EEWORLDEEWORLDEEWORLD

Part Number

Search

1206N220J251NTM

Description
Ceramic Capacitor, Multilayer, Ceramic, 250V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.000022uF, Surface Mount, 1206, CHIP
CategoryPassive components    capacitor   
File Size56KB,4 Pages
ManufacturerNovacap
Websitehttps://www.novacap.eu/en/
Environmental Compliance  
Download Datasheet Parametric View All

1206N220J251NTM Overview

Ceramic Capacitor, Multilayer, Ceramic, 250V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.000022uF, Surface Mount, 1206, CHIP

1206N220J251NTM Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Objectid1983058266
package instruction, 1206
Reach Compliance Codecompliant
Country Of OriginMainland China, USA
ECCN codeEAR99
YTEOL7.85
capacitance0.000022 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
high1.63 mm
JESD-609 codee3
length3.18 mm
Installation featuresSURFACE MOUNT
multi-layerYes
negative tolerance5%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
Package formSMT
method of packingTR, EMBOSSED, 7/13 INCH
positive tolerance5%
Rated (DC) voltage (URdc)250 V
size code1206
surface mountYES
Temperature characteristic codeC0G
Temperature Coefficient30ppm/Cel ppm/°C
Terminal surfaceMatte Tin (Sn) - with Nickel (Ni) barrier
Terminal shapeWRAPAROUND
width1.52 mm
COG - COMMERCIAL - 16Vdc to 10KVdc
Ultra stable Class I dielectric (EIA COG) or NPO:
linear temperature coefficient, low loss,
stable electrical properties with time, voltage and frequency. Designed for surface mount
application with nickel barrier termination suitable for solder wave, vapor phase or reflow
solder board attachment. Also available with silver-palladium terminations for hybrid use
with conductive epoxy. COG chips are used in precision circuitry requiring Class I stability.
CAPACITANCE & VOLTAGE SELECTION FOR POPULAR CHIP SIZES
3 digit code: two significant digits, followed by number of zeros eg: 183 = 18,000 pF. R denotes decimal, eg. 2R7 = 2.7 pF
SIZE
Min Cap
0402 0504 0603 0805 1005 1206 1210 1515
0R3
.
024
1808
5R0
.065
393
333
223
153
103
682
472
472
472
392
392
222
122
821
391
221
5R0
.080
393
333
273
223
153
103
562
472
472
472
472
332
182
122
471
271
x
1812
100
.065
563
563
393
273
183
153
103
103
103
822
822
472
272
182
821
471
100
.100
563
563
393
393
273
223
153
123
123
103
103
822
472
272
122
821
x
1825
150
.080
104
104
104
683
473
393
223
223
223
183
183
103
562
272
122
681
391
150
.140
104
104
104
823
683
563
473
333
273
183
183
153
103
562
222
122
821
x
0R5
.044
222
182
152
152
821
561
0R3
.035
152
122
102
102
561
331
0R5
.054
562
472
392
392
182
152
821
821
821
681
681
471
0R5
.054
822
682
562
562
272
222
122
122
122
102
102
391
3R0
.064
153
123
123
103
562
392
272
182
182
152
152
102
561
391
5R0
.065
273
273
223
183
103
822
472
472
472
392
392
222
122
821
3R0
.130
473
393
333
333
223
223
153
103
822
682
682
562
392
272
122
681
Tmax
16V
25V
V O LTA G E
271
221
181
181
101
560
50V
100V
200V
250V
300V
400V
500V
CAP
MAX
&
600V
800V*
1000V*
1500V*
2000V*
3000V*
4000V*
5000V*
6000V*
7000V*
8000V*
9000V*
10000V*
Note:
“ x ”
denotes a special
thickness
(see Tmax
row above).
An
X is required in the part number. Please
refer to page 10 for
how to order.
* Units rated above 800V may require conformal coating in use to preclude arcing over the chip surface
NOTE: REFER TO PAGES 10 & 11 FOR ORDERING INFORMATION
12
.
www.
N O V A C A P
.
com
12
PIC16F877 MCU Programming Tutorial + 12 Simulation Examples
PIC16F877 MCU Programming Tutorial + 12 Simulation Examples....
liuwenliang2012 Microchip MCU
New current mode control method
Unlike conventional pulse width modulation (PWM) techniques that operate the power supply by controlling the duty cycle and the power flowing into the converter, resonant switching techniques process ...
qwqwqw2088 Analogue and Mixed Signal
MOV instructions help you understand the internal and external memory of CC2530
People who have never used 51 cores will be confused by the various internal and external memories when they use CC2530. I made a MOV assembly instruction to help everyone understand the complex memor...
shzk47 RF/Wirelessly
About the problem of external RAM and flash
I am a novice. 1. What are the external RAM and flash of stm32 used for? I think the external flash is used to solve the problem of too large a program, and put part of the code into the external flas...
dong130300 stm32/stm8
How to change the LDC1000EVM default sensor coil
[color=#000000]Alfred Gomes[font=宋体][size=10.5pt]shows you how to change the default sensor coil of the LDC1000EVM[font=宋体][size=10.5pt] with your own coil in a few simple steps. [/size][/font]TI[font...
德州仪器_视频 Analogue and Mixed Signal

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2344  611  2471  249  2057  48  13  50  6  42 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号