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TBP38SA03X-30MFK

Description
IC,PROM,32X8,TTL,LLCC,20PIN,CERAMIC
Categorystorage    storage   
File Size41KB,1 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Stay tuned Parametric

TBP38SA03X-30MFK Overview

IC,PROM,32X8,TTL,LLCC,20PIN,CERAMIC

TBP38SA03X-30MFK Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Objectid1164068157
package instructionQCCN, LCC20,.35SQ
Reach Compliance Codenot_compliant
ECCN codeEAR99
Maximum access time30 ns
JESD-30 codeS-XQCC-N20
Memory IC TypeOTP ROM
memory width8
Number of terminals20
word count32 words
character code32
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize32X8
Package body materialCERAMIC
encapsulated codeQCCN
Encapsulate equivalent codeLCC20,.35SQ
Package shapeSQUARE
Package formCHIP CARRIER
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum slew rate0.125 mA
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyTTL
Temperature levelMILITARY
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED

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