EEWORLDEEWORLDEEWORLD

Part Number

Search

C0805C104J8UAC

Description
CAPACITOR, CERAMIC, MULTILAYER, 50 V, X7R, 0.01 uF, SURFACE MOUNT, 0603
CategoryPassive components   
File Size28KB,2 Pages
ManufacturerKEMET
Websitehttp://www.kemet.com
Download Datasheet Parametric View All

C0805C104J8UAC Overview

CAPACITOR, CERAMIC, MULTILAYER, 50 V, X7R, 0.01 uF, SURFACE MOUNT, 0603

C0805C104J8UAC Parametric

Parameter NameAttribute value
Maximum operating temperature125 Cel
Minimum operating temperature-55 Cel
negative deviation5 %
positive deviation5 %
Rated DC voltage urdc50 V
Processing package descriptionCHIP, ROHS COMPLIANT
Lead-freeYes
EU RoHS regulationsYes
stateACTIVE
terminal coatingMATTE TIN OVER NICKEL
Installation featuresSURFACE MOUNT
Manufacturer SeriesC0603
size code0603
capacitance0.0100 uF
packaging shapeRECTANGULAR PACKAGE
Capacitor typeCERAMIC
Terminal shapeWRAPAROUND
Temperature Coefficient15%
Temperature characteristic codeX7R
multi-layerYes
KEMET
®
CERAMIC CHIP/STANDARD
FEATURES
• C0G (NP0), X7R, Z5U and Y5V Dielectrics
• 10, 16, 25, 50, 100 and 200 Volts
• Standard End Metalization: Tin-plate over nickel
barrier
• Available Capacitance Tolerances: ±0.10 pF; ±0.25
pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and
+80%-20%
• Tape and reel packaging per EIA481-1. (See page
51 for specific tape and reel information.) Bulk
Cassette packaging (0402, 0603, 0805 only) per
IEC60286-6 and EIAJ 7201.
CAPACITOR OUTLINE DRAWINGS
W
T
S
ELECTRODES
L
B
TIN PLATE
NICKEL PLATE
CONDUCTIVE
METALLIZATION
DIMENSIONS—MILLIMETERS AND (INCHES)
EIA
SIZE CODE
0402*
0603*
0805*
1206*
1210*
1812
1825*
2220
2225
METRIC
SIZE CODE
(Ref only)
1005
1608
2012
3216
3225
4532
4564
5650
5664
L#
LENGTH
1.0 (.04) ± .05(.002)
1.6 (.063) ± 0.15 (.006)
2.0 (.079) ± 0.2 (.008)
3.2 (.126) ± 0.2 (.008)
3.2 (.126) ± 0.2 (.008)
4.5 (.177) ± 0.3 (.012)
4.5 (.177) ± 0.3 (.012)
5.6 (.220) ± 0.4 (.016)
5.6 (.220) ± 0.4 (.016)
W#
WIDTH
0.5 (.02) ± .05 (.002)
0.8 (.032) ± 0.15 (.006)
1.25 (.049) ± 0.2 (.008)
1.6 (.063) ± 0.2 (.008)
2.5 (.098) ± 0.2 (.008)
3.2 (.126) ± 0.3 (.012)
6.4 (.252) ± 0.4 (.016)
5.0 (.197) ± 0.4 (.016)
6.3 (.248) ± 0.4 (.016)
T (EIA) #
THICKNESS MAX.
0.55 (.022)
0.9 (.035)
1.3 (.051)
1.5 (.059)
1.7 (.067)
1.7 (.067)
1.7 (.067)
1.8 (.071)
2.0 (.079)
B
BANDWIDTH
0.20 (0.008)-0.40 (0.016)
0.35 (.014) ±0.15 (.006)
0.5 (.02) ±.25 (.010)
0.5 (.02) ±.25 (.010)
0.5 (.02) ±.25 (.010)
0.6 (.024) ±.35 (.014)
0.6 (.024) ±.35 (.014)
0.6 (.024) ±.35 (.014)
0.6 (.024) ±.35 (.014)
S
MIN. SEPARATION
0.3 (.012)
0.7 (.028)
0.75 (.030)
N/A
N/A
N/A
N/A
N/A
N/A
MOUNTING
TECHNIQUE
Solder Reflow
Solder Wave
or
Solder Reflow
Solder
Reflow
* Note: Indicates EIA Preferred Case Sizes
# Note: Different tolerances apply for 0402, 0603, and 0805 packaged in bulk cassette.
CAPACITOR ORDERING INFORMATION
(Standard Chips - For
C 0805 C 103 K 5 R A C*
CERAMIC
SIZE CODE
SPECIFICATION
C - Standard
CAPACITANCE CODE
Expressed in Picofarads (pF)
First two digits represent significant figures.
Third digit specifies number of zeros. (Use 9
for 1.0 thru 9.9pF. Use 8 for 0.5 through 0.99pF)
(Example: 2.2pF = 229 or 0.50 pF = 508)
CAPACITANCE TOLERANCE
B – ±0.10pF J – ±5%
C – ±0.25pF K – ±10%
M – ±20%
D – ±0.5pF
F – ±1%
P – (GMV)
G – ±2%
Z – +80%, -20%
* Part Number Example: C0805C103K5RAC
Military see page 45)
END METALLIZATION
C-Standard
(Tin-plated nickel barrier)
FAILURE RATE LEVEL
A- Not Applicable
TEMPERATURE CHARACTERISTIC
Designated by Capacitance
Change Over Temperature Range
G – C0G (NP0) (±30 PPM/°C)
R – X7R (±15%)
U – Z5U (+22%, -56%)
V – Y5V (+22%, -82%)
VOLTAGE
1 - 100V
3 - 25V
2 - 200V
4 - 16V
5 - 50V
8 - 10V
(14 digits - no spaces)
38
KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
Guess what this is?
[i=s]This post was last edited by jameswangsynnex on 2015-3-3 20:02[/i]In fact, this is a small cartoon cat camera. It is as clever as a cat, and its magnetic claws can be firmly attached to the iron ...
北极风 Mobile and portable
How to design a real-time clock using msp430f449, just code is enough
Thank you for your help, I'm very grateful...
李海海 Microcontroller MCU
Harbin Boiler's 600MW supercritical boiler manufacturing technology fills the domestic gap
Harbin, June 12 (Reporter: Qiu Huiling, reporter: Hao Cheng) The design scheme of the vertical tube ring 600 MW supercritical boiler independently developed by Harbin Boiler Plant Co., Ltd. has succes...
JasonYoo RF/Wirelessly
Live broadcast at 10:00 today: How to complete efficient and reliable USB PD power design in minutes - PI Expert step-by-step tutorial
The design of USB PD charger/power supply, due to its variable output characteristics, will face some challenges even for engineers with rich power supply design experience. In the online live broadca...
EEWORLD社区 Power technology
Domestic alternatives to stm8s003f3p6
The industry has not been very prosperous in the past two years, and everyone is trying to save money and cut costs. Coupled with the US ban on the sale of chips to Huawei, this thing we have always w...
辛昕 Domestic Chip Exchange
Asking for advice: PCI driver resource conflict problem
I used the wizard of driverstudio to build a driver framework for PCI9030, and did not make any changes to the code of this driver framework. However, this driver has some abnormal phenomena: most mot...
liurong82 Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 466  690  1620  2490  903  10  14  33  51  19 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号