Flash, 32MX16, 14.5ns, PBGA63
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Objectid | 1125520491 |
| package instruction | FBGA, BGA63,10X12,32 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| YTEOL | 2 |
| Maximum access time | 14.5 ns |
| command user interface | YES |
| Data polling | NO |
| JESD-30 code | R-PBGA-B63 |
| memory density | 536870912 bit |
| Memory IC Type | FLASH |
| memory width | 16 |
| Humidity sensitivity level | 3 |
| Number of departments/size | 512 |
| Number of terminals | 63 |
| word count | 33554432 words |
| character code | 32000000 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 32MX16 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | FBGA |
| Encapsulate equivalent code | BGA63,10X12,32 |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY, FINE PITCH |
| page size | 1K words |
| Parallel/Serial | PARALLEL |
| power supply | 2.65 V |
| Certification status | Not Qualified |
| ready/busy | YES |
| Department size | 64K |
| Maximum standby current | 0.00005 A |
| Maximum slew rate | 0.03 mA |
| Nominal supply voltage (Vsup) | 2.65 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | BALL |
| Terminal pitch | 0.8 mm |
| Terminal location | BOTTOM |
| switch bit | NO |
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