EEWORLDEEWORLDEEWORLD

Part Number

Search
 PDF

B32923C3105K789

Description
Film Capacitor, Polypropylene, 630V, 10% +Tol, 10% -Tol, 1uF, Through Hole Mount, RADIAL LEADED, LEAD FREE
CategoryPassive components    capacitor   
File Size309KB,18 Pages
ManufacturerEPCOS (TDK)
Environmental Compliance
Download Datasheet Parametric View All

B32923C3105K789 Overview

Film Capacitor, Polypropylene, 630V, 10% +Tol, 10% -Tol, 1uF, Through Hole Mount, RADIAL LEADED, LEAD FREE

B32923C3105K789 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid1744634738
package instruction,
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresRATED AC VOLTAGE (V): 305; REFERENCE STANDARD: IEC60384-14, SAFETY CLASS X2
capacitance1 µF
Capacitor typeFILM CAPACITOR
Custom functionsOther Lead Lengths Available On Request
dielectric materialsPOLYPROPYLENE
high20.5 mm
JESD-609 codee3
length26.5 mm
Manufacturer's serial numberB32923
Installation featuresTHROUGH HOLE MOUNT
negative tolerance10%
Number of terminals2
Maximum operating temperature105 °C
Minimum operating temperature-40 °C
Package shapeRECTANGULAR PACKAGE
Package formRadial
method of packingAMMO PACK
positive tolerance10%
Rated (AC) voltage (URac)305 V
Rated (DC) voltage (URdc)630 V
seriesB32923C/D(K TOL)
surface mountNO
Terminal surfaceMatte Tin (Sn)
Terminal pitch22.5 mm
Terminal shapeWIRE
width11 mm
Friendly Arm mini6410 and tiny6410 videos have been published, come and download them!!!
115 network disk download, the address is in the pdf document, I downloaded it from the group sharing... Free download welcome...
37°男人 Embedded System
【Fully handmade】Automatic gain amplifier design and production
, 255, 255)][font=Tahoma, Helvetica, SimSun, sans-serif][size=4]First of all, let me introduce myself. Since I entered the forum, I am the kind of lurker who only pays attention but does not comment. ...
RF-刘海石 RF/Wirelessly
Question about the corresponding components of the required functions in Windows XP Embedded
As we all know, there are 11,000 components in Windows, but when making XPE, most of the components are not needed. I wonder if you have ever encountered a situation where you want some functions in W...
qiaogang Embedded System
Analysis of build.prop generation process of Android properties
[p=26, null, left][color=#000][font=Arial][color=#ca00][url=http://blog.csdn.net/thl789/]Tian Haili[/url][/color][/font][/color][/p][p=26, null, left][color=#000][font=Arial]2011-11-26[/font][/color][...
Wince.Android Linux and Android
Getting Started with AVR
Does anyone have good video learning materials?...
无泪的哭泣 Microchip MCU
Internal Hardware Resources of PIC 16F84 Microcontroller (Part 2)
3 Data memory   In the PIC16F84 microcontroller, in addition to the program memory for storing programs, there is also a data memory. When executing a program, the microcontroller often needs to input...
rain Microchip MCU

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1536  2214  2549  696  1501  31  45  52  15  13 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号