1. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.1 Vrms, 0.0 Adc, +25 °C
2. I
rms
: DC current for an approximate temperature rise of 40 °C without core loss. Derating is necessary for AC currents.
PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the
temperature rise. It is recommended that the temperature of the part not exceed 125 °C under worst case operating
conditions verified in the end application.
3. I
sat
: Peak current for approximately 35% rolloff @ +25 °C
4. K-factor: K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L *
ΔI.
Bp-p: (mT), K:
(K-factor from table), L: (Inductance in μH),
ΔI
(Peak to peak ripple current in Amps)..
5. Part Number Definition: DR1030-xxx-R
DR1030 = Product code and size
-xxx= inductance value in μH, R= decimal point,
If no R is present then last character equals number of zeros
-R suffix = RoHS compliant
Dimensions (mm)
Part marking: inductance value in uH. R = decimal point. If no R is present then last character equals number of zeroes.
wwlly = date code, R = revision level
Do not route traces or vias underneath the inductor
2
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DR1030
Shielded power inductors
Packaging information (mm)
Supplied in tape and reel packaging , 1000 parts per 13” diameter reel
Technical Data
4132
Effective April 2016
Temperature rise vs. total loss
160
140
Temperature Rise (°C)
120
100
80
60
40
20
0
0.00
0.20
0.40
0.60
0.80
1.00
1.20
Total Loss (W)
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3
Technical Data
4132
Effective April 2016
DR1030
Shielded power inductors
Core loss vs. Bp-p
Core Loss (W)
Bp-p (mT)
Inductance characteristics
120%
100%
80%
% of OCL vs. % of I
sat
% of OCL
60%
40%
20%
0%
-40 °C
+25 °C
+85 °C
0%
20%
40%
60%
80%
100%
120%
% of I
sat
4
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DR1030
Shielded power inductors
Solder reflow profile
T
P
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
L
Preheat
A
t
t
P
T
C
-5°C
Technical Data
4132
Effective April 2016
Table 1 - Standard SnPb Solder (Tc)
Package
Thickness
Volume
mm3
<350
Volume
mm3
≥350
<2.5mm)
≥2.5mm
T
smax
235°C
220°C
220°C
220°C
Temperature
Table 2 - Lead (Pb) Free Solder (Tc)
T
smin
t
s
Package
Thickness
Volume
mm
3
<350
Volume
mm
3
350 - 2000
Volume
mm
3
>2000
<1.6mm
1.6 – 2.5mm
>2.5mm
25°C
Time 25°C to Peak
260°C
260°C
250°C
260°C
250°C
245°C
260°C
245°C
245°C
Time
Reference JDEC J-STD-020D
Profile Feature
Standard SnPb Solder
Lead (Pb) Free Solder
Preheat and Soak
• Temperature min. (Tsmin)
• Temperature max. (Tsmax)
• Time (Tsmin to Tsmax) (ts)
100°C
150°C
60-120 Seconds
3°C/ Second Max.
183°C
60-150 Seconds
Table 1
20 Seconds**
6°C/ Second Max.
6 Minutes Max.
150°C
200°C
60-120 Seconds
3°C/ Second Max.
217°C
60-150 Seconds
Table 2
30 Seconds**
6°C/ Second Max.
8 Minutes Max.
Average ramp up rate Tsmax to Tp
Liquidous temperature (T
l
)
Time at liquidous (tL)
Peak package body temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
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