EEWORLDEEWORLDEEWORLD

Part Number

Search

C1210C103C1UAC

Description
CAPACITOR, CERAMIC, MULTILAYER, 50 V, X7R, 0.01 uF, SURFACE MOUNT, 0603
CategoryPassive components   
File Size28KB,2 Pages
ManufacturerKEMET
Websitehttp://www.kemet.com
Download Datasheet Parametric View All

C1210C103C1UAC Overview

CAPACITOR, CERAMIC, MULTILAYER, 50 V, X7R, 0.01 uF, SURFACE MOUNT, 0603

C1210C103C1UAC Parametric

Parameter NameAttribute value
Maximum operating temperature125 Cel
Minimum operating temperature-55 Cel
negative deviation5 %
positive deviation5 %
Rated DC voltage urdc50 V
Processing package descriptionCHIP, ROHS COMPLIANT
Lead-freeYes
EU RoHS regulationsYes
stateACTIVE
terminal coatingMATTE TIN OVER NICKEL
Installation featuresSURFACE MOUNT
Manufacturer SeriesC0603
size code0603
capacitance0.0100 uF
packaging shapeRECTANGULAR PACKAGE
Capacitor typeCERAMIC
Terminal shapeWRAPAROUND
Temperature Coefficient15%
Temperature characteristic codeX7R
multi-layerYes
KEMET
®
CERAMIC CHIP/STANDARD
FEATURES
• C0G (NP0), X7R, Z5U and Y5V Dielectrics
• 10, 16, 25, 50, 100 and 200 Volts
• Standard End Metalization: Tin-plate over nickel
barrier
• Available Capacitance Tolerances: ±0.10 pF; ±0.25
pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and
+80%-20%
• Tape and reel packaging per EIA481-1. (See page
51 for specific tape and reel information.) Bulk
Cassette packaging (0402, 0603, 0805 only) per
IEC60286-6 and EIAJ 7201.
CAPACITOR OUTLINE DRAWINGS
W
T
S
ELECTRODES
L
B
TIN PLATE
NICKEL PLATE
CONDUCTIVE
METALLIZATION
DIMENSIONS—MILLIMETERS AND (INCHES)
EIA
SIZE CODE
0402*
0603*
0805*
1206*
1210*
1812
1825*
2220
2225
METRIC
SIZE CODE
(Ref only)
1005
1608
2012
3216
3225
4532
4564
5650
5664
L#
LENGTH
1.0 (.04) ± .05(.002)
1.6 (.063) ± 0.15 (.006)
2.0 (.079) ± 0.2 (.008)
3.2 (.126) ± 0.2 (.008)
3.2 (.126) ± 0.2 (.008)
4.5 (.177) ± 0.3 (.012)
4.5 (.177) ± 0.3 (.012)
5.6 (.220) ± 0.4 (.016)
5.6 (.220) ± 0.4 (.016)
W#
WIDTH
0.5 (.02) ± .05 (.002)
0.8 (.032) ± 0.15 (.006)
1.25 (.049) ± 0.2 (.008)
1.6 (.063) ± 0.2 (.008)
2.5 (.098) ± 0.2 (.008)
3.2 (.126) ± 0.3 (.012)
6.4 (.252) ± 0.4 (.016)
5.0 (.197) ± 0.4 (.016)
6.3 (.248) ± 0.4 (.016)
T (EIA) #
THICKNESS MAX.
0.55 (.022)
0.9 (.035)
1.3 (.051)
1.5 (.059)
1.7 (.067)
1.7 (.067)
1.7 (.067)
1.8 (.071)
2.0 (.079)
B
BANDWIDTH
0.20 (0.008)-0.40 (0.016)
0.35 (.014) ±0.15 (.006)
0.5 (.02) ±.25 (.010)
0.5 (.02) ±.25 (.010)
0.5 (.02) ±.25 (.010)
0.6 (.024) ±.35 (.014)
0.6 (.024) ±.35 (.014)
0.6 (.024) ±.35 (.014)
0.6 (.024) ±.35 (.014)
S
MIN. SEPARATION
0.3 (.012)
0.7 (.028)
0.75 (.030)
N/A
N/A
N/A
N/A
N/A
N/A
MOUNTING
TECHNIQUE
Solder Reflow
Solder Wave
or
Solder Reflow
Solder
Reflow
* Note: Indicates EIA Preferred Case Sizes
# Note: Different tolerances apply for 0402, 0603, and 0805 packaged in bulk cassette.
CAPACITOR ORDERING INFORMATION
(Standard Chips - For
C 0805 C 103 K 5 R A C*
CERAMIC
SIZE CODE
SPECIFICATION
C - Standard
CAPACITANCE CODE
Expressed in Picofarads (pF)
First two digits represent significant figures.
Third digit specifies number of zeros. (Use 9
for 1.0 thru 9.9pF. Use 8 for 0.5 through 0.99pF)
(Example: 2.2pF = 229 or 0.50 pF = 508)
CAPACITANCE TOLERANCE
B – ±0.10pF J – ±5%
C – ±0.25pF K – ±10%
M – ±20%
D – ±0.5pF
F – ±1%
P – (GMV)
G – ±2%
Z – +80%, -20%
* Part Number Example: C0805C103K5RAC
Military see page 45)
END METALLIZATION
C-Standard
(Tin-plated nickel barrier)
FAILURE RATE LEVEL
A- Not Applicable
TEMPERATURE CHARACTERISTIC
Designated by Capacitance
Change Over Temperature Range
G – C0G (NP0) (±30 PPM/°C)
R – X7R (±15%)
U – Z5U (+22%, -56%)
V – Y5V (+22%, -82%)
VOLTAGE
1 - 100V
3 - 25V
2 - 200V
4 - 16V
5 - 50V
8 - 10V
(14 digits - no spaces)
38
KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
Application of electromagnetic functional composite materials in radar antenna covers
Authors: Peng Huaxin, Professor, Zhejiang University; Qin Faxiang, Researcher, Zhejiang UniversityElectromagnetic functional composite materials can be divided into three categories according to their...
btty038 RF/Wirelessly
Printed circuits must have a "Printing Business License"
Printed circuits require a "Printing Business License"...
maoshen Talking
Key anti-shake problem
[img]file:///C:/Documents%20and%20Settings/Administrator/桌/12[/img] void kelay() { if(!stop) //If the button is pressed { delay1(10);//Delay 10MS if(!stop) //If the button is really pressed { keycnt++...
HUI535233725 MCU
Altium Design Expert Advanced---Master Common Function Keys
A complete list of commonly used function keys in design [b][font=Tahoma,]PCB[/font][/b][b]Design improvement[/b][b]: [/b] [color=#000]Switching between grids and grids[/color]: [color=#000]View-Grids...
qwqwqw2088 PCB Design
Summarize the defects and uses of stm32's i2c
As the title says, my two months of experience~~ I hope it will be helpful to those who come laterSummary of the defects and uses of STM32's I2C.pdf (92.94 KB)Downloads:672 2010-12-1 08:49...
leee20002 stm32/stm8
EEWORLD University Hall ---- Jiangsu University Zhixin Cup FPGA Innovation Design Competition Entry Collection
Jiangsu University Zhixin Cup FPGA Innovation Design Competition Entry Collection : https://training.eeworld.com.cn/course/557...
chenyy MCU

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2631  2428  2872  2657  2890  53  49  58  54  59 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号