LBEE5ZSTNC-523-D datasheet, PDF

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LBEE5ZSTNC-523-D: Descriptionwifi / 802.11 development tools com6m board for type TN wireless module; CategoryDevelopment board/suite/development tools; File Size164KB，2 Pages; ManufacturerMurata; Websitehttps://www.murata.com; Environmental Compliance

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LBEE5ZSTNC-523-D Overview

wifi / 802.11 development tools com6m board for type TN wireless module

LBEE5ZSTNC-523-D Parametric

Parameter Name	Attribute value
Manufacture	Mu
Product Category	WiFi / 802.11 Development Tools
RoHS	Yes
Produc	Development Boards
Tool Is For Evaluation Of	LBEE5ZSTNC-523
Protocol Supported	802.11 b/g/n, Bluetooth
Frequency	2.4 GHz
Interface Type	Wireless
Operating Supply Voltage	2.7 V to 4.3 V
Antenna Connector Type	U.FL
Description/Functi	Com6M Card is a wireless connectivity card based on Murata's type TN module and Texas Instruments WL1271L chipse
Dimensions	36.36 mm x 25.43 mm x 1.6 mm
For Use With	TI AM335x EVM
Maximum Operating Temperature	+ 70 C
Minimum Operating Temperature	- 20 C
Packaging	Bulk
Factory Pack Quantity	100

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Com6M Card – WiFi / BT / BLE

Part Number: LBEE5ZSTNC-523-D

Description

The Com6M Card

is a wireless connectivity card based on

Murata’s type TN module and Texas Instruments WL1271L

chipset. Com6M provides IEEE802.11 b/g/n wireless LAN,

Bluetooth v3, including Bluetooth low energy (BLE)

connectivity. The card interfaces directly to

several Texas

Instruments OMAP

, SITARA

, DaVinci

, and Integra

processors facilitating faster customer design cycles.

Com6M

includes FCC wireless certification further speeding the

customer design cycle.

On card major components include the Murata type TN

module, fast clock, U.FL connector, switch connector and chip

antenna. Within the Murata type TN module is the

WL1271L chipset, DC-DC converter, and the RF front end

integrated circuit. The Com6M card interfaces to the

Samtec MEC6-150-02, 100 position edge socket.

Com6M’s purpose is a convenient plug-in wireless

connectivity solution for microprocessor development

platforms. Developers begin product development with a

pre-integrated platform enabling application development to

begin earlier in the cycle. This approach enables faster

time-to-market. The customer eventually transitions from

the development platform to the target form factor. The

Murata type TN module will then typically reside on the

customer’s host board to optimize performance, cost, and

area for mass production.

Characteristics

Chipset

Module

Supply voltage

Interface voltage

Operating

Temperature

Dimensions

Package

Wireless

Interfaces

Socket interface

WL1271L

Type TN

2.7 to 4.3 Vdc for VBAT

1.8 for VIO

-20 to +70 deg C

36.36 x 25.43 x 1.6 mm

Card form factor

On card chip antenna

On card switch connector

On module U.FL connector

Samtec MEC6-150-02

Note:

Murata Inc. reserves the right to make changes in specifications at anytime and without notice.

No license is generated under any rights of Murata or its supporters unless specifically agreed.

The information furnished in this product brief is believed to be

accurate and reliable. However, no responsibility is assumed by Murata for its use, nor any infringements of patents or other rights of third parties resulting from its use.

www.murata-ws.com

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