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Global Connector Technology Ltd. - BG046: 2.54mm PITCH SHROUDED HEADER, DUAL ROW, THROUGH HOLE, VERTICAL
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SPECIFICATIONS
规格
CURRENT RATING
电流额定值
: 3 AMP
INSULATOR RESISTANCE
绝缘电阻值
: 1000 MΩ Min.
CONTACT RESISTANCE
接触电阻值
: 20mΩ Max.
DIELECTRIC WITHSTANDING
耐电压
: AC 600 V
OPERATING TEMPERATURE
工½温度
: -40°C TO +105°C
CONTACT MATERIAL
端子物料
: COPPER ALLOY
INSULATOR MATERIAL
绝缘½物料
:
STANDARD
标准物料
: POLYAMIDE
聚醯胺
, NYLON 6T, UL 94-V0
OPTIONS
可选物料
: POLYESTER
聚酯
, LCP, UL 94-V0
OR POLYESTER
聚酯
, PBT, UL94-V0
SOLDERING PROCESS
可焊性
:
NYLON 6T (STANDARD
标准物料
) -
IR REFLOW
回流焊
: 260°C for 10 sec.
WAVE
波峰焊
: 230°C for 5-10 sec.
MANUAL SOLDER
人工焊接
: 350°C for 3-5 sec
PBT (OPTION
可选物料
) - MANUAL SOLDER
人工焊接
: 330°C for 3-5 sec.
(NOT SUITABLE FOR HI-TEMP PROCESS
不适合高温处理
)
LCP (OPTION
可选物料
) -
IR REFLOW
回流焊
: 260°C for 10 sec.
WAVE
波峰焊
: 250°C for 5-10 sec.
MANUAL SOLDER
人工焊接
: 350°C for 3-5 sec
MATES WITH
配套之母座
(SUBJECT TO PIN LENGTH
在端子长度适合的条件下
):
BG215
BG216 - Allowing perfect polarisation
- Non-Polarised mating connections available - contact GCT for details
By
DETAIL
REV
DATE
BC
DRAWING
RELEASE
A
05/04/07
ASE
PCN:
BG046-001
E
Ordering Grid
BG046
XX
X
XXXX
X
X
Packing Options
H = Tray
(Standard)
D = Tube
(not available for 6 & 8 contact versions)
F
F
No. of Contacts
06 to 64
A = Gold Flash All Over
(Standard)
B = Selective Gold Flash Contact Area/
Tin On Tail
C = Tin All Over
G = 10µ" Gold Contact Area/Tin On Tail
I = 30µ" Gold Contact Area/Tin On Tail
Insulator Material
N = Nylon 6T
(Standard)
P = PBT
L = LCP
Dimension C
(1/100mm)
(Tail Length)
0300 = 3.00mm
(Standard)
Or specify Dimension C
eg 0250 = 2.50mm
G
G
Tolerances
(Except as noted)
Part Number:-
Date:-
Dimensions in mm
X.°±5°
.X°±2°
X.X ± 0.20
X.XX ± 0.15 .XX°±1°
X.XXX ± 0.10 .XXX°±0.5°
X. ± 0.30
Third Angle Projection
BG046
Description:-
05 APR 07
H
ASE
PCN:
BG046-002
2.54mm PITCH SHROUDED HEADER, DUAL ROW,
THROUGH HOLE, VERTICAL
GC
Scale
NTS
H
Sheet No.
E & OE
1/1
www.gct.co
Drawn by
BC
B
18/05/11
C
30/03/12
C
THIS DRAWING IS CONFIDENTIAL AND MUST NOT BE
COPIED OR DISCLOSED WITHOUT WRITTEN CONSENT
Revision
C
Material
See Note
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FPGA/CPLD
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