EEWORLDEEWORLDEEWORLD

Part Number

Search

C1206C104B3VAC

Description
CAPACITOR, CERAMIC, MULTILAYER, 50 V, X7R, 0.01 uF, SURFACE MOUNT, 0603
CategoryPassive components   
File Size28KB,2 Pages
ManufacturerKEMET
Websitehttp://www.kemet.com
Download Datasheet Parametric View All

C1206C104B3VAC Overview

CAPACITOR, CERAMIC, MULTILAYER, 50 V, X7R, 0.01 uF, SURFACE MOUNT, 0603

C1206C104B3VAC Parametric

Parameter NameAttribute value
Maximum operating temperature125 Cel
Minimum operating temperature-55 Cel
negative deviation5 %
positive deviation5 %
Rated DC voltage urdc50 V
Processing package descriptionCHIP, ROHS COMPLIANT
Lead-freeYes
EU RoHS regulationsYes
stateACTIVE
terminal coatingMATTE TIN OVER NICKEL
Installation featuresSURFACE MOUNT
Manufacturer SeriesC0603
size code0603
capacitance0.0100 uF
packaging shapeRECTANGULAR PACKAGE
Capacitor typeCERAMIC
Terminal shapeWRAPAROUND
Temperature Coefficient15%
Temperature characteristic codeX7R
multi-layerYes
KEMET
®
CERAMIC CHIP/STANDARD
FEATURES
• C0G (NP0), X7R, Z5U and Y5V Dielectrics
• 10, 16, 25, 50, 100 and 200 Volts
• Standard End Metalization: Tin-plate over nickel
barrier
• Available Capacitance Tolerances: ±0.10 pF; ±0.25
pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and
+80%-20%
• Tape and reel packaging per EIA481-1. (See page
51 for specific tape and reel information.) Bulk
Cassette packaging (0402, 0603, 0805 only) per
IEC60286-6 and EIAJ 7201.
CAPACITOR OUTLINE DRAWINGS
W
T
S
ELECTRODES
L
B
TIN PLATE
NICKEL PLATE
CONDUCTIVE
METALLIZATION
DIMENSIONS—MILLIMETERS AND (INCHES)
EIA
SIZE CODE
0402*
0603*
0805*
1206*
1210*
1812
1825*
2220
2225
METRIC
SIZE CODE
(Ref only)
1005
1608
2012
3216
3225
4532
4564
5650
5664
L#
LENGTH
1.0 (.04) ± .05(.002)
1.6 (.063) ± 0.15 (.006)
2.0 (.079) ± 0.2 (.008)
3.2 (.126) ± 0.2 (.008)
3.2 (.126) ± 0.2 (.008)
4.5 (.177) ± 0.3 (.012)
4.5 (.177) ± 0.3 (.012)
5.6 (.220) ± 0.4 (.016)
5.6 (.220) ± 0.4 (.016)
W#
WIDTH
0.5 (.02) ± .05 (.002)
0.8 (.032) ± 0.15 (.006)
1.25 (.049) ± 0.2 (.008)
1.6 (.063) ± 0.2 (.008)
2.5 (.098) ± 0.2 (.008)
3.2 (.126) ± 0.3 (.012)
6.4 (.252) ± 0.4 (.016)
5.0 (.197) ± 0.4 (.016)
6.3 (.248) ± 0.4 (.016)
T (EIA) #
THICKNESS MAX.
0.55 (.022)
0.9 (.035)
1.3 (.051)
1.5 (.059)
1.7 (.067)
1.7 (.067)
1.7 (.067)
1.8 (.071)
2.0 (.079)
B
BANDWIDTH
0.20 (0.008)-0.40 (0.016)
0.35 (.014) ±0.15 (.006)
0.5 (.02) ±.25 (.010)
0.5 (.02) ±.25 (.010)
0.5 (.02) ±.25 (.010)
0.6 (.024) ±.35 (.014)
0.6 (.024) ±.35 (.014)
0.6 (.024) ±.35 (.014)
0.6 (.024) ±.35 (.014)
S
MIN. SEPARATION
0.3 (.012)
0.7 (.028)
0.75 (.030)
N/A
N/A
N/A
N/A
N/A
N/A
MOUNTING
TECHNIQUE
Solder Reflow
Solder Wave
or
Solder Reflow
Solder
Reflow
* Note: Indicates EIA Preferred Case Sizes
# Note: Different tolerances apply for 0402, 0603, and 0805 packaged in bulk cassette.
CAPACITOR ORDERING INFORMATION
(Standard Chips - For
C 0805 C 103 K 5 R A C*
CERAMIC
SIZE CODE
SPECIFICATION
C - Standard
CAPACITANCE CODE
Expressed in Picofarads (pF)
First two digits represent significant figures.
Third digit specifies number of zeros. (Use 9
for 1.0 thru 9.9pF. Use 8 for 0.5 through 0.99pF)
(Example: 2.2pF = 229 or 0.50 pF = 508)
CAPACITANCE TOLERANCE
B – ±0.10pF J – ±5%
C – ±0.25pF K – ±10%
M – ±20%
D – ±0.5pF
F – ±1%
P – (GMV)
G – ±2%
Z – +80%, -20%
* Part Number Example: C0805C103K5RAC
Military see page 45)
END METALLIZATION
C-Standard
(Tin-plated nickel barrier)
FAILURE RATE LEVEL
A- Not Applicable
TEMPERATURE CHARACTERISTIC
Designated by Capacitance
Change Over Temperature Range
G – C0G (NP0) (±30 PPM/°C)
R – X7R (±15%)
U – Z5U (+22%, -56%)
V – Y5V (+22%, -82%)
VOLTAGE
1 - 100V
3 - 25V
2 - 200V
4 - 16V
5 - 50V
8 - 10V
(14 digits - no spaces)
38
KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
What kind of emulator is DAP/uP?
As the title says. I want to design a circuit board myself recently, and I need to use a DSP chip. Some people say that the DAP/uP simulator can be used to simulate and debug the system, but I don't k...
skybirdy Embedded System
STM32F103ZC driver DM9000AEP problem
I expanded a DM9000AEP on the learning board I made, downloaded the Anfulai network test program "Ex011-TCP Communication_uIP" from the Internet, changed the address, and also modified the correspondi...
南海渔歌 stm32/stm8
Cannot read data in BMP085 register using IIC communication
I need to use a pressure sensor for my graduation project, so I bought bmp085 and bmp180 modules. I use CC2430 chip as the controller. The crystal oscillator is 32MHz. The current program is modified ...
chenxiao002468 51mcu
Problems using jrtplib on PDA
I wrote rtp initialization like this RTPAppSession *rtp; //RTPAppSession inherits from RTPSession and uses OnRTPPacket to process received data RTPSessionParams sessParams; RTPUDPv4TransmissionParams ...
wangxzok Embedded System
Protect sensitive IC components
For cost, integration and performance, it is necessary to use high-speed serial data interfaces and reduce semiconductor manufacturing layout. However, such smaller devices are more susceptible to ele...
kandy2059 Analog electronics
The msp430f5418 is prone to crashes when used, and sometimes it is found that the external crystal oscillator cannot be started.
Just as the title says. Anyone who has used this film, please advise....
shzps Microcontroller MCU

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1103  688  858  773  2008  23  14  18  16  41 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号