Ultra-Small, Ultra-Low Power MEMS Oscillator with Spread Spectrum
Features
• Output Frequency: 1 MHz to 100 MHz LVCMOS
• Spread Spectrum Options:
- Center-Spread: ±0.25%, ±0.5%, ±1.0%,
±1.5%, ±2.0%, ±2.5%
- Down-Spread: –0.25%, –0.5%, –1.0%,
–1.5%, –2.0%, –3.0%
• Ultra-Low Power Consumption: 3 mA (Active),
1
A (Standby)
• Wide Supply Voltage Range: 1.71V ~ 3.63V V
DD
• Ultra-Small Package Sizes:
- 1.6 mm
1.2 mm
- 2.0 mm
1.6 mm
- 2.5 mm
2.0 mm
• Wide Temperature Range:
- Automotive: –40°C to +125°C
- Ext. Industrial: –40°C to +105°C
- Industrial: –40°C to +85°C
- Ext. Commercial: –20°C to +70°C
• Excellent Shock and Vibration Immunity
- Qualified to MIL-STD-883
• High Reliability
- 20x Better MTBF than Quartz Oscillators
• Lead Free and RoHS Compliant
• Automotive AEC-Q100 Option Available
General Description
The DSC63xxB family of devices is the industry’s
smallest and lowest-power spread-spectrum MEMS
oscillators. Available in three different package sizes
with operating current as low as 3 mA, the smallest
4-pin package is a mere 1.6 mm x 1.2 mm in size. The
devices support up to ±2.5% or –3% spread spectrum
that can achieve up to 15 dB electromagnetic
interference (EMI) reduction. Because of industry
standard package and pin options, customers can
solve last minute EMI problems simply by placing the
new DSC63xxB on their current board layout with no
redesign required.
The DSC63xxB family is available in 1.6 mm x 1.2 mm
and 2.0 mm x 1.6 mm, and 2.5 mm x 2.0 mm
packages. These packages are “drop-in” replacements
for standard 4-pin CMOS quartz crystal oscillators.
Package Types
DSC63
XX
B
2.5 mm x 2.0 mm VLGA
2.0 mm x 1.6 mm VFLGA
1.6 mm x 1.2 mm VFLGA
(Top View)
OE/STDBY/SSEN
1
4
VDD
Applications
•
•
•
•
Flat Panel Display/Monitor
Multi-Function Printer
Digital Signage
Consumer Electronics
GND
2
3
OUT
2019 Microchip Technology Inc.
DS20006154A-page 1
DSC63XXB
Block Diagram
DSC63
XX
B
DIGITAL
CONTROL
OE/STDBY/SSEN
PIN 1
SST
MEMS
RESONATOR
TEMP SENSOR
CONTROL &
COMPENSATION
PLL
VCO
SUPPLY
REGULATION
VDD
PIN 4
OUTPUT
DIVIDER
DRIVER
OUTPUT
PIN 3
GND
PIN 2
DS20006154A-page 2
2019 Microchip Technology Inc.
DSC63XXB
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
Supply Voltage .......................................................................................................................................... –0.3V to +4.0V
Input Voltage (V
IN
) ..............................................................................................................................–0.3V to V
How accurate is the delay of _delay_ms()? If we use the counter TNCT0 to count, the initial value of TNCT0 is 55, and it overflows after jumping to 255, and select the clock source with 8 division, F_...
This article and design code were written by FPGA enthusiast Xiao Meige. Without the author's permission, this article is only allowed to be copied and reproduced on online forums, and the original au...
6638 Write a serial port program that sends a "query" to the microcontroller through the assistant and then returns the "answer" to the computer. It was written in interrupts, but it has not been comp...
This time, I applied for 3 samples: INA300AIDSQT, ATL431AQDBZR, MSP430FR4133IPMR. Order date: 8/5/2015 8:56 PM, sample received date: 8/7/2015. From review to delivery to receipt, it took exactly 48 h...
There are many different ways of human-computer interaction. The more common ones are listed below:
Mouse interaction: Using a mouse to operate a computer and interact was the most common human...[Details]
Flip-chip and ball grid array (BGA) are two widely used packaging technologies in the electronics industry. Each has its own advantages and limitations, and in some cases, they can complement each ...[Details]
Is pure electric vehicles a false proposition for long-distance driving? At least from my personal perspective, based on current technological and infrastructure standards, I believe so. Below, I'l...[Details]
The most significant feature of IPS panels is that both electrodes are located on the same surface, unlike other LCD panels, which have electrodes arranged on top and bottom surfaces in a three-dim...[Details]
Topics: Bring Your Own Device (BYOD) trends; the impact of using employees' own mobile devices to control access to work facilities and equipment on information security; and ways to securely imple...[Details]
Limited vocabulary recognition
According to the number of characters, words or short sentences in the vocabulary, it can be roughly divided into: less than 100 is small vocabulary; 100-1000 is...[Details]
Recently,
Xpeng Motors and Xinlian Integrated Circuit jointly announced the mass production of China's first hybrid silicon carbide product.
Designed and developed by Xpeng Motors and joint...[Details]
On August 22nd, Lantu Motors unveiled a new technology called "Lanhai Intelligent Hybrid" during a live broadcast of CCTV News' "Top Laboratory." The name sounds like another new term, but a closer...[Details]
According to foreign media reports, BMW has just been granted a patent for a screen that could cover the entire roof. BMW hopes to transform at least a portion of the vehicle's headliner into a dis...[Details]
As the scale and business applications of national e-government networks continue to expand, the data and services transmitted over them are becoming increasingly sensitive and critical. To protect...[Details]
One of the most core components of electric vehicles is the motor. The power supply provides electrical energy to the motor, which converts this electrical energy into mechanical energy, which in t...[Details]
Normally, we determine our location and where we want to go by comparing our surroundings with observation and simple GPS tools. However, this kind of reasoning is very difficult for self-driving c...[Details]
SMT placement machines are important equipment in surface mount technology (Surface Mount Technology). Their performance has a decisive impact on the quality and efficiency of electronic manufactur...[Details]
Reflow soldering is one of the most commonly used methods in electronics manufacturing, allowing for the soldering of large numbers of components in a relatively short time. However, any experience...[Details]
The 2025 China International Automotive Testing Exhibition will be held at the Shanghai World Expo Exhibition and Convention Center from August 27 to 29, 2025.
Clacton Seafront, UK, ...[Details]