EEWORLDEEWORLDEEWORLD

Part Number

Search

C1206C104P4UAC

Description
CAPACITOR, CERAMIC, MULTILAYER, 50 V, X7R, 0.01 uF, SURFACE MOUNT, 0603
CategoryPassive components   
File Size28KB,2 Pages
ManufacturerKEMET
Websitehttp://www.kemet.com
Download Datasheet Parametric View All

C1206C104P4UAC Overview

CAPACITOR, CERAMIC, MULTILAYER, 50 V, X7R, 0.01 uF, SURFACE MOUNT, 0603

C1206C104P4UAC Parametric

Parameter NameAttribute value
Maximum operating temperature125 Cel
Minimum operating temperature-55 Cel
negative deviation5 %
positive deviation5 %
Rated DC voltage urdc50 V
Processing package descriptionCHIP, ROHS COMPLIANT
Lead-freeYes
EU RoHS regulationsYes
stateACTIVE
terminal coatingMATTE TIN OVER NICKEL
Installation featuresSURFACE MOUNT
Manufacturer SeriesC0603
size code0603
capacitance0.0100 uF
packaging shapeRECTANGULAR PACKAGE
Capacitor typeCERAMIC
Terminal shapeWRAPAROUND
Temperature Coefficient15%
Temperature characteristic codeX7R
multi-layerYes
KEMET
®
CERAMIC CHIP/STANDARD
FEATURES
• C0G (NP0), X7R, Z5U and Y5V Dielectrics
• 10, 16, 25, 50, 100 and 200 Volts
• Standard End Metalization: Tin-plate over nickel
barrier
• Available Capacitance Tolerances: ±0.10 pF; ±0.25
pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and
+80%-20%
• Tape and reel packaging per EIA481-1. (See page
51 for specific tape and reel information.) Bulk
Cassette packaging (0402, 0603, 0805 only) per
IEC60286-6 and EIAJ 7201.
CAPACITOR OUTLINE DRAWINGS
W
T
S
ELECTRODES
L
B
TIN PLATE
NICKEL PLATE
CONDUCTIVE
METALLIZATION
DIMENSIONS—MILLIMETERS AND (INCHES)
EIA
SIZE CODE
0402*
0603*
0805*
1206*
1210*
1812
1825*
2220
2225
METRIC
SIZE CODE
(Ref only)
1005
1608
2012
3216
3225
4532
4564
5650
5664
L#
LENGTH
1.0 (.04) ± .05(.002)
1.6 (.063) ± 0.15 (.006)
2.0 (.079) ± 0.2 (.008)
3.2 (.126) ± 0.2 (.008)
3.2 (.126) ± 0.2 (.008)
4.5 (.177) ± 0.3 (.012)
4.5 (.177) ± 0.3 (.012)
5.6 (.220) ± 0.4 (.016)
5.6 (.220) ± 0.4 (.016)
W#
WIDTH
0.5 (.02) ± .05 (.002)
0.8 (.032) ± 0.15 (.006)
1.25 (.049) ± 0.2 (.008)
1.6 (.063) ± 0.2 (.008)
2.5 (.098) ± 0.2 (.008)
3.2 (.126) ± 0.3 (.012)
6.4 (.252) ± 0.4 (.016)
5.0 (.197) ± 0.4 (.016)
6.3 (.248) ± 0.4 (.016)
T (EIA) #
THICKNESS MAX.
0.55 (.022)
0.9 (.035)
1.3 (.051)
1.5 (.059)
1.7 (.067)
1.7 (.067)
1.7 (.067)
1.8 (.071)
2.0 (.079)
B
BANDWIDTH
0.20 (0.008)-0.40 (0.016)
0.35 (.014) ±0.15 (.006)
0.5 (.02) ±.25 (.010)
0.5 (.02) ±.25 (.010)
0.5 (.02) ±.25 (.010)
0.6 (.024) ±.35 (.014)
0.6 (.024) ±.35 (.014)
0.6 (.024) ±.35 (.014)
0.6 (.024) ±.35 (.014)
S
MIN. SEPARATION
0.3 (.012)
0.7 (.028)
0.75 (.030)
N/A
N/A
N/A
N/A
N/A
N/A
MOUNTING
TECHNIQUE
Solder Reflow
Solder Wave
or
Solder Reflow
Solder
Reflow
* Note: Indicates EIA Preferred Case Sizes
# Note: Different tolerances apply for 0402, 0603, and 0805 packaged in bulk cassette.
CAPACITOR ORDERING INFORMATION
(Standard Chips - For
C 0805 C 103 K 5 R A C*
CERAMIC
SIZE CODE
SPECIFICATION
C - Standard
CAPACITANCE CODE
Expressed in Picofarads (pF)
First two digits represent significant figures.
Third digit specifies number of zeros. (Use 9
for 1.0 thru 9.9pF. Use 8 for 0.5 through 0.99pF)
(Example: 2.2pF = 229 or 0.50 pF = 508)
CAPACITANCE TOLERANCE
B – ±0.10pF J – ±5%
C – ±0.25pF K – ±10%
M – ±20%
D – ±0.5pF
F – ±1%
P – (GMV)
G – ±2%
Z – +80%, -20%
* Part Number Example: C0805C103K5RAC
Military see page 45)
END METALLIZATION
C-Standard
(Tin-plated nickel barrier)
FAILURE RATE LEVEL
A- Not Applicable
TEMPERATURE CHARACTERISTIC
Designated by Capacitance
Change Over Temperature Range
G – C0G (NP0) (±30 PPM/°C)
R – X7R (±15%)
U – Z5U (+22%, -56%)
V – Y5V (+22%, -82%)
VOLTAGE
1 - 100V
3 - 25V
2 - 200V
4 - 16V
5 - 50V
8 - 10V
(14 digits - no spaces)
38
KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
Anyone who has used the MAX436 filter chip before, please come in and help me solve the problem
I use MAX436 to process the signal. I read the information of MAX436, but the actual use is opposite to the theory. I would like to ask the experts to help me. I follow the connection method of Figure...
tang_lixin Embedded System
LPC2103 cannot download program using ISP
I use FlashMagic software to connect to LPC2103 via USB to serial port to download the program, but it always prompts "failed to autobaud - step1" The circuit of the development board I use is fine, a...
kencai Embedded System
[Group purchase] STM32 development board, take you to get started with STM32 from scratch
Want to buy an STM32 development board? Want to get started from scratch? In order to better help friends in the forum to learn, EEWORLD and Feiqian Electronics jointly organized this STM32 developmen...
飞嵌电子 stm32/stm8
This error has been bothering me for a long time.
When I download the system runtime image to the emulator in PB, I always get the following error: The specified CE boot image could not be loaded. Your virtual machine may not have enough RAM allocate...
yifeng02977 Embedded System
Help: How about switching careers to electronic testing equipment sales?
I sell power supplies. A few days ago, I read a report that Tektronix and Agilent have launched their own new frequency meters , FCA and 53200 series . I want to ask if engineers at eeworld usually us...
猫熊 Test/Measurement
Help on AD issue of EZ430RF2500
I would like to ask why the external AD resource of the EZ430RF2500 module has a voltage when it is powered on. Isn't it said that the input voltage of the AD analog voltage is 0? There is voltage onl...
lhqalex Microcontroller MCU

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1105  2294  1923  1287  2659  23  47  39  26  54 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号