-

modated.

9. Document Applicable:

The high reliability prod-

uct is implemented through various internal docu-

ments under revision control. The Manufacturing

Instructions provide detailed descriptions of all oper-

ations and delineate requirements for process con-

trol and product performance at various points in the

process flow. Inspector Operating Documents

describe test procedures and sampling plans for

inspection of raw materials, in-process material and

finished product. Raw material specifications

describe physical and chemical characteristics as

well as the packaging and labeling needed to pre-

serve characteristics and identity. Customer specifi-

cations are internal documents applicable only to

products manufactured and inspected to require-

ments of individual customers; in effect, these docu-

ments translate customer drawings into modifica-

tions of the specified portions of KEMET standard

procedures.

The Quality System in total is controlled by the

KEMET Quality Manual and by various Quality

Operating Documents. All documents, and revisions

thereto, bear specified approval signatures.

DETAILED SPECIFICATION:

Temperature Characteristics

Electrical stability with respect to temperature and

voltage is related inversely to the packaging effi-

ciency (capacitance X voltage in a given case size).

C0G (BP) is made from ceramic materials which are

not ferroelectric, yielding superior stability but low

packaging efficiency. X7R (BX) is made from materi-

als which are ferroelectric, such as barium titanate,

yielding a stable and high packaging efficiency.

Aging

If the temperature of a barium titanate dielectric is

lowered after an excursion above its curie point, the

ceramic crystalline structure gradually reverts to the

tetragonal form typical of the low temperature condi-

tions. The reversion requires a considerable length

of time, and its effect in practical capacitors has

become known as “Aging”. The rate of aging is

affected by both the temperature and the applied

voltage experienced by the capacitor. The COG (BP)

formulation is non-ferroelectric and does not exhibit

CERAMIC HIGH RELIABILITY CAPACITORS

aging. The X7R (BX) formulation exhibits its own

characteristic aging rate which describes a decrease

in capacitance versus time. The capacitance of the

X7R dielectric decreases approximately 1.0% dur-

ing each decade of hours following a return to tem-

peratures below the curie point. In other words,

capacitance will decrease 1.0% between 1 and 10

hours, another 1.0% between 10 and 100 hours,

another 1.0% between 100 and 1000 hours, etc.

KEMET takes into consideration the aging rate by

designing capacitors to fall within the specified

capacitance tolerance at 1000 hours. Inasmuch as

the aging rate is exponential, very little change in

capacitance will take place after 1000 hours.

Voltage Effects

Ferroelectric materials are also affected by applied

voltage, both alternating and direct. Low values of

voltage produce a slight increase in capacitance and

dissipation factor. Higher voltages cause a decrease

in capacitance. Typically, capacitors with X7R char-

acteristic decrease in capacitance by approximately

10% when rated DC voltage is applied.

A small portion of the decrease in capacitance by

the application of a high DC voltage persists after the

voltage is removed and then disappears gradually.

Customer Testing

Because of temperature and voltage effects, caution

must be used in establishing a testing sequence for

ceramic capacitors. Insulation resistance measure-

ments and tests of dielectric withstanding voltage

both require application of high DC voltage and

cause temporary changes in capacitance. These

tests, therefore, should not be conducted until

capacitance testing is completed. Alternatively, the

capacitors can be “de-aged” at high temperature as

described above. A stabilization time at room ambi-

ent of 24 hours should be used after de-aging.

See F-3101 Catalog for more details.

PERFORMANCE CHARACTERISTICS

General Information

Working Voltage:

C0G (BP)

- 50,100 & 200 volts

X7R (BX)

- 50,100 & 200 volts

Temperature Characteristics:

C0G (BP):

0 ±30 ppm/°C from -55°C to +125°C.

(Limits widen below 20 pF.)

X7R (BX):

±15%; from -55°C to +125°C.

Capacitance Tolerance:

C0G (BP):

C - ±0.25pF; D - ±0.5pF; F - ±1%;

G- ±2%; J- ±5%; K- ±10%; M- ±20%.

X7R (BX):

J - ±5%; K - ±10%; M - ±20%.

Electrical

Capacitance:

Within specified tolerance when

measured with 1 volt RMS @ 1 kHz (1000pF or less

@ 1 MHz for C0G (BP)).

Dissipation Factor:

25°C @ 1 kHz (1000 pF or less at 1 MHz for

C0G (BP)).

C0G (BP):

0.15% maximum

X7R (BX):

2.5% maximum

Insulation Resistance:

After 2 minutes electrification:

at 25°C and rated voltage:

C0G (BP):

l00 GΩ or (1000 megohm

X µF), whichever is less.

X7R (BX):

l00 GΩ or (1000 megohm

X µF), whichever is less.

at 125°C and rated voltage:

C0G (BP):

l0 GΩ or (100 megohm

X µF), whichever is less.

X7R (BX):

l0 GΩ or (100 megohm

X µF), whichever is less.

Dielectric Withstanding Voltage:

250% of

rated voltage for 5 seconds with current limited to

50 MA at 25°C.

Aging Rate:

% Delta Cap/Decade Hour, Typical

C0G (BP):

X7R (BX):

1.0%

IMPORTANT NOTICE

KEMET Electronics Corporation disclaims all warranties, whether express, implied, or statutory as to any manner whatso-

ever, including the condition of the equipment, its compatibility with specific requirements, its merchantability, or fitness for any

particular purpose which extend beyond the description on the face hereof.

Furthermore, under no circumstances shall KEMET Electronics Corporation be liable for consequential, special, incidental

or indirect damages resulting from the use or handling of this product.

Finally, KEMET Electronics Corporation does not assume any responsibility for the correctness of the information contained

in this catalog. All design characteristics, specifications, tolerances, and the like are subject to change without notice.

CERAMIC HIGH RELIABILITY CAPACITORS

MIL-PRF-123/GR900

TYPICAL PERFORMANCE CURVES

CERAMIC HIGH RELIABILITY MOLDED & CHIPS

GENERAL INFORMATION MIL-PRF-123

INTRODUCTION

MIL-PRF-123 specification covers the general requirements for high

reliability, general purpose (BX) and temperature stable (BP) ceramic

dielectric fixed capacitors for space, missile, and other high reliability

applications. Capacitors covered by MIL-PRF-123 may be used in

critical frequency determining applications, timing circuits, and other

applications where absolute stability is required (BP) and in applica-

tions where appreciable variations in capacitance with respect to

temperature, voltage, frequency, and life can be tolerated (BX).

10.

Radiographic Inspection

(leaded devices only) (100% of lot).

11.

Visual Inspection

per MIL-PRF-123 criteria.

12.

Destructive Physical Analysis

per EIA-469 and MIL-PRF-123.

SAMPLE TESTS

The following Group B tests shall be performed on samples from

each lot, which have been subjected to and have passed Group A

inspection.

Thermal Shock—Performed

in accordance to MIL-STD-202,

Method 107, Condition A, with step 3 being 125°C. Number of

cycles shall be 100.

Life Test per MIL-5TD-202, Method 108.

Test temperature and

tolerance is +125°C +4, -0°C. Capacitors shall be subjected to

2X rated voltage for 1000 hours.

Humidity, steady state, low voltage per MIL-STD-202,

Method 103, Condition A.

Capacitors shall be subjected to an

environment of 85°C with 85% relative humidity for 240 hours

minimum. Cycling shall not be performed. A dc potential of 1.3

±0.25 volts shall be applied continuously through a 100,000

ohm resistance to each device under test. At completion, 25°C

IR and Cap are read.

Voltage-temperature limits—Capacitance

is measured at var-

ious temperatures (-55°C to +125°C) with and without rated

voltage.

Moisture Resistance per MIL-STD-202, Method 106.

There

shall be 20 continuous cycles. During the first 10 cycles only, a

dc potential of 50 volts shall be applied across the capacitor ter-

minals. Once each day, a check shall be performed to deter-

mine whether a capacitor has shorted. Vibration cycle of MIL-

STD-202, Method 106, Step 7b shall not be performed. Upon

completion of MIL-STD-202, Method 106, Step 6 of the final

cycle, capacitors shall be measured for capacitance, dielectric

withstanding voltage and insulation resistance.

The following Group C tests shall be performed on samples selected

from lots that have passed Group A and have been submitted for

Group B inspection. Samples shall be selected every two months.

1. Terminal Strength

2. Solderability

3. Resistance to Soldering Heat

4. Solvent Resistance (Leaded devices only)

All lots shipped must have been subjected to and passed Group A

and B testing.

SCREENING TESTS

Each lot has the following In-Process Inspections performed:

1. 100% C-SAM (C-Mode Surface Acoustical Microscopy)

2. In-Process Destructive Physical Analysis

3. 100% visual inspection at a minimum of 10X magnification

4. Pre-encapsulation terminal strength evaluation (leaded devices

only). Radial leaded capacitors must meet a minimum lead pull

of 1.8 kg (4.0 lbs.).

The following Group A shall be performed on each lot:

Thermal Shock—Performed

in accordance to MIL-STD-202,

Method 107, Condition A, with step 3 being 125°C. Number of

cycles shall be 20 (100% of lot).

Voltage Conditioning—The

voltage conditioning shall consist

of applying twice the rated voltage to the units at the maximum

rated temperature of 125°C for a minimum of 168 hours and a

maximum of 264 hours. The voltage conditioning may be termi-

nated at any time during 168 hours to 264 hours time interval

that confirmed failures meet the requirements for the PDA dur-

ing the last 48 hours listed in Table I below (100% of lot).

Optional Voltage Conditioning (Accelerated Voltage

Conditioning)—AII

conditions of the standard voltage condi-

tioning apply with the exception of the increased voltage and the

decreased test time. (Refer to Mil-PRF-123 for formula.)

*Step 5

is performed on chips at this point (100% of lot).

Dielectric Withstanding Voltage

250% of the dc rated voltage

at 25°C (100% of lot).

Insulation Resistance—The

25°C measurement with rated

voltage applied shall be the lesser of 100 GΩ or 1000 megohm-

microfarads (100% of lot).

*5.Insulation

Resistance—The

125°C measurement with rated

voltage applied shall be the lesser of 10 GΩ or 100 megohm-

microfarads (1000% of lot). For chips 125°C IR is performed

prior to step 3 above.

Storage

at 150°C for 2 hours minimum without voltage applied

followed by a 12-hour minimum stabilization period (tempera-

ture characteristic BX only).

Capacitance

must be within specified tolerance at 25°C (100%

of lot).

Cap Exclusion:

Capacitance values no more than 5% or

.5 pF, whichever is greater, for BX characteristics or 1% or .3 pF,

whichever is greater, for BP characteristics beyond specified tol-

erance limit shall be removed from the lot but shall not be con-

sidered defective for determination of the PDA.

Dissipation Factor

shall not exceed 2.5% for X dielectric,

0.15% for G dielectric at 25°C (100% of lot).

Percent Defective Allowable (PDA).

The following table lists

the PDA requirements for MIL-PRF-123 Group A:

TABLE I

BURN IN PDA

LAST 48 HOURS

1 unit or 0.1%

1 unit or 0.2%

1 unit or 0.1%

STANDARD PACKAGING FOR

MIL-PRF-123 IS AS FOLLOWS:

C052Z

C062Z

C512Z

tray

1 pc. per bag

C0805Z

C1206Z

C1210Z

C1808Z

C1812Z

C1825Z

C2225Z

chip

tray

DATA PACKAGE

A data package is sent with each shipment which contains:

1. Summary of Group A testing

2. Summary of Group B testing

3. Group B Variables Test Data

4. Lead Pull Data (Leaded Devices Only)

5. Final Destructive Physical Analysis Report

6. Certificate of Compliance stating that the ceramic capacitors

supplied meet all the requirements of MIL-PRF-123, the applic-

able slash sheet(s) and all associated documents.

KEMET

STYLE

C052Z

C062Z

C512Z

C0805Z

C1210Z

C1808Z

C2225Z

C1206Z

C1812Z

C1825Z

MIL

STYLE

CKS05

CKS06

CKS07

CKS51

CKS52

CKS53

CKS54

CKS55

CKS56

CKS57

PDA

OVERALL

More (Only the first 5 pages are displayed. Please Download Datasheet to view the full content.) >

Recommended Resources

Practical regulated power supply circuit diagram

Combination of source ground and emitter follower

Diamond brand KYT-25 turning fan circuit diagram

Traffic light alternating flash circuit

555 bistable mode and typical application circuit

Three-button interlock electronic switch

Urgent! Urgent! Pyroelectric sensor + microwave sensor signal processing: I am doing a graduation project on anti-theft alarm. In the alarm information collection module, I want to use a combination of pyroelectric sensors and microwave sensors (dual detectors) to reduce th...; 杨闯 Sensor

IP help document cannot be opened: When you want to view the help document about this IP, click DocumentationAt this time, the browser goes to the local to find the help document, but it prompts "Network cannot be accessed"Go to the lo...; yin4319 FPGA/CPLD

Nokia N92 (DVB-H mobile phone).pdf: Nokia N92 (DVB-H mobile phone).pdf...; wanilyccc PCB Design

Very simple second-order low-pass passive filtering: The cut-off frequency is 50Hz. Does it mean to use the formula of 1/2pi*RC? I feel that the calculation is wrong. Do I need to consider the gain, amplitude-frequency and phase-frequency?...; 西里古1992 Analog electronics

KW41 Development Kit - Electronic Label DIY Process #2 Try both software and hardware: 1. During this process, I have been transplanting the LCD1602 library, but the software has used many solutions but none of them worked. Finally, I found the reason. The PTC4 pin is reused. On the FRD...; fyaocn NXP MCU

(The problem has been solved) Ask Vivi's load flash Vivi x problem: I found a clean vivi, transplanted it, put jtag on the development board, and then connected it with dnw.exe. After entering the vivishell, I used bon part 0 192k 1216k partition. After completion, I ...; tigerlikes Embedded System

Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

Popular Components