EEWORLDEEWORLDEEWORLD

Part Number

Search

C124K102M1BX5CM

Description
CAPACITOR, CERAMIC, MULTILAYER, 200 V, C0G, 0.001 uF, THROUGH HOLE MOUNT
CategoryPassive components   
File Size1MB,16 Pages
ManufacturerKEMET
Websitehttp://www.kemet.com
Download Datasheet Parametric View All

C124K102M1BX5CM Overview

CAPACITOR, CERAMIC, MULTILAYER, 200 V, C0G, 0.001 uF, THROUGH HOLE MOUNT

C124K102M1BX5CM Parametric

Parameter NameAttribute value
Maximum operating temperature125 Cel
Minimum operating temperature-55 Cel
negative deviation1 %
positive deviation1 %
Rated DC voltage urdc200 V
Processing package descriptionRADIAL LEADED
stateACTIVE
terminal coatingTIN LEAD OVER NICKEL
Installation featuresTHROUGH HOLE MOUNT
Manufacturer SeriesC052
capacitance1.00E-3 uF
packaging shapeRECTANGULAR PACKAGE
Capacitor typeCERAMIC
Terminal shapeWIRE
Temperature Coefficient30ppm/Cel
Temperature characteristic codeC0G
multi-layerYes
MULTILAYER CERAMIC CAPACITORS/AXIAL
& RADIAL LEADED
Multilayer ceramic capacitors are available in a
variety of physical sizes and configurations, including
leaded devices and surface mounted chips. Leaded
styles include molded and conformally coated parts
with axial and radial leads. However, the basic
capacitor element is similar for all styles. It is called a
chip and consists of formulated dielectric materials
which have been cast into thin layers, interspersed
with metal electrodes alternately exposed on opposite
edges of the laminated structure. The entire structure is
fired at high temperature to produce a monolithic
block which provides high capacitance values in a
small physical volume. After firing, conductive
terminations are applied to opposite ends of the chip to
make contact with the exposed electrodes.
Termination materials and methods vary depending on
the intended use.
TEMPERATURE CHARACTERISTICS
Ceramic dielectric materials can be formulated with
Class III:
General purpose capacitors, suitable
a wide range of characteristics. The EIA standard for
for by-pass coupling or other applications in which
ceramic dielectric capacitors (RS-198) divides ceramic
dielectric losses, high insulation resistance and
dielectrics into the following classes:
stability of capacitance characteristics are of little or
no importance. Class III capacitors are similar to Class
Class I:
Temperature compensating capacitors,
II capacitors except for temperature characteristics,
suitable for resonant circuit application or other appli-
which are greater than ± 15%. Class III capacitors
cations where high Q and stability of capacitance char-
have the highest volumetric efficiency and poorest
acteristics are required. Class I capacitors have
stability of any type.
predictable temperature coefficients and are not
affected by voltage, frequency or time. They are made
KEMET leaded ceramic capacitors are offered in
from materials which are not ferro-electric, yielding
the three most popular temperature characteristics:
superior stability but low volumetric efficiency. Class I
C0G:
Class I, with a temperature coefficient of 0 ±
capacitors are the most stable type available, but have
30 ppm per degree C over an operating
the lowest volumetric efficiency.
temperature range of - 55°C to + 125°C (Also
known as “NP0”).
Class II:
Stable capacitors, suitable for bypass
X7R:
Class II, with a maximum capacitance
or coupling applications or frequency discriminating
change of ± 15% over an operating temperature
circuits where Q and stability of capacitance char-
range of - 55°C to + 125°C.
acteristics are not of major importance. Class II
Z5U:
Class III, with a maximum capacitance
capacitors have temperature characteristics of ± 15%
change of + 22% - 56% over an operating tem-
or less. They are made from materials which are
perature range of + 10°C to + 85°C.
ferro-electric, yielding higher volumetric efficiency but
less stability. Class II capacitors are affected by
Specified electrical limits for these three temperature
temperature, voltage, frequency and time.
characteristics are shown in Table 1.
SPECIFIED ELECTRICAL LIMITS
Parameter
Dissipation Factor: Measured at following conditions.
C0G – 1 kHz and 1 vrms if capacitance >1000pF
1 MHz and 1 vrms if capacitance 1000 pF
X7R – 1 kHz and 1 vrms* or if extended cap range 0.5 vrms
Z5U – 1 kHz and 0.5 vrms
Dielectric Stength: 2.5 times rated DC voltage.
Insulation Resistance (IR): At rated DC voltage,
whichever of the two is smaller
Temperature Characteristics: Range, °C
Capacitance Change without
DC voltage
* MHz and 1 vrms if capacitance
100 pF on military product.
Temperature Characteristics
C0G
X7R
2.5%
(3.5% @ 25V)
Z5U
0.10%
4.0%
Pass Subsequent IR Test
1,000 M
F
or 100 G
-55 to +125
0 ± 30 ppm/°C
1,000 M
F
or 100 G
-55 to +125
± 15%
1,000 M
or 10 G
F
+ 10 to +85
+22%,-56%
Table I
4
© KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
Urgent help!!! About the calculation of the inductance of the switching power supply transformer
I would like to ask the experts, I read in a book that the transformer inductance L = AL*N^2, is this formula applicable to all topologies? Is this also the calculation for push-pull transformers?Than...
sara9999 Switching Power Supply Study Group
Research on Simulation Source of Spaceborne Synthetic Aperture Radar Echo Signal
Abstract: This paper discusses a real-time implementation method of the simulation source of the echo signal of the spaceborne synthetic aperture radar (SAR) and the hardware design based on PCI bus a...
JasonYoo Test/Measurement
How to use S12XS128 to realize time-sharing detection of two sets of ultrasonic modules
How can I use a S12XS128 to realize the time-sharing detection of two sets of ultrasonic ranging modules (HC-SR04)? I installed two sets of ultrasonic ranging modules on the front of the smart car. Wh...
loosie NXP MCU
Drink some water before going to bed at midnight
Is everyone asleep? Good night!...
dai277530706 Talking
Samsung 2450sd card driver problem (sd card unplug and plug messages will appear when waking up from sleep mode)
I don't want the unplug and plug messages to happen when waking up from sleep mode. Has anyone solved this problem? Please give me some advice....
b4bz Embedded System
Problems with structures in EVC
If there is a structure in the header file: struct FvFixed { CString m_str; public: friend FvFixed const operator+(const FvFixed x, const FvFixed y); friend FvFixed const operator-(const FvFixed x, co...
seewei Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1155  1661  283  1635  531  24  34  6  33  11 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号