EEWORLDEEWORLDEEWORLD

Part Number

Search

M55342K12U649DR-W

Description
Fixed Resistor, Metal Glaze/thick Film, 0.1W, 649ohm, 50V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0603, CHIP
CategoryPassive components    The resistor   
File Size150KB,1 Pages
ManufacturerState of the Art Inc.
Download Datasheet Parametric View All

M55342K12U649DR-W Overview

Fixed Resistor, Metal Glaze/thick Film, 0.1W, 649ohm, 50V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0603, CHIP

M55342K12U649DR-W Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Objectid1916012679
package instructionCHIP
Reach Compliance Codenot_compliant
Country Of OriginUSA
ECCN codeEAR99
YTEOL7.35
structureChip
JESD-609 codee4
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-65 °C
Package height0.46 mm
Package length1.58 mm
Package shapeRECTANGULAR PACKAGE
Package formSMT
Package width0.81 mm
method of packingWAFFLE PACK
Rated power dissipation(P)0.1 W
Rated temperature70 °C
GuidelineMIL-PRF-55342
resistance649 Ω
Resistor typeFIXED RESISTOR
size code0603
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient100 ppm/°C
Terminal surfacePlatinum/Gold (Pt/Au)
Terminal shapeWRAPAROUND
Tolerance1%
Operating Voltage50 V
State of the Art, Inc.
Thick Film Chip Resistor
M55342/12 RM0603
GLASS
PASSIVATION
WRAPAROUND
TERMINATIONS
RESISTOR
FILM
96% ALUMINA CHIP
PERFORMANCE
TEMPERATURE RISE (°C)
Resistance Range
Tolerances
Maximum Power
Maximum Voltage
1
W
- 22M
W
1%, 2%, 5%, 10%
100 mW
50 Volts
CHARACTERISTICS*
M
K
±100
±0.5%
±0.25%
±0.25%
±0.25%
±0.5%
±0.5%
±0.5%
±300
±0.5%
±0.5%
±0.5%
±0.25%
±0.5%
±2.0%
±1.0%
POWER DISSIPATION
fiber epoxy board
ceramic board
TESTS
TCR (-55 to +125
°
C) in ppm/
°
C
Thermal Shock
Low Temperature Operation
Short-time Overload
Resistance to Soldering Heat
Moisture Resistance
Life, 2,000 Hours
High Temperature Exposure
POWER DISSIPATION (WATTS)
LIFE TEST
POWER DERATING
*Maximum allowable change per MIL-PRF-55342,
typical change is 10% of these values.
PART NUMBERING
M55342 K 12 B 100D S - TR
PACKAGING CODE: TR = Tape & Reel W= Waffle Pack
PRODUCT LEVEL DESIGNATOR: M: 1% per 1000 hrs. R: 0.01% P: 0.1% S: 0.001% T: Space Level C: Non - ER
RESISTANCE AND TOLERANCE CODE:
Three significant digits, with a letter indicating the
decimal location, the tolerance, and the value range.
D: 1%
W
E: 1% K
W
F: 1% M
W
G: 2%
W
H: 2% K
W
T: 2% M
W
J: 5%
W
K: 5% K
W
L: 5% M
W
M: 10%
W
N: 10% K
W
P: 10% M
W
TERMINATION MATERIALS:
B: Solderable wraparound C: Epoxy bondable palladium/silver wraparound U: Epoxy bondable platinum/gold wraparound
W: Gold wire bondable
G: Gold wraparound
SIZE CODE: /12 = RM0603
TEMPERATURE CHARACTERISTIC: K: ± 100ppm M: ± 300ppm
PERFORMANCE SPECIFICATION MIL-PRF-55342
MECHANICAL
INCHES
MILLIMETERS
.092
MINIMUM
RECOMMENDED
MOUNTING
PADS
(INCHES)
Length
Width
Thickness
Top Term
Bottom Term
Gap
Approx. Weight
.062 (.058 - .070)
.032 (.027 - .037)
.018 (.010 - .033)
.010 (.007 - .017)
.014 (.010 - .020)
.034 (.030 - .038)
.00235 grams
1.58
0.81
0.46
0.25
0.36
0.86
(1.47 - 1.78)
(0.69 - 0.94)
(0.25 - 0.84)
(0.18 - 0.43)
(0.25 - 0.51)
(0.76 - 0.97)
.034
.030
.031
State of the Art, Inc.
2470 Fox Hill Road, State College, PA 16803-1797
Phone (814) 355-8004 Fax (814) 355-2714 Toll Free 1-800-458-3401
“Specifications subject to change without notice.”
www.resistor.com
04/09/08
[Anxinke UWB indoor positioning module NodeMCU-BU01] 05. Transplantation preparation: ranging function code analysis
In the previous post, we analyzed the factory's initialization configuration process for NodeMCU-BU01 by reading the code, and located the specific implementation of AT command parsing and running and...
xld0932 RF/Wirelessly
What does a 5G base station look like? What is the difference between it and a 4G base station?
1. What is a base station? What does a base station consist of?The radio access network, also known as RAN (Radio Access Network). Simply put, it is the network that connects all mobile terminals to t...
dancerzj RF/Wirelessly
A low-power, wireless sensor network design
The explosive development of wireless technology has spawned a variety of industrial, scientific and medical (ISM) band wireless standards. Thanks to these new standards, various wireless applications...
Jacktang Wireless Connectivity
[Introduction to M4 Development Board] EKK-LM4F232 explores the hibernate function of M4
Hibernation moduleThe Hibernation module provides a means of reducing power consumption by managing the removal and restoration of power. When the processor and peripherals are idle, power can be comp...
蓝雨夜 Microcontroller MCU
OEM batteries encounter "intellectual property gate"
[b]Special topic motivation[/b] Some scholars believe that Guangdong is facing many major problems that need to be solved in the process of modern industrial upgrading, among which the most prominent ...
songrisi Power technology
Does anyone know the principle of microcontroller reset (I mean inside the microcontroller)?
I was bored, so I thought about this question! I am not referring to the common RC reset and pulse reset. I want to know the internal situation of the microcontroller. After receiving the reset pulse,...
通宵敲代码 MCU

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2025  1587  836  1359  1314  41  32  17  28  27 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号