C1206C103B2RAC datasheet, PDF - EEWORLD Datasheet

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C1206C103B2RAC: DescriptionCAPACITOR, CERAMIC, MULTILAYER, 50 V, X7R, 0.01 uF, SURFACE MOUNT, 0603; CategoryPassive components; File Size28KB，2 Pages; ManufacturerKEMET; Websitehttp://www.kemet.com

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C1206C103B2RAC Overview

CAPACITOR, CERAMIC, MULTILAYER, 50 V, X7R, 0.01 uF, SURFACE MOUNT, 0603

C1206C103B2RAC Parametric

Parameter Name	Attribute value
Maximum operating temperature	125 Cel
Minimum operating temperature	-55 Cel
negative deviation	5 %
positive deviation	5 %
Rated DC voltage urdc	50 V
Processing package description	CHIP, ROHS COMPLIANT
Lead-free	Yes
EU RoHS regulations	Yes
state	ACTIVE
terminal coating	MATTE TIN OVER NICKEL
Installation features	SURFACE MOUNT
Manufacturer Series	C0603
size code	0603
capacitance	0.0100 uF
packaging shape	RECTANGULAR PACKAGE
Capacitor type	CERAMIC
Terminal shape	WRAPAROUND
Temperature Coefficient	15%
Temperature characteristic code	X7R
multi-layer	Yes

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KEMET

CERAMIC CHIP/STANDARD

FEATURES

• C0G (NP0), X7R, Z5U and Y5V Dielectrics

• 10, 16, 25, 50, 100 and 200 Volts

• Standard End Metalization: Tin-plate over nickel

barrier

• Available Capacitance Tolerances: ±0.10 pF; ±0.25

pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and

+80%-20%

• Tape and reel packaging per EIA481-1. (See page

51 for specific tape and reel information.) Bulk

Cassette packaging (0402, 0603, 0805 only) per

IEC60286-6 and EIAJ 7201.

CAPACITOR OUTLINE DRAWINGS

ELECTRODES

TIN PLATE

NICKEL PLATE

CONDUCTIVE

METALLIZATION

DIMENSIONS—MILLIMETERS AND (INCHES)

EIA

SIZE CODE

0402*

0603*

0805*

1206*

1210*

1812

1825*

2220

2225

METRIC

SIZE CODE

(Ref only)

1005

1608

2012

3216

3225

4532

4564

5650

5664

LENGTH

1.0 (.04) ± .05(.002)

1.6 (.063) ± 0.15 (.006)

2.0 (.079) ± 0.2 (.008)

3.2 (.126) ± 0.2 (.008)

4.5 (.177) ± 0.3 (.012)

5.6 (.220) ± 0.4 (.016)

WIDTH

0.5 (.02) ± .05 (.002)

0.8 (.032) ± 0.15 (.006)

1.25 (.049) ± 0.2 (.008)

1.6 (.063) ± 0.2 (.008)

2.5 (.098) ± 0.2 (.008)

3.2 (.126) ± 0.3 (.012)

6.4 (.252) ± 0.4 (.016)

5.0 (.197) ± 0.4 (.016)

6.3 (.248) ± 0.4 (.016)

T (EIA) #

THICKNESS MAX.

0.55 (.022)

0.9 (.035)

1.3 (.051)

1.5 (.059)

1.7 (.067)

1.8 (.071)

2.0 (.079)

BANDWIDTH

0.20 (0.008)-0.40 (0.016)

0.35 (.014) ±0.15 (.006)

0.5 (.02) ±.25 (.010)

0.6 (.024) ±.35 (.014)

MIN. SEPARATION

0.3 (.012)

0.7 (.028)

0.75 (.030)

N/A

MOUNTING

TECHNIQUE

Solder Reflow

Solder Wave

Solder Reflow

Solder

Reflow

* Note: Indicates EIA Preferred Case Sizes

# Note: Different tolerances apply for 0402, 0603, and 0805 packaged in bulk cassette.

CAPACITOR ORDERING INFORMATION

(Standard Chips - For

C 0805 C 103 K 5 R A C*

CERAMIC

SIZE CODE

SPECIFICATION

C - Standard

CAPACITANCE CODE

Expressed in Picofarads (pF)

First two digits represent significant figures.

Third digit specifies number of zeros. (Use 9

for 1.0 thru 9.9pF. Use 8 for 0.5 through 0.99pF)

(Example: 2.2pF = 229 or 0.50 pF = 508)

CAPACITANCE TOLERANCE

B – ±0.10pF J – ±5%

C – ±0.25pF K – ±10%

M – ±20%

D – ±0.5pF

F – ±1%

P – (GMV)

G – ±2%

Z – +80%, -20%

* Part Number Example: C0805C103K5RAC

Military see page 45)

END METALLIZATION

C-Standard

(Tin-plated nickel barrier)

FAILURE RATE LEVEL

A- Not Applicable

TEMPERATURE CHARACTERISTIC

Designated by Capacitance

Change Over Temperature Range

G – C0G (NP0) (±30 PPM/°C)

R – X7R (±15%)

U – Z5U (+22%, -56%)

V – Y5V (+22%, -82%)

VOLTAGE

1 - 100V

3 - 25V

2 - 200V

4 - 16V

5 - 50V

8 - 10V

(14 digits - no spaces)

KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300

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