EEWORLDEEWORLDEEWORLD

Part Number

Search

B0202AG-02-2401-C

Description
Fixed Resistor, Thin Film, 0.25W, 2400ohm, 100V, 0.25% +/-Tol, 50ppm/Cel, Surface Mount, 0202, CHIP
CategoryPassive components    The resistor   
File Size381KB,3 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Download Datasheet Parametric View All

B0202AG-02-2401-C Overview

Fixed Resistor, Thin Film, 0.25W, 2400ohm, 100V, 0.25% +/-Tol, 50ppm/Cel, Surface Mount, 0202, CHIP

B0202AG-02-2401-C Parametric

Parameter NameAttribute value
Objectid1579361392
package instruction, 0202
Reach Compliance Codecompliant
ECCN codeEAR99
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
method of packingTRAY
Rated power dissipation(P)0.25 W
Rated temperature70 °C
resistance2400 Ω
Resistor typeFIXED RESISTOR
size code0202
surface mountYES
technologyTHIN FILM
Temperature Coefficient50 ppm/°C
Terminal shapeONE SURFACE
Tolerance0.25%
Operating Voltage100 V
Wire Bondable
Chip Resistors
WBC Series
Discrete or tapped schematics
MIL inspection available
High resistor density
IRC’s WBC series wire bondable chip resistors are ideally suited for
the most demanding hybrid application. The WBC combines IRC’s
TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to produce an extremely small
footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
(0.508mm ±0.025)
0.020˝ ±0.001
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed P x R )
Operating Temperature
Back contact
Noise
R
Top contact
pad chamfered
0.004˝ min bond pad size
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Al / Au optional)
3KÅ Au minimum
10KÅ Al minimum
Silicon Dioxide or
Silicon Nitride
R
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
(0.508mm ±0.025)
0.020˝ ±0.001
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
R0202 and
T0303
B0202
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
(0.762mm ±0.025)
0.030˝ ±0.001
½R
½R
Backside
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
Passivation
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
WBC Series Issue January 2009 Sheet 1 of 3
MSP430FR573x, MSP430FR572x Device Erratasheet
...
莫妮卡 Microcontroller MCU
GPRS Wireless Network Controller
[font=宋体][b][size=5]1. Introduction [/size][/b][font=宋体][size=12pt] [/size][/font][color=#000000][font=宋体][size=12pt] This design uses GD32F350 as the main control. [/size][/font][font=宋体][size=12pt] ...
常见泽1 GD32 MCU
Problems with porting raw-os to stm32f103
[code]int main(void) { raw_os_init(); led_init(); Bsp_Timer2_Init(); led_task_test(); raw_os_start(); return 0; } void TIM2_IRQHandler(void) { if(TIM_GetITStatus(TIM2,TIM_IT_Update)) { raw_enter_inter...
使者0123 Embedded System
How to derive the transfer function of the Debo integrator in 3.2 in circuit design based on operational amplifiers and analog integrated circuits
Could you please help me derive the transfer function of this integrator circuit? I have been deriving it for a long time but still can’t get the transfer function of the extreme point p=-(1-k)/RC?...
sunboy25 Analog electronics
So anxious~
There is a US-owned company that is in urgent need of an RF engineer with more than one and a half years of relevant work experience, preferably in the field of mobile phone antennas. The salary depen...
boyejie Recruitment
How to call C++ class members in C language
Because I made a small module to be used in a single-chip microcomputer, but now I need to verify it on the host computer. So I used Qt, but the interface of this Qt module is related to the timer. I ...
lonerzf Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2527  1934  2575  1219  931  51  39  52  25  19 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号