cExpress-BT2
Type 2
COM Express
®
Compact Size Type 2 Module with
Intel
®
Atom™ or Celeron
®
Processor System-on-Chip
Features
Single, dual, Quad-core Intel
®
Atom™ or
Celeron
®
Processor System-on-Chip
Up to 8GB Dual Channel DDR3L at 1333MHz
VGA and dual channel 18/24-bit LVDS
Two PCIe x1, and 32-bit PCI bus
GbE, one SATA 3Gb/s, one PATA IDE, eight USB 2.0
Supports Smart Embedded Management
Agent (SEMA) functions
Extreme Rugged™ operating temperature:
-40°C to +85°C (optional)
Specifications
Core System
CPU
Single, Dual, Quad-Core Intel
®
Atom™ or Celeron
®
Processor
Atom™ E3845 1.91 GHz 542/792 Gfx (Turbo) 10W (4C/1333)
Atom™ E3827 1.75 GHz 542/792 Gfx (Turbo) 8W (2C/1333)
Atom™ E3826 1.46 GHz 533/667 Gfx (Turbo) 7W (2C/1066)
Atom™ E3825 1.33 GHz 533 Gfx (No Turbo) 6W (2C/1066)
Atom™ E3815 1.46 GHz 400 Gfx (No Turbo) 5W (1C/1066)
Celeron
®
N2920 1.6 GHz, 400/756 Gfx (Turbo) 7.5W (4C/1066)
Celeron
®
J1900 2 GHz, 688/792 Gfx (Turbo) 10W (4C/1333)
Supports: Single, Dual or Quad Out-of-Order Execution
(OOE) processor cores, Intel
®
VT-x, Intel
®
SSE4.1 and
SSE4.2, Intel
®
64 architecture, IA 32-bit , PCLMULQDQ
Instruction DRNG, Intel
®
Thermal Monitor (TM1 & TM2)
Note: Availability of the features may vary between processor SKUs.
Ethernet
Intel
®
MAC/PHY
Interface
Intel
®
i210 (MAC/PHY) Ethernet controller
10/100/1000 GbE connection
I/O Interfaces
USB
SATA
PATA
eMMC
SDIO
GPIO
4x USB 1.1/2.0 (USB 0,1,2,3) and 4x USB 2.0 only (USB 4,5,6,7)
One SATA 3 Gb/s ports (optionally 2 ports: lose PATA)
Single PATA IDE (Master only) through Jmicron JM330 SATA
to PATA
Optional soldered on module bootable eMMC flash storage
8 to 64 GB
On module mini SD card socket
4 GPO and 4 GPI with interrupt
Dual channel non-ECC 1333/1066 MHz DDR3L memory up
to 8GB in dual stacked SODIMM sockets
Embedded BIOS
AMI EFI with CMOS backup in 8MB SPI BIOS
Cache
Primary 32 KB, 8-way L1 instruction cache and 24 KB, 6-way
L1 write-back data cache
2MB for E3845, N2920 and J1900
1MB for E3827, E3826 and E3825
512K for E3815
Expansion Busses
2 PCI Express x1 Gen 2 (AB): lanes 0/1
PCI Bus 33 MHz Rev. 2.3
LPC bus, SMBus (system) , I
2
C (user)
SEMA Board Controller Supports: Voltage/Current monitoring, Power sequence
debug support, AT/ATX mode control, Logistics and Forensic
information, Flat Panel Control, General Purpose I
2
C, Failsafe
BIOS (dual BIOS), Watchdog Timer and Fan Control
Debug Headers
40-pin multipurpose flat cable connector
Use in combination with DB-40 debug module
providing BIOS POST code LED, BMC access, SPI BIOS
flashing, power test points, debug LEDs
60-pin XDP header for ICE debug of CPU/chipset
Memory
Super I/O
On carrier if needed (standard support for W83627DHG-P)
TPM
Chipset
Type
Atmel AT97SC3204
TPM 1.2
Power
Standard Input
Wide Input
Management
Power States
ECO mode
ATX = 12V±5% / 5Vsb ±5% or AT = 12V±5%
ATX = 5~20 V / 5Vsb ±5% or AT = 5 ~20V
ACPI 4.0 compliant, Smart Battery support
C0, C1, C1E, C4, C6 S0, S3, S4, S5 (Wake on USB S3/S4,
WOL S3/S4/S5
Supports deep S5 (ECO mode) for power saving
Mechanical and Environmental
Specification
PICMG COM.0: Rev 2.1 Type 2
Form Factor
Compact size: 95 mm x 95 mm
Operating Temperature Standard: 0°C to +60°C
Extreme Rugged™: -40°C to +85°C (optional)
Humidity
5-90% RH operating, non-condensing
5-95% RH storage (and operating with conformal coating)
Shock and Vibration
IEC 60068-2-64 and IEC-60068-2-27
MIL-STD-202F, Method 213B, Table 213-I, Condition A and
Method 214A, Table 214-I, Condition D
HALT
Thermal Stress, Vibration Stress, Thermal Shock and
Combined Test
Video
GPU Feature Support
7th generation Intel
®
graphics core architecture with four
execution units supporting two independent displays
3D graphics hardware acceleration
Supports for DirectX 11, OCL 1.1, OGL ES Halt/2.0/1.1, OGL 3.2
Video decode hardware acceleration including support for
H.264, MPEG2, MVC, VC-1, WMV9 and VP8 formats
Video encode hardware acceleration including support for
H.264, MPEG2 and MVC formats
Analog VGA supporting resolutions of up to
2560 x 1600 x 24bpp @60
Single/dual channel 18/24-bit LVDS from eDP (two lanes)
VGA
LVDS
Operating Systems
Standard Support
Windows 7/8 32/64-bit, Linux 32/64-bit
Extended Support (BSP) WES7/8, WEC7/8, Linux , VxWorks
Audio
Chipset
Audio Codec
Intel
®
HD Audio integrated in SOC
Located on carrier Express-BASE
http://www.adlinktech.com/Computer-on-Module
Functional Diagram
SODIMM
1~4 GB DDR3L
non ECC
Analog VGA
Intel® Atom™
LVDS
eDP to LVDS
RTD2136R
DDI1
eDP 2 lanes
SODIMM
1~4 GB DDR3L
non ECC
4x USB v1.1/2.0 (port 0~3)
3x USB HSIC HUB (port 4-6)
E3845
E3827
E3826
E3825
E3815
Intel® Celeron®
N2920
J1900
1x SATA
(port 1)
SATA to
PATA
JM330
2 PCIe x1 GEN2
(port 0,1)
GbE
i210
PCIe x1 Gen2
(port 3)
PCIe x1
(port 2)
“Bay Trail”
PCIe to
PCI
TI
XIO2001
AB
1x SATA2
(port 1)
1x SATA
(port 0)
XDP
60-pin
eMMC
8~64GB
HD Audio
Mini SD
Socket
TPM
Atmel
AT97SC3204
LPC bus
4x GP0
4x GPI
SMBus
GP I
2
C
DDC I
2
C
SPI_CS#
SPI 0
BIOS
SPI 1
BIOS
LM73
System
LM73
CPU
GPIO
PCA9535BS
SPI_CS0
SEMA
BMC
SPI
Ordering Information
Modules
Model Number
cExpress-BT2-E3815
cExpress-BT2-E3825
cExpress-BT2-E3826
cExpress-BT2-E3827
cExpress-BT2-E3845
cExpress-BT2-J1900
cExpress-BT2-N2920
Accessories
Description/Configuration
COM Express
®
Compact Size Type 2 Module with Intel
®
Atom™ E3815 at 1.46 GHz
COM Express
®
Compact Size Type 2 Module with Intel
®
Atom™ E3825 at 1.33 GHz
COM Express
®
Compact Size Type 2 Module with Intel
®
Atom™ E3826 at 1.46 GHz
COM Express
®
Compact Size Type 2 Module with Intel
®
Atom™ E3827 at 1.75 GHz
COM Express
®
Compact Size Type 2 Module with Intel
®
Atom™ E3845 at 1.91 GHz
COM Express
®
Compact Size Type 2 Module with Intel
®
Celeron
®
J1900 at 2.00 GHz
COM Express
®
Compact Size Type 2 Module with Intel
®
Celeron
®
N2920 at 1.6 GHz
Model Number
Heat Spreaders
HTS-cBT2-B
HTS-cBT2-BT
Passive Heatsinks
THS-cBT2-B
THS-cBT2-BT
THSH-cBT2-B
Active Heatsink
THSF-cBT2-B
Description/Configuration
Heatspreader for cExpress-BT2 with threaded standoffs for
bottom mounting
Heatspreader for cExpress-BT2 with through hole
standoffs for top mounting
Low profile heatsink for cExpress-BT2 with threaded
standoffs for bottom mounting
Low profile heatsink for cExpress-BT2 with through hole
standoffs for top mounting
High profile heatsink for cExpress-BT2 with threaded
standoffs for bottom mounting
High profile heatsink with Fan for cExpress-BT2 with
threaded standoffs for bottom mounting (-40°C to +85°C
operation)
Note: All specifications are subject to change without further notice.
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