MICROWAVE CHIP RESISTORS
MSMW SERIES
W
All MSMW parts can be Wire-Bonded, Ribbon-Bonded and offered with Solder Bumps. Parts are manufactured
using specialized Laser Trimming for Optimal Performance over Operating Frequency Range.
DAT
MECHANICAL DATA
T
L
Shown with optional Gold Back
SERIES
MSMW 21
MSMW 110
MSMW 112
MSMW 115
MSMW 118
MSMW 120
MSMW 121
MSMW 122
MSMW 124
L
0.020"
0.037"
0.050"
0.050"
0.021"
0.100"
0.100"
0.020"
0.150"
x
x
x
x
x
x
x
x
x
W
0.010"
0.017"
0.050"
0.025"
0.017"
0.050"
0.100"
0.016"
0.085"
x
x
x
x
x
x
x
x
x
T
0.010"
0.010"
0.010"
0.010"
0.010"
0.010"
0.010"
0.010"
0.010"
TOLERANCE
(±0.003")
(±0.003")
(±0.003")
(±0.003")
(±0.003")
(±0.003")
(±0.003")
(±0.003")
(±0.003")
RATING
POWER RATING
@ 70°C
50mW
125mW
125mW
125mW
125mW
125mW
500mW
125mW
500mW
DAT
ELECTRICAL DATA
SERIES
MSMW 21
MSMW 110
MSMW 112
MSMW 115
MSMW 118
MSMW 120
MSMW 121
MSMW 122
MSMW 124
ABSOLUTE TOLERANCE
T.C.R.
OHMIC VALUE
400Ω
2
Ω −
400
Ω
KΩ
2
Ω −
1 K
Ω
KΩ
2
Ω −
3 K
Ω
KΩ
2
Ω −
2 K
Ω
300Ω
2
Ω −
300
Ω
KΩ
5
Ω −
5 K
Ω
KΩ
1 0
Ω −
5 K
Ω
360Ω
2
Ω −
360
Ω
KΩ
1 0
Ω −
5 K
Ω
1%, 2%, 5%, 10%
STANDARD
±150ppm/° STANDARD (TaN)
±25ppm/°C STANDARD (NiCr); ±150ppm/
°
C STANDARD (TaN)
CONSULT SALES FOR OTHER VALUES / TOLERANCES
MICROWAVE
MICROWAVE
MICROWAVE
MICROWAVE
MICROWAVE
& RF
& RF
& RF
& RF
& RF
RESISTORS
RESISTORS
RESISTORS
RESISTORS
RESISTORS
DAT
SERIES DATA
SUBSTRATE MATERIAL
SUBSTRATE MATERIAL
CURRENT NOISE
OPERATING VOLT
OPERATING VOLTAGE
SHORT TERM OVERLOAD
HIGH TEMP EXPOSURE
THERMAL SHOCK
RESISTANCE
MOISTURE RESISTANCE
STABILITY
STABILITY
OPERATING
OPERATING TEMP RANGE
STORAGE TEMP
STRAY
STRAY DISTRIBUTED
CAPACIT
ACITANCE
CAPACITANCE
ALUMINA
QUARTZ
STANDARD,
99.6% ALUMINA STANDARD, QUARTZ** OPTIONAL
-20dB TYPICAL
100 V MAX.
RATED
25°
±0.
0.2
5X RATED POWER, 25°C, 5 SEC., ±0.25% MAX.
∆
R/R: ±0.1% MSI TYPICAL
±0.25%
0.03
03%
150°C, 100 HRS., ±0.25% MAX.
∆
R/R: ±0.03% MSI TYPICAL
107F, ±0.25%
MIL-STD 202, METHOD 107F, ±0.25% MAX.
∆
R/R: ±0.1% MSI TYPICAL
±0.
0.5
0.1
MIL-STD 202, METHOD 106, ±0.5% MAX.
∆
R/R: ±0.1% MSI TYPICAL
70°C,
POWER, ±0.5%
1000 HRS., 70°C, 100% POWER, ±0.5% MAX.
∆
R/R: ±0.1% MSI TYPICAL
-55
-55°C TO +150°C
+150°C
0.06pF
0.02pF
PART NUMBER DESIGNATION
DESIGNATION
MSMW
XX
SUBSTRATE
SUBSTRATE /
RESISTIVE FILM
TaN
AT = Alumina / TaN
AN = Alumina / NiCr
TaN
QT = Quartz / TaN
QN = Quartz / NiCr
TaN
PT = Polished / TaN
PN = Polished / NiCr
XXXXX
OHMIC VALUE
5-Digit
Number: 1st
4 Digits Are
Significant
With "R" As
Decimal
Point When
Required.
5th Digit
Represents
Number of
Zeros.
X
TOLERANCE
F
G
J
K
= 1%
= 2%
= 5%
= 10%
X
OPTION
F = ±100ppm/°C
G = Gold Bond
Pads Std.*
GB = Gold Backside
T = With Solder
Bumps
T3 = With Leadfree
Solder Bumps
21
110, 112
115, 118
120, 121
122, 124
MINI-SYSTEMS, INC.
THIN FILM DIVISION
DAVID
ATTLEBORO,
20 DAVID ROAD, N. ATTLEBORO, MA 02760
508-695-0203 FAX: 508-695-6076
DCN TF 109-G-0306
1KΩ
Tol.,
EXAMPLE: MSMW 110AN-10000F-GB = 110 Series, Alumina Substrate, 1K
Ω
, ±1% Tol.,
±25ppm/°C, Nichrome, Gold Backside.
* Always used when no other option is required.
** Consult Sales for power capabilities on Quartz substrate
Embedded System
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