EEWORLDEEWORLDEEWORLD

Part Number

Search

10113947-W0C-30B

Description
high speed / modular connectors xcede 6pr 4col LT pol guide W/ key
CategoryThe connector   
File Size1MB,4 Pages
ManufacturerFCI [First Components International]
Download Datasheet Parametric View All

10113947-W0C-30B Overview

high speed / modular connectors xcede 6pr 4col LT pol guide W/ key

10113947-W0C-30B Parametric

Parameter NameAttribute value
ManufactureFCI
Product CategoryHigh Speed / Modular Connectors
RoHSN
Factory Pack Quantity480
BAcKpAneL connectors
XCede
®
HigH-PerformanCe
BaCkPlane ConneCtor SyStem
Description
Fci’s Xcede
®
connector platform is designed for 25 Gb/s
performance to provide the headroom to support future
high-speed, serial data rate requirements demanded by
next-generation equipment in data centers and service
provider networks. the use of engineering polymers in a
resonance-damping shield enables very low crosstalk
across a wide frequency range.
Xcede connectors also address requirements for higher
linear signal density at the interface of backplane and
daughter card. signal connectors can be configured with
2, 4 or 6 differential pairs per column, providing up to 82.4
differential pairs/inch, suiting architectures with multiple
front or rear fabric slots and blade systems with cooling
straight through the backplane. complementary guidance
and power modules are also included in the product
range. A wafer organizer can be used to combine groups
of right-angle signal, guidance and power modules as an
integrated daughter-card connector.
the Xcede backplane header system provides the
ruggedness and long-term reliability required by today’s
systems. the wide ground contacts feature a stiffness-
enhancing rib and are advanced well ahead of the signals
for exceptional robustness and signal pin protection.
FeAtures & BeneFits
High-speed backplane system designed for 25 Gb/s
Use of engineering materials in the shield aids in
reduction of crosstalk resonances
1.85 mm column pitch offers high linear signal density
• Configurations with 6 differential pairs/column fit 36 mm
card slot pitch and provide 82.4 pairs/inch
• 4 pairs/column fit 25 mm slot pitch with 54.9 pairs/inch
• 2 pairs/column fit 15 mm slot pitch with 27.5 pairs/inch
Two ground vias between differential pairs allow elongated
antipads to further improve impedance
Optional short compliant pin permits deeper backdrilling and
dual diameter vias to enhance return loss performance
Wide ground contacts feature a stiffening rib and are
advanced well ahead of signals for exceptional robustness
and signal pin protection
Intermateable, electrically and mechanically interchangeable
licensed second source to Amphenol TCS
Xcede® is a registered trademark of Amphenol corporation
tArGet MArKets / AppLicAtions
Communications
Routers
Switches
Networking
Access
Transport
Wireless
Data
Servers
Storage Systems
Industrial
Medical
Test & Measurement
I applied for samples on TI's official website, but I didn't expect to receive two waste pieces.
I have been busy with my graduation project recently. I applied for samples from Ti's official website. But Ti actually put the chip in foam when shipping. So the first chip turned out like thisA row ...
GaryTavish TI Technology Forum
The one I posted before was LDC1000, 1314 is here
{:1_144:}...
竹汐墨熙 Electronics Design Contest
The reform of the Chipcoin is in the works, Xin Xin is playing random music on the sidelines (checked)
[i=s] This post was last edited by Xin Xin on 2018-5-3 16:37 [/i] [b][color=#ff0000]Too many opinions~[/color][/b] I have been chatting with Linzi on QQ recently. I heard that she is worried about the...
辛昕 Suggestions & Announcements
Development Trend and Prospect of Microelectronics Technology in the 21st Century
Development trends and prospects of microelectronics technology in the 21st century....
linda_xia Analog electronics
Wireless USB Technology Overview
USB is convenient and practical, and has become one of the essential equipment for people who use computers nowadays. Its biggest advantage is its mobility, which allows for convenient storage and car...
xtss RF/Wirelessly
Application Tips/Low Power Design in 80C51 Portable Products
Abstract : Through the design practice of a PDA product using a button battery, this paper introduces the low-power design theory and principles of the 80C51 series of microcontrollers and the low-pow...
rain 51mcu

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1375  2663  1389  1369  707  28  54  15  30  8 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号