LEC-BT
SMARC
SMARC
®
Full Size Module with Intel
®
Atom™
Processor E3800 Series System-on-Chip
Features
Single, dual or quad-core Intel
®
Atom™ Processor
E3800 Series System-on-Chip
Up to 4 GB DDR3L at 1066/1333 MHz (ECC)
HDMI and LVDS
GbE, camera interface
1x SATA 3Gb/s, 1x USB 3.0, 3x USB 2.0,
max. 12x GPIO
Extreme Rugged™ operating temperature:
-40°C to 85°C
*LEC = Low Energy Computer-on-Module
Specifications
Core System
CPU
Intel Atom™ E3800 Series, single, dual or quad-core SoC
with integrated graphics
Atom™ E3845 (4C/1333), 1.91 GHz, Gfx 542/792 MHz
(Turbo), 10 W TDP
Atom™ E3826 (2C/1066), 1.46 GHz, Gfx 533/667 MHz
(Turbo), 7 W TDP
Atom™ E3815 (1C/1066), 1.46 GHz, Gfx 400/- MHz (No
Turbo), 5 W TDP
Memory
Up to 4 GB DDR3L at 1066/1333 MHz, memory down with
ECC
Alignment
AMI UEFI with CMOS backup in 8 MB SPI BIOS, Fast Boot
support
Cache
512 kB to 2 MB L2 cache
SEMA Board Controller Supports: Voltage/Current monitoring, Power Sequencing,
Logistics and Forensic Information, Flat Panel Control, I²C
Bus Control, GPIO Control, User Flash, Failsafe BIOS (dual
BIOS), Watchdog Timer and Fan Control
®
I/O Interfaces
PCIe
USB
SATA
eMMC
SDIO
GPIO
Camera
Serial
3x PCIe x1 Gen2
1x USB 3.0 + 3x USB 2.0
1x SATA 3 Gb/s
Soldered, bootable eMMC flash storage from 4 to 64 GB
(optional)
1x SDIO (4-bit)
12x GPIO, 5x used for camera, 7x available
CSI 4L/1L
2x SPI, 2x I
2
C, 1x I
2
S, Power Management, 2x UART
Power
Standard Input
Power States
3.0 V ~ 5.25 V DC ±5%
Supports C0-C6, S0, S3, S4, S5
Mechanical and Environmental
Form Factor
SMARC Specification v1.0
Dimensions
SMARC full size module, 82 mm x 80 mm
Operating Temperature Standard: 0°C to +60°C
Extreme Rugged™: -40°C to +85°C
Humidity
5-90% RH operating, non-condensing
5-95% RH storage (and operating with conformal coating)
Shock and Vibration
IEC 60068-2-64 and IEC-60068-2-27
MIL-STD-202F, Method 213B, Table 213-I, Condition A and
Method 214A, Table 214-I, Condition D
HALT
Thermal Stress, Vibration Stress, Thermal Shock and
Combined Test
Video
GPU Feature Support
7th generation Intel
®
graphics core architecture with four
execution units, supports two independent displays
2D and 3D graphics hardware acceleration
Support for DirectX 11.1, OGLES 2.0, OGL 3.2
Video decode HW acceleration for H.264, MPEG2, VC1, VP8
formats
Video encode HW acceleration for H.264, MPEG2 formats
Single channel 18/24-bit LVDS from DDI0
HDMI 1.4a from DDI1
LVDS
HDMI
Audio
Chipset
Ports
Intel
®
HD Audio integrated in SOC
I
2
S and HDA for audio codec on carrier
Operating Systems
Linux, VxWorks, Windows 7/8, Windows Embedded
Compact 7
Extended Support (BSP) QNX, Android
Standard Support
Ethernet
Intel
®
MAC/PHY
Interface
1x Intel
®
i210IT Ethernet controller
10/100/1000 GbE
http://www.adlinktech.com/Computer-on-Module
Functional Diagram
LVDS 18/ 24-bit
single
LVDS
RTD2136
DDIO
DDR3L
1066/ 1333MHz
DDI1 (HDMI)
Audio (HDA and I
2
S )
2x I
2
C(LCD/GP)
12x GPIO
(5x reserved for CSI)
SM Bus
GPIO
PCA9535A
Memory
down
2/ 4 GB ECC
DDR3L
INT
GbE
314-pin Golden finger
LAN
i210IT
PCIe x1
PCIe x1, PCIe port 1, 2, 3
eM M C
(Option)
PMIC
IDTP9145
MMC
Camera Support (CSI 4L/1L)
2x Serial (incl. RTS/CTS)+PCU-UART
USB 2.0, ports 0,1,2
USB 3.0 on AFB
SATA0
SDIO x4
Power Management
Boot Select
2x I
2
C
SMB
Intel
®
Bay Trail
SoC
LPC
Debug
Connector
for DB40
BMC
HWM
SPI
BIOS
2x SPI
Ordering Information
Modules
Model Number
LEC-BT4-4G-8G-ER
Description/Configuration
SMARC
®
Full Size Module with Intel
®
Atom™ E3845,
quad core, 4 GB DDR3L, 8 GB eMMC, Extreme Rugged™
operating temperature: -40°C to +85°C
SMARC
®
Full Size Module with Intel
®
Atom™ E3826, dual
core, 2 GB DDR3L, 8 GB eMMC, Extreme Rugged™
operating temperature: -40°C to +85°C
LEC-BT1-2G-8G-ER
SMARC
®
Full Size Module with Intel
®
Atom™ E3815, single
core, 2 GB DDR3L, 8 GB eMMC, Extreme Rugged™
operating temperature: -40°C to +85°C
Heatspreader for LEC-BTS
LEC-BT2-2G-8G-ER
LEC-BT-HS
Note: All specifications are subject to change without further notice.