EEWORLDEEWORLDEEWORLD

Part Number

Search

4310T-106-1061DC

Description
Array/Network Resistor, Divider, Thin Film, 1.25W, 50V, 0.5% +/-Tol, 25ppm/Cel, Through Hole Mount, SIP
CategoryPassive components    The resistor   
File Size198KB,2 Pages
ManufacturerBourns
Websitehttp://www.bourns.com
Related ProductsFound1parts with similar functions to 4310T-106-1061DC
Download Datasheet Parametric View All

4310T-106-1061DC Overview

Array/Network Resistor, Divider, Thin Film, 1.25W, 50V, 0.5% +/-Tol, 25ppm/Cel, Through Hole Mount, SIP

4310T-106-1061DC Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerBourns
package instruction,
Reach Compliance Code_compli
ECCN codeEAR99
Component power consumption0.1 W
The first element resistor1060 Ω
JESD-609 codee0
Manufacturer's serial number4300T
Installation featuresTHROUGH HOLE MOUNT
Network TypeDIVIDER
Number of components9
Number of functions1
Number of terminals10
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
Rated power dissipation(P)1.25 W
Rated temperature70 °C
Resistor typeARRAY/NETWORK RESISTOR
Second/last element resistor100000 Ω
surface mountNO
technologyTHIN FILM
Temperature Coefficient25 ppm/°C
Temperature coefficient tracking5 ppm/°C
Terminal surfaceTin/Lead (Sn/Pb)
Terminal shapeFLAT
Tolerance0.5%
Operating Voltage50 V
Base Number Matches1
oH
VE S CO
AV R M
AI SIO PL
LA N IA
BL S NT
E
Features
RoHS compliant* (see How to Order
“Termination” option)
Low profile provides compatibility with
DIPs
Also available in medium profile (4300S -
.250 ”) and high profile (4300K - .350 ”)
Marking on contrasting background
Custom circuits available per factory
*R
4300T, S, K Series - Thin Film Molded SIP
Product Characteristics
Resistance Range
Bussed ...................49.9 to 100K ohms
Isolated ......................20 to 200K ohms
Series.........................20 to 100K ohms
Resistance Tolerance
.........................±0.1 %, ±0.5 %, ±1 %
Temperature Coefficient
..................±100 ppm/°C, ±50 ppm/°C,
±25 ppm/°C
Temperature Range ....-55 °C to +125 °C
Insulation Resistance
..................10,000 megohms minimum
TCR Tracking .........................±5 ppm/°C
Maximum Operating Voltage............50 V
Environmental Characteristics
Thermal Shock and
Power Conditioning ...................... 0.1 %
Short Time Overload ..................... 0.1 %
Terminal Strength ........................ 0.25 %
Resistance to Soldering Heat ....... 0.1 %
Moisture Resistance ..................... 0.1 %
Life .............................................. 0.50 %
Physical Characteristics
Body Material Flammability
...........................Conforms to UL94V-0
Lead Frame Material
..........................Copper, solder coated
Body Material ..................Novolac epoxy
How To Order
Package Power Temp. Derating Curve
(Low Profile, 4300T)
(
)
1.75
1.50
4311T
WATTS
1.25
1.00
.75
.50
.25
4310T
4309T
4308T
4306T
Product Dimensions
27.53
MAX.
(1.084)
22.45
MAX.
(.884)
14.83 MAX.
(.584)
24.99
MAX.
(.984)
19.92
MAX.
(.784)
PIN #1 REF.
4.95
(.195)
MAX.
.381 + .127/ - .000
(.015 + .005/ - 000)
2.54
±
.07
(.100
±
.003*)
TYP.
NON-ACCUM.
3.43 + .38/ - .25
(.135 + .015/ - .010)
1.02
±
.12
(.040
±
.005)
.483
±
.050
TYP.
(.020
±
.002)
2.16
±
.10
(.085
±
.004)
25
70
150
125
AMBIENT TEMPERATURE (
°
C )
0
Package Power Ratings at 70°C
T
S
K
4304 .......... ............ 0.60...... 0.80 watts
4306 ...... 0.75.......... 0.90...... 1.20 watts
4308 ...... 1.00.......... 1.20...... 1.60 watts
4309 ...... 1.13 ................................watts
4310 ...... 1.25.......... 1.50...... 2.00 watts
4311 ...... 1.38 ................................watts
1.02
±
.05
(.0425
±
.002)
.254
±
.050
(.010
±
.002)
Governing dimensions are in metric. Dimensions in parentheses
are inches and are approximate.
*Terminal centerline to centerline measurements made at point of
emergence of the lead from the body.
43 11 T - 101 - 2222 F A B __
Model
(43 = Molded SIP)
Number of Pins
Physical Config.
•T = Low Profile Thin Film
•S = Med. Profile Thin Film
•K = High Profile Thin Film
Electrical Configuration
•101 = Bussed
•102 = Isolated
•106 = Series
Resistance Code
•First 3 digits are significant
•Fourth digit represents the
number of zeros to follow.
Absolute Tolerance Code
•B = ±0.1%
•F = ±1%
•D = ±0.5%
Temperature Coefficient Code
•A = ±100ppm/°C •C = ±25ppm/°C
•B = ±50ppm/°C
Ratio Tolerance (Optional)
•A = ±0.05% to R1 •D = ±0.5% to R1
•B = ±0.1% to R1
Terminations
• L = Tin-plated (RoHS compliant version)
• Blank = Tin/Lead-plated
Consult factory for other available options.
Typical Part Marking
Represents total content. Layout may vary.
PART
NUMBER
4311T-101-
1003BB
YYWW
CIRCUIT
RESISTANCE
CODE
DATE CODE
PIN ONE
INDICATOR
MANUFACTURER'S
TRADEMARK
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.

4310T-106-1061DC Similar Products

Part Number Manufacturer Description
4310T-106-1061DCL Bourns Array/Network Resistor, Divider, Thin Film, 1.25W, 50V, 0.5% +/-Tol, 25ppm/Cel, Through Hole Mount, SIP, ROHS COMPLIANT
Problems with arm linux transplantation
I wrote a driver for a custom USB device under Fedora8, and it has been verified to be fine. Now I am porting it to arm linux. After cross-compiling the driver, it can be successfully insmoded to the ...
梦里飘 Linux and Android
Why does the compilation fail when embedding the BRA instruction in CCS?
The embedded BRA instruction is as follows, the purpose is to force a jump to the address 0x20266 to execute __asm("BRA #20266");...
darkduck Microcontroller MCU
How to prepare for a software engineering interview
Posted by: Wang Xin, Google Engineer (Author Profile: Wang Xin, Google Engineer. Born in Beijing, moved to the United States with his parents when he was five years old. He skipped three grades in mid...
maker Talking about work
Question + Is there any TI power chip that can boost the voltage to more than 250V? It is powered by old-fashioned tubes.
Does TI power chip have the ability to boost voltage to above 250v? It uses old-style tubes for power supply. This makes development easier. Other chips are not efficient and generate a lot of heat. D...
fxw451 Analogue and Mixed Signal
Siemens Professional Glossary Chinese-English Comparison Table
Still a very good place!...
skey_ph Industrial Control Electronics
Does anyone have any literature on the principles of PMSM?
Where do you find materials for studying PMSM?...
安_然 DSP and ARM Processors

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 346  2598  721  1771  1956  7  53  15  36  40 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号