(1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only, and
functional operation of the device at these or any other conditions
beyond those specified is not implied.
(2) Input terminals are diode clamped to the power-supply rails. Input
signals that can swing more than 0.5V beyond the supply rails
should be current limited to 10mA or less.
(3) Short-circuit to ground; one amplifier per package.
ELECTROSTATIC DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION
(1)
PRODUCT
PACKAGE-LEAD
PACKAGE
DESIGNATOR
DGK
DRB
DGK
DRB
SPECIFIED
TEMPERATURE
RANGE
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
PACKAGE
MARKING
A64
A65
A62
A63
ORDERING
NUMBER
OPA381AIDGKT
OPA381AIDGKR
OPA381AIDRBT
OPA381AIDRBR
OPA2381AIDGKT
OPA2381AIDGKR
OPA2381AIDRBT
OPA2381AIDRBR
TRANSPORT
MEDIA, QUANTITY
Tape and Reel, 250
Tape and Reel, 2500
Tape and Reel, 250
Tape and Reel, 3000
Tape and Reel, 250
Tape and Reel, 2500
Tape and Reel, 250
Tape and Reel, 3000
OPA381
OPA381
OPA2381
OPA2381
MSOP-8
DFN-8
MSOP-8
DFN-8
(1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet.
PIN ASSIGNMENTS
Top View
OPA381
NC
(1 )
−
In
+In
V
−
OPA381
8
7
6
5
NC
(1 )
V+
Out
NC
(1 )
NC
(1 )
−In
+In
V
−
1
2
3
4
MSOP−8
1
2
3
4
Exposed
Thermal
Die Pad
on
Underside
8
NC
(1 )
7
V+
6
Out
5
NC
(1 )
DFN−8
NOTE: (1) NC indicates no internal connection.
OPA2381
Out A
−
In A
OPA2381
8
7
6
5
V+
Out B
−
In B
Out A
−In
A
+In A
V
−
1
2
3
4
MSOP−8
1
2
3
4
+In A
V
−
+In B
Exposed
Thermal
Die Pad
on
Underside
8
V+
7
Out B
6
−
In B
5
+In B
DFN−8
2
www.ti.com
OPA381
OPA2381
SBOS313B − AUGUST 2004 − REVISED NOVEMBER 2004
ELECTRICAL CHARACTERISTICS: V
S
= +2.7V to +5.5V
Boldface
limits apply over the temperature range,
T
A
= −40°C to +125°C.
All specifications at TA = +25°C, RL = 10kΩ connected to VS/2, and VOUT = VS/2, unless otherwise noted.
OPA381
PARAMETER
OFFSET VOLTAGE
Input Offset Voltage
Drift
vs Power Supply
Over Temperature
Long-Term Stability(1)
Channel Separation, dc
INPUT BIAS CURRENT
Input Bias Current
Over Temperature
Input Offset Current
NOISE
Input Voltage Noise, f = 0.1Hz to 10Hz
Input Voltage Noise Density, f = 10kHz
Input Voltage Noise Density, f > 1MHz
Input Current Noise Density, f = 10kHz
INPUT VOLTAGE RANGE
Common-Mode Voltage Range
Common-Mode Rejection Ratio
INPUT IMPEDANCE
Differential Capacitance
Common-Mode Resistance and Capacitance
OPEN-LOOP GAIN
Open-Loop Voltage Gain
FREQUENCY RESPONSE
Gain-Bandwidth Product
Slew Rate
Settling Time, 0.0015%(3)
Settling Time, 0.003%(3)
Overload Recovery Time(4), (5)
OUTPUT
Voltage Output Swing from Positive Rail
Voltage Output Swing from Negative Rail
Voltage Output Swing from Positive Rail
Voltage Output Swing from Negative Rail
Output Current
Short-Circuit Current
Capacitive Load Drive
Open-Loop Output Impedance
POWER SUPPLY
Specified Voltage Range
Quiescent Current (per amplifier)
Over Temperature
TEMPERATURE RANGE
Specified and Operating Range
Storage Range
Thermal Resistance
MSOP-8
DFN-8
AOL
0.05V < VO < (V+) − 0.6V, VCM = VS/2, VS = 5V
0V < V
O
< (V+) − 0.6V, V
CM
= 0V, R
P
= 10kΩ to −5V
(2)
, V
S
= 5V
CONDITION
VOS
dVOS/dT
PSRR
VS = +5V, VCM = 0V
VS = +2.7V to +5.5V, VCM = 0V
VS = +2.7V to +5.5V, VCM = 0V
MIN
TYP
7
0.03
3.5
See Note (1)
1
MAX
25
0.1
20
20
UNITS
µV
µV/°C
µV/V
µV/V
µV/V
pA
pA
µV
PP
nV/√Hz
nV/√Hz
fA/√Hz
IB
IOS
en
en
en
in
VCM
CMRR
VCM = VS/2
VCM = VS/2
VS = +5V, VCM = 0V
VS = +5V, VCM = 0V
VS = +5V, VCM = 0V
VS = +5V, VCM = 0V
3
±50
See Typical Characteristics
6
±100
3
70
10
20
V−
95
(V+) − 1.8V
110
1
13|| 2.5
10
110
106
135
135
18
12
7
7
200
400
600
30
50
400
600
−20
0
10
20
See Typical Characteristics
250
2.7
5.5
1
1.1
+125
+150
150
65
VS = +5V, (V−) < VCM < (V+) − 1.8V
V
dB
pF
Ω
|| pF
dB
dB
MHz
V/µs
µs
µs
ns
mV
mV
mV
mV
mA
mA
Ω
V
mA
mA
°C
°C
°C/W
°C/W
GBW
SR
G = +1
VS = +5V, 4V Step, G = +1, OPA381
VS = +5V, 4V Step, G = +1, OPA2381
VIN
•
G = > VS
RL = 10kΩ
RL = 10kΩ
RP = 10kΩ to −5V(2)
RP = 10kΩ to −5V(2)
IOUT
ISC
CLOAD
RO
VS
IQ
F = 1MHz, IO = 0
IO = 0A
0.8
−40
−65
q
JA
(1) High temperature operating life characterization of zero-drift op amps applying the techniques used in the OPA381 have repeatedly demonstrated randomly
distributed variation approximately equal to measurement repeatability of 1µV. This consistency gives confidence in the stability and repeatability of these zero-
drift techniques.
(2) Tested with output connected only to R , a pulldown resistor connected between V
P
OUT and −5V, as shown in Figure 3. See also
Applications
section,
Achieving
Output Swing to Negative Rail.
(3) Transimpedance frequency of 250kHz.
(4) Time required to return to linear operation.
(5) From positive rail.
3
OPA381
OPA2381
SBOS313B − AUGUST 2004 − REVISED NOVEMBER 2004
www.ti.com
TYPICAL CHARACTERISTICS: V
S
= +2.7V to +5.5V
All specifications at TA = +25°C, RL = 10kΩ connected to VS/2, and VOUT = VS/2, unless otherwise noted.
OPEN−LOOP GAIN AND PHASE vs FREQUENCY
140
120
Open−Loop Gain (dB)
100
80
60
40
20
0
−20
10
100
1k
10k
100k
1M
10M
Frequency (Hz)
Gain
Phase
200
150
PSRR, CMRR (dB)
100
Phase (
_
)
50
0
−50
140
120
100
80
60
40
20
0
−
20
−40
−60
10
POWER−SUPPLY REJECTION RATIO AND
COMMON−MODE REJECTION vs FREQUENCY
PSRR
−
100
−150
−200
100M
CMRR
100
1k
10k
100k
1M
10M
100M
Frequency (Hz)
PHASE MARGIN vs LOAD CAPACITANCE
90
80
Phase Margin (
_
)
70
60
50
R
S
= 50Ω
40
30
R
S
= 0Ω
20
10
0
100
200 300 400 500 600 700
C
L
Load Capacitance (pF)
800 900 1000
R
S
= 100
Ω
Quiescent Current (mA)
1.00
0.90
0.85
0.80
0.75
0.70
0.65
0.60
0.55
0.50
2.7V
5.5V
QUIESCENT CURRENT vs TEMPERATURE
100pF
50kΩ
R
S
C
L
−40 −25
0
25
50
75
100
125
Temperature (_ C)
QUIESCENT CURRENT vs SUPPLY VOLTAGE
1.00
0.90
Quiescent Current (mA)
Input Bias Current (pA)
0.85
0.80
0.75
0.70
0.65
0.60
0.55
0.50
2.7
3.1
3.5
3.9
4.3
4.7
5.1
5.5
Supply Voltage (V)
1
1000
INPUT BIAS CURRENT vs TEMPERATURE
100
10
−40 −25
0
25
50
75
100
125
Temperature (_ C)
4
www.ti.com
OPA381
OPA2381
SBOS313B − AUGUST 2004 − REVISED NOVEMBER 2004
TYPICAL CHARACTERISTICS: V
S
= +2.7V to +5.5V (continued)
All specifications at TA = +25°C, RL = 10kΩ connected to VS/2, and VOUT = VS/2, unless otherwise noted.
Dear experts, I have never been exposed to FPGA and Verilog, but the Senior Design Project of our group is to input two HDMI TV signals into FPGA, and finally output one TV signal. The effect we want ...
[i=s]This post was last edited by ddllxxrr on 2019-4-11 21:50[/i] I tried the straight line a long time ago, but found it was a diagonal line. I found that I could change it to a straight line by chan...
This is the program I modified. I have been struggling with it for two days. I would like to ask an expert to help me solve it. Debugging shows no errors. Thank you very much!!!! QQ648597650 [[i] This...
[i=s]This post was last edited by littleshrimp on 2016-12-23 00:34[/i] I encountered the problem before that the phone could not search after running the CC2650 program after downloading it[url=https:...
Once, a friend invited Ge You to a small restaurant for dinner. Ge You went to the toilet during the meal, and when he came back, his pants were wet. Friend: Why are your pants wet? Ge You: It happens...
The role of digital-to-analog converters
Real-world analog signals, such as temperature, pressure, sound, or images, are constantly being converted into digital form that is easier to store, p...[Details]
This article discusses how to use an ultra-low-power RF transceiver chip from Zarlink Semiconductor for pacemakers, neurostimulators, drug pumps, and other such implantable medical devices t...[Details]
Maximize instrument utilization and reduce
test times
Increasing the throughput of automated test systems can improve efficiency. Using off-the-shelf tools (COTS) such as multicore proc...[Details]
introduction
Like other
portable
electronic products,
blood flow parameter detectors
need to be small, thin, durable, reliable, and have a long standby time. Therefore, system desi...[Details]
1. Introduction
The intelligent detector discussed in this paper is an integrated semiconductor photodetector. Compared with traditional semiconductor photosensitive devices, its most ...[Details]
Preface
For a long time, SD cards with Flash Memory as storage have been widely used in consumer electronic products due to their small size, low power consumption, erasable and non-volati...[Details]
introduction
Image compression technology is becoming more and more important in modern life. With the improvement of data processing speed of DSP, a single-chip DSP can achieve good results...[Details]
Abstract: This paper uses the S3C2410 chip GX development board with ARM920T core as the hardware platform and Windows CE operating system to design an embedded system touch screen interactive func...[Details]
1. Intrusion Detection System (IDS)
IDS is the abbreviation of "Intrusion Detection Systems" in English, which means "Intrusion Detection System" in Chinese. Professionally speaking, it monito...[Details]
Abstract:
The signal flow of the external transceiver in the WCDMA/TD-SCDMA protocol is analyzed. The analysis results show that most of the functional modules in the WCDMA/TD-SCDMA external tr...[Details]
China National Stadium Project Introduction
The National Stadium (Bird's Nest), the main venue for the opening and closing ceremonies of the 2008 Beijing Olympic Games, is located on the g...[Details]
With more and more countries, regions and cities legislating to require drivers to use hands-free calling systems, as well as the shrinking wallets of most consumers around the world and the uncert...[Details]
In today’s body control module (BCM) designs, knowledgeable engineers are moving away from electromechanical relays wherever possible. Their next step is to eliminate fuses. But is eliminating ...[Details]
0 Introduction
In modern industrial production and scientific and technological research, various data usually need to be collected. The commonly used data acquisition board collection met...[Details]
Frequent dropped calls, "network busy" messages, and intermittent service are all potential symptoms of poor device interoperability. Often, these issues are caused by either insufficient validatio...[Details]