www.fastrongroup.com
FASTRON wire wound chip inductors are designed particularly for RF applications that require optimal Q on high frequency circuits. Its gold flash pad metallization
provides better solderability for a higher yield in your production. In addition, their encapsulation not only protects the winding but also allows surface mount assembly.
It comes in compact sizes (from 0402 to 1812) available in reel packing. Inductance values between those listed in this catalog are mostly available on request. Ferrite
core versions are also available for selected case sizes for applications which require higher inductances in a smaller case size.
Chip Inductors for RF Applications / Medical Applications (Wire wound-open)
Applications
Used in LC resonant circuits such as oscillator and signal generators, impedance matching, RF filters etc.
Mobile Telecommunication: GSM, CDMA, TCDMA, cordless phones, 2 way radio
Automotive Subsystems: TPMS, Keyless Entry, Anti-Theft, GPS
Wireless Communication: W-LAN, WIFI, WIMAX, RFID, Bluetooth
Non-magnetic versions for medical imaging applications: ASM series
L – Value (rated inductance)
Q – Factor (min)
SRF (min)
DCR (max)
Operating Temperature
Surface Finishing
Pad Metallization
Wire Termination
Recommended soldering method
Moisture Sensitivity Levels (MSL)
Solderability
Resistance to Soldering Heat
Resistance to Solvent
Climatic Test
≥ 1 MHz measured with HP 4286A RF LCR meter at frequency f
L
< 1 MHz measured with Bode 100 Vector Network Analyzer at frequency f
L
≥ 1 MHz measured with HP 4287A RF LCR meter at frequency f
Q
< 1 MHz measured with Bode 100 Vector Network Analyzer at frequency f
Q
Measured with HP 8753ES Network Analyzer
Measured at 25°C
For ceramic core from -40°C to +150°C (Including component self-heating)
For ferrite core from -40°C to +85°C
Epoxy molded flat top for perfect pick and place assembly
Gold flash as top layer for AS, AQ, F & AF
Silver flash as top layer for ASM
Spot welding
Reflow
MSL Level 1, indicating unlimited floor life at ≤ 30°C / 85% relative humidity
Using lead free solder (Sn 99.9) at 260°C ± 5°C for 5 ± 0.5 seconds, min 90% solder coverage
of metallization
Standard: IEC 68-2-20 (Ta)
Resistant to 260°C ± 5°C for 10 ± 1 seconds
Standard: IEC 68-2-20 (Tb)
Resistant to Isopropyl alcohol for 5 ± 0.5 minutes at 23°C ± 5°C
Standard: IEC 68-2-45
Defined by the following standards
IEC 68-2-1 for Cold test: -55°C for 96 hours
IEC 68-2-2 for Dry heat test: +85°C for ferrite core and 125°C for ceramic core for 96 hours
IEC 60068-2-78 for Humidity test: 40°C at RH 95% for 4 days
Temperature cycle (ceramic) : -40°C to +125°C to -40°C
Temperature cycle (ferrite) : -40°C to +85°C to -40°C
Max/Min temperature duration: 15 minutes
Temperature transition duration: 5 minutes
Cycles: 25
Standard: MIL-STD-202G
Components withstand a pushing force of 10N for 10 ± 1 seconds
Standard: IEC 60068-2-21, method Ue
3
Mil-Std 202 Method 213, Condition C
3 axis, 6 times, total 18 shocks
100 G, 6 ms, half-sine
Mil-Std 202 Method 204
20 mins at 5G
10 Hz to 2000 Hz
12 cycles each of 3 orientations
Technical Data
Technical Data
Thermal Shock Test
Adhesion of Soldered Component
(Shear Test)
Mechanical Shock
Vibration
Ordering Code
Example:
0402AS-1N0X-YY
0402AS-1N0K-01
0402
AS
-
1N0
X
-
YY
(Case Size) (Core Type) (Inductance Value) (Tolerance) (Packing Code)
Case Sizes
Core Type
Tolerances
Packing Code
- 0402, 0603, 0805, 1008, 1206, 1210, 1812
- AS, AQ, ASM (Ceramic), F (Ferrite), AF (Ceramic & Ferrite)
- F (1%), G (2%), A (3%), J (5%), K (10%), M (20%)
- 01, 04, 08 (Taped / Reel)
Revision date : 25 May 2017
Analog electronics
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