EEWORLDEEWORLDEEWORLD

Part Number

Search

DSC6352HL1JB-100.0000T

Description
LVCMOS Output Clock Oscillator, 100MHz Nom
CategoryPassive components    oscillator   
File Size780KB,26 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Download Datasheet Parametric View All

DSC6352HL1JB-100.0000T Overview

LVCMOS Output Clock Oscillator, 100MHz Nom

DSC6352HL1JB-100.0000T Parametric

Parameter NameAttribute value
Objectid7271643470
Reach Compliance Codecompliant
Country Of OriginThailand
YTEOL6.63
Other featuresAEC-Q100; STANDBY; ENABLE/DISABLE FUNCTION; TR
maximum descent time1.5 ns
Frequency Adjustment - MechanicalNO
frequency stability50%
Installation featuresSURFACE MOUNT
Nominal operating frequency100 MHz
Maximum operating temperature105 °C
Minimum operating temperature-40 °C
Oscillator typeLVCMOS
Output load15 pF
physical size1.6mm x 1.2mm x 0.89mm
longest rise time1.5 ns
Maximum supply voltage3.63 V
Minimum supply voltage1.71 V
surface mountYES
maximum symmetry55/45 %
DSC63XXB
Ultra-Small, Ultra-Low Power MEMS Oscillator with Spread Spectrum
Features
• Output Frequency: 1 MHz to 100 MHz LVCMOS
• Spread Spectrum Options:
- Center-Spread: ±0.25%, ±0.5%, ±1.0%,
±1.5%, ±2.0%, ±2.5%
- Down-Spread: –0.25%, –0.5%, –1.0%,
–1.5%, –2.0%, –3.0%
• Ultra-Low Power Consumption: 3 mA (Active),
1
A (Standby)
• Wide Supply Voltage Range: 1.71V ~ 3.63V V
DD
• Ultra-Small Package Sizes:
- 1.6 mm
1.2 mm
- 2.0 mm
1.6 mm
- 2.5 mm
2.0 mm
• Wide Temperature Range:
- Automotive: –40°C to +125°C
- Ext. Industrial: –40°C to +105°C
- Industrial: –40°C to +85°C
- Ext. Commercial: –20°C to +70°C
• Excellent Shock and Vibration Immunity
- Qualified to MIL-STD-883
• High Reliability
- 20x Better MTBF than Quartz Oscillators
• Lead Free and RoHS Compliant
• Automotive AEC-Q100 Option Available
General Description
The DSC63xxB family of devices is the industry’s
smallest and lowest-power spread-spectrum MEMS
oscillators. Available in three different package sizes
with operating current as low as 3 mA, the smallest
4-pin package is a mere 1.6 mm x 1.2 mm in size. The
devices support up to ±2.5% or –3% spread spectrum
that can achieve up to 15 dB electromagnetic
interference (EMI) reduction. Because of industry
standard package and pin options, customers can
solve last minute EMI problems simply by placing the
new DSC63xxB on their current board layout with no
redesign required.
The DSC63xxB family is available in 1.6 mm x 1.2 mm
and 2.0 mm x 1.6 mm, and 2.5 mm x 2.0 mm
packages. These packages are “drop-in” replacements
for standard 4-pin CMOS quartz crystal oscillators.
Package Types
DSC63
XX
B
2.5 mm x 2.0 mm VLGA
2.0 mm x 1.6 mm VFLGA
1.6 mm x 1.2 mm VFLGA
(Top View)
OE/STDBY/SSEN
1
4
VDD
Applications
Flat Panel Display/Monitor
Multi-Function Printer
Digital Signage
Consumer Electronics
GND
2
3
OUT
2019 Microchip Technology Inc.
DS20006154A-page 1
CAMERA issue with 6410
I used 6410 naked LCD to enable WIN0 and can output 800*600 color bar signal normally. The address of my FRAMEBUFFER is 0X51000000. Later, I collected the camera signal and used PREVIEW PATH mode DMA ...
baobeidudu Embedded System
When the LSM6DS3TR-C is configured with the I2C address, the power consumption is high when the SA0 pin is connected to GND.
Hello everyone, when the LSM6DS3TR-C is configured in the I2C address, when the SA0 pin is connected to GND, there is a 10k pull-down resistor. The power consumption will increase by 0.5mA compared to...
lys909 MEMS sensors
Post a classic article on full bridge design
Post a classic article on full bridge design...
tonytong Power technology
Buying books.
Today I saw a senior selling books, and I bought 7 books, including "Principles of Automatic Control", "Electronic Measurement and Instrumentation", "Digital Signal Processing Tutorial", etc....
fghdzb Talking
Intel CEO denies rumors, says he is not considering IPO of flash memory chip business
[i=s]This post was last edited by jameswangsynnex on 2015-3-3 20:00[/i]...
rain Mobile and portable
Novice question: EVC3.0 and EVB programming issues under WINCE. Experts who have done EVC or EVB development please come in!
I would like to ask, in the WINCE environment, can all the functions that EVC can accomplish (such as being able to run on PDA, etc.) be completed by EVB under EVT? What is the difference between deve...
13692816588 Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1543  2398  2145  397  779  32  49  44  8  16 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号