This device is ideal for applications where a signal
needs to be switched between two different lines. The
small 8-lead package makes it an ideal space-saving
replacement for a 1-Form-C electromechanical relay
(EMR).
Featurges
•
3750V
rms
Input/Output Isolation
•
1-Form-C Solid State Relay
•
Low Drive Power Requirements
(TTL/CMOS Compatible)
•
High Reliability
•
Arc-Free With No Snubbing Circuits
•
FCC Compatible
•
VDE Compatible
•
No EMI/RFI Generation
•
Small 8-pin Packages
•
Machine Insertable, Wave Solderable
•
Surface Mount Tape & Reel Versions Available
Approvals
•
UL Recognized Component: File E76270
•
CSA Certified Component: Certificate 1175739
•
EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 004
Ordering Information
Part #
LCC110
LCC110P
LCC110PTR
LCC110S
LCC110STR
Description
8-Pin DIP (50/Tube)
8-Pin Flatpack (50/Tube)
8-Pin Flatpack Tape & Reel (1000/Reel)
8-Pin Surface Mount (50/Tube)
8-Pin Surfact Mount Tape & Reel (1000/Reel)
Applications
•
Telecommunications
•
Telecom Switching
•
Tip/Ring Circuits
•
Modem Switching (Laptop, Notebook,
Pocket Size)
•
Hook Switch
•
Dial Pulsing
•
Ground Start
•
Ringing Injection
•
Instrumentation
•
Multiplexers
•
Data Acquisition
•
Electronic Switching
•
I/O Subsystems
•
Meters (Watt-Hour, Water, Gas)
•
Medical Equipment—Patient/Equipment Isolation
•
Security
•
Aerospace
•
Industrial Controls
Pin Configuration
Do Not Use
+ Control
– Control
Do Not Use
AC/DC Configuration
1
8
2
3
4
7
6
5
Normally Open Pole
Normally Closed Pole
Switching Characteristics for a
1-Form-C Device
I
F
90%
Form-A I
LOAD
t
on
10%
t
off
90%
10%
t
off
t
on
Form-B I
LOAD
Pb
DS-LCC110-R06
e
3
www.ixysic.com
1
I
NTEGRATED
C
IRCUITS
D
IVISION
Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input control Current
Peak (10ms)
Input Power Dissipation
1
Total Power Dissipation
2
Isolation Voltage, Input to Output
Operating Temperature
Storage Temperature
1
2
LCC110
Min
-
-
-
-
-
-
3750
-40
-40
Max
350
5
50
1
150
800
-
+85
+125
Unit
V
P
V
mA
A
mW
mW
V
rms
ºC
ºC
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Derate linearly 1.33mW / ºC.
Derate linearly 6.67mW / ºC.
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Load Current
Continuous, AC/DC Configuration
Peak
On-Resistance, AC/DC Configuration
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Capacitance, Input to Output
Conditions
Symbol
Min
Typ
Max
Units
-
t=10ms
I
L
=120mA
V
L
=350V
P
I
L
I
LPK
R
ON
I
LEAK
t
on
t
off
C
OUT
I
F
I
F
V
F
I
R
C
I/O
-
-
-
-
-
-
-
-
0.4
0.9
-
-
-
-
23
-
-
-
25
-
0.7
1.2
-
3
120
±350
35
1
4
4
-
8
-
1.4
10
-
mA
rms
/ mA
DC
mA
P
µA
I
F
=8mA, V
L
=10V
V
L
=50V, f=1MHz
I
L
=120mA
-
I
F
=8mA
V
R
=5V
-
ms
pF
mA
mA
V
A
pF
Note: If both poles operate simultaneously, then load current must be derated in order not to exceed package power dissipation value.
2
www.ixysic.com
R06
I
NTEGRATED
C
IRCUITS
D
IVISION
COMMON PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Typical LED Forward Voltage Drop
(N=50)
30
Device Count (N)
25
20
15
10
5
0
1.17
1.19
1.21
1.23
1.25
LED Forward Voltage Drop (V)
LED Forward Voltage Drop (V)
35
1.8
1.6
1.4
1.2
1.0
0.8
-40
-20
0
20
40
60
80
100
120
Temperature (ºC)
I
F
=50mA
I
F
=30mA
I
F
=20mA
I
F
=10mA
I
F
=5mA
LCC110
Typical LED Forward Voltage Drop
vs. Temperature
0.020
0.018
0.016
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0
-40
Typical Leakage vs. Temperature
Measured across Pins 5&6 or 7&8
Leakage ( A)
-20
0
20
40
60
80
100
Temperature (ºC)
Energy Rating Curve
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
10 s 100 s 1ms 10ms 100ms
Time
Load Current (A)
1s
10s
100s
FORM-A RELAY PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Form-A
Typical Turn-On Time
(N=50, I
F
=8mA, I
L
=120mA
DC
)
Form-A
Typical Turn-Off Time
(N=50, I
F
=8mA, I
L
=120mA
DC
)
Form-A
Typical On-Resistance Distribution
(N=50, I
F
=8mA, I
L
=120mA
DC
)
25
20
15
10
5
0
1.2
25
20
15
10
5
0
35
30
Device Count (N)
25
20
15
10
5
0
Device Count (N)
2.0
2.8
3.6
4.4
5.2
Device Count (N)
0.05
0.14
0.23
0.32
0.41
0.50
19.5
20.5
21.5
22.5
23.5
24.5
25.5
Turn-On Time (ms)
Turn-Off Time (ms)
On-Resistance ( )
25
20
15
10
5
0
Form-A
Typical I
F
for Switch Operation
(N=50, I
L
=120mA
DC
)
25
20
15
10
5
0
Form-A
Typical I
F
for Switch Dropout
(N=50, I
L
=120mA
DC
)
Form-A
Typical Blocking Voltage Distribution
(N=50)
35
30
Device Count (N)
25
20
15
10
5
0
Device Count (N)
Device Count (N)
1.2
2.0
2.8
3.6
4.4
5.2
1.2
2.0
2.8
3.6
4.4
5.2
400
420
440
460
480
500
520
LED Current (mA)
LED Current (mA)
Blocking Voltage (V
P
)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
R06
www.ixysic.com
3
I
NTEGRATED
C
IRCUITS
D
IVISION
LCC110
FORM-A RELAY PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Form-A
Typical Turn-On Time
vs. LED Forward Current
(I
L
=120mA
DC
)
Form-A
Typical I
F
for Switch Operation
vs. Temperature
(I
L
=120mA
DC
)
Turn-On Time (ms)
1.0
0.9
Turn-On Time (ms)
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0
5
6
5
LED Current (mA)
4
3
2
1
0
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
I
F
=8mA
I
F
=10mA
I
F
=20mA
Form-A
Typical Turn-On Time
vs. Temperature
(I
L
=120mA
DC
)
10
15
20
25
30
35
40
45
50
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
LED Forward Current (mA)
Temperature (ºC)
Temperature (ºC)
0.25
Turn-Off Time (ms)
0.20
0.15
0.10
0.05
0
0
5
Form-A
Typical Turn-Off Time
vs. LED Forward Current
(I
L
=120mA
DC
)
6
LED Current (mA)
5
4
3
2
1
0
-40
Form-A
Typical I
F
for Switch Dropout
vs. Temperature
(I
L
=120mA
DC
)
Turn-Off Time (ms)
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
Form-A
Typical Turn-Off Time
vs. Temperature
(I
F
=5mA, I
L
=120mA
DC
)
10
15
20
25
30
35
40
45
50
-20
0
20
40
60
80
100
0
-40
-20
0
20
40
60
80
100
LED Forward Current (mA)
Temperature (ºC)
Temperature (ºC)
40
35
On-Resistance ( )
Form-A
Typical On-Resistance
vs. Temperature
(I
F
=8mA, I
L
=120mA
DC
)
Load Current (mA)
150
100
50
0
-50
-100
-150
Form-A
Typical Load Current vs. Load Voltage
(I
F
=8mA)
Form-A
Maximum Load Current
vs. Temperature
180
160
Load Current (mA)
140
120
100
80
60
40
30
25
20
15
10
5
0
-40
-20
0
20
40
60
80
100
I
F
=20mA
I
F
=10mA
I
F
=8mA
-40
-20
0
20
40
60
80
100
120
-3
-2
-1
0
1
2
3
Temperature (ºC)
Load Voltage (V)
Temperature (ºC)
Form-A
Typical Blocking Voltage
vs. Temperature
420
415
Blocking Voltage (V
P
)
410
405
400
395
390
385
380
375
-40
-20
0
20
40
60
80
100
Temperature (ºC)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
4
www.ixysic.com
R06
I
NTEGRATED
C
IRCUITS
D
IVISION
LCC110
FORM-B RELAY PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Form-B
Typical Turn-On Time
(N=50, I
F
=8mA, I
L
=120mA
DC
)
Form-B
Typical Turn-Off Time
(N=50, I
F
=8mA, I
L
=120mA
DC
)
Form-B
Typical On-Resistance Distribution
(N=50, I
F
=8mA, I
L
=120mA
DC
)
30
25
Device Count (N)
30
25
Device Count (N)
30
25
Device Count (N)
20
15
10
5
0
20
15
10
5
0
0.03
0.05
0.07
0.09
0.11
0.13
Turn-On Time (ms)
20
15
10
5
0
0.21
0.28
0.35
0.42
0.49
0.56
Turn-Off Time (ms)
25.5
26.5
27.5
28.5
29.5
30.5
31.5
On-Resistance ( )
30
25
Device Count (N)
Form-B
Typical I
F
for Switch Operation
(N=50, I
L
=120mA
DC
)
25
20
15
10
5
0
Form-B
Typical I
F
for Switch Dropout
(N=50, I
L
=120mA
DC
)
Form-B
Typical Blocking Voltage Distribution
(N=50)
30
25
Device Count (N)
20
15
10
5
0
20
15
10
5
0
1.2
2.0
2.8
3.6
4.4
5.2
LED Current (mA)
Device Count (N)
1.2
2.0
2.8
3.6
4.4
5.2
365
375
385
395
405
415
425
LED Current (mA)
Blocking Voltage (V
P
)
0.075
Turn-On Time (ms)
0.074
0.073
0.072
0.071
0.070
0
5
Form-B
Typical Turn-On Time
vs. LED Forward Current
(I
L
=120mA
DC
)
6
5
LED Current (mA)
4
3
2
1
0
-40
Form-B
Typical I
F
for Switch Operation
vs. Temperature
(I
L
=120mA
DC
)
Turn-On Time (ms)
0.25
0.20
0.15
0.10
0.05
0
-40
Form-B
Typical Turn-On Time
vs. Temperature
(I
F
=5mA, I
L
=120mA
DC
)
10
15
20
25
30
35
40
45
50
-20
0
20
40
60
80
100
-20
0
20
40
60
80
100
LED Forward Current (mA)
Temperature (ºC)
Temperature (ºC)
0.40
Turn-Off Time (ms)
0.35
0.30
0.25
0.20
0.15
0
5
Form-B
Typical Turn-Off Time
vs. LED Forward Current
(I
L
=120mA
DC
)
6
5
LED Current (mA)
4
3
2
1
0
-40
Form-B
Typical I
F
for Switch Dropout
vs. Temperature
(I
L
=120mA
DC
)
Turn-Off Time (ms)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-40
-20
Form-B
Typical Turn-Off Time
vs. Temperature
(I
L
=120mA
DC
)
I
F
=8mA
I
F
=10mA
I
F
=20mA
10
15
20
25
30
35
40
45
50
-20
0
20
40
60
80
100
0
20
40
60
80
100
LED Forward Current (mA)
Temperature (ºC)
Temperature (ºC)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
Don't judge others' appearance, because they don't rely on you for food. Don't judge others' virtues, because you are not nobler than them. Don't judge others' families, because it has nothing to d...
I have installed micropython on ESP32. Is there any documentation or examples for Bluetooth operation? I did not find any tutorials for ESP32 on [url=http://www.micropython.com]www.micropython.com[/ur...
void SPIEXCHANGE(count) // Start SPI transfer int count; { if(count>0) { // Is there data to send? i=0; RE2=0; // Chip select bit is low SSPBUF=a[i]; // Send data } else ; // Otherwise, no operation a...
Come and claim Alipay's New Year's red envelopes! Starting January 1, you will have the chance to get an additional exclusive red envelope! [img=50,50]http://bbs.38hot.net/static/image/smiley/pw_defau...
[i=s]This post was last edited by Newhor on 2022-7-14 22:03[/i]First of all, I would like to thank EEWorld for inviting you to the Disassembly (Fifth Issue): Disassembling Power Strips to Learn Circui...
The PCB design of the microphone array is completed, and I am ready to make the board. The previous post shared the schematic diagram. I wanted to edit it directly from that post, but it is no longer ...
While
the solid-state battery
industry is still engaged in a long technological marathon for
the "ultimate solution" for
electric vehicles
, some companies have begun looking for mor...[Details]
The most significant feature of IPS panels is that both electrodes are located on the same surface, unlike other LCD panels, which have electrodes arranged on top and bottom surfaces in a three-dim...[Details]
In recent years, with the application of the IEC61850 standard and the development and deployment of optoelectronic transformers, the concept of digital substations has been put into practical use ...[Details]
On August 22nd, Lantu Motors unveiled a new technology called "Lanhai Intelligent Hybrid" during a live broadcast of CCTV News' "Top Laboratory." The name sounds like another new term, but a closer...[Details]
On August 21, WeRide officially launched WePilot AiDrive, a one-stage end-to-end assisted driving solution developed in cooperation with Bosch. This comes only half a year after the two parties' "t...[Details]
SMT placement machines are important equipment in surface mount technology (Surface Mount Technology). Their performance has a decisive impact on the quality and efficiency of electronic manufactur...[Details]
Reflow soldering is one of the most commonly used methods in electronics manufacturing, allowing for the soldering of large numbers of components in a relatively short time. However, any experience...[Details]
Through AI connection technology supported by Qualcomm X85 5G modem and RF and Qualcomm FastConnect 7900 mobile connection system, seamless switching can be achieved between cellular net...[Details]
Reflow soldering, as an electronics assembly process, has become a vital component of the electronics manufacturing industry. Choosing reflow soldering equipment is crucial for improving production...[Details]
Puttshack's Trackaball uses the Nordic nRF54L15 system-on-chip (SoC) to monitor sensors and enable Bluetooth low energy connectivity, while the nPM2100 power management integrated circuit (PMIC) ...[Details]
"I want to ask why there are so many manufacturers making mobile phone CPUs, but only Intel and AMD make computer CPUs?"
The progress of domestic PC CPU production has disappointed many ...[Details]
The screen is the first thing you notice when evaluating a phone's quality. Its quality directly impacts both visual and operational performance. However, understanding mobile phone screens r...[Details]
On August 20, it was reported that the specifications of Intel's upcoming Panther Lake mobile processor appeared on the Intel GFX CI website, which mainly focuses on Intel's open source Linux drive...[Details]
Introduction: Traditionally, lead-acid batteries have primarily been used to provide backup power and power regulation based on location. In typical applications, the battery's actual use (discharg...[Details]
As the core of electric vehicles, batteries are concerned with vehicle use and maintenance. The operation of vehicles is guaranteed by the electricity generated by batteries. For batteries, battery...[Details]