Buffer/Inverter Based MOSFET Driver, 1.5A, BICMOS, CDIP8, CERDIP-8
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Microchip |
| Parts packaging code | DIP |
| package instruction | DIP, DIP8,.3 |
| Contacts | 8 |
| Reach Compliance Code | compli |
| ECCN code | EAR99 |
| high side driver | NO |
| Input properties | STANDARD |
| Interface integrated circuit type | BUFFER OR INVERTER BASED MOSFET DRIVER |
| JESD-30 code | R-GDIP-T8 |
| JESD-609 code | e0 |
| length | 9.652 mm |
| Number of functions | 2 |
| Number of terminals | 8 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output characteristics | TOTEM-POLE |
| Nominal output peak current | 1.5 A |
| Output polarity | COMPLEMENTARY |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP8,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 4.5/18 V |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| Maximum seat height | 5.08 mm |
| Maximum slew rate | 8 mA |
| Maximum supply voltage | 18 V |
| Minimum supply voltage | 4.5 V |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | BICMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| Disconnect time | 0.06 µs |
| connection time | 0.06 µs |
| width | 7.62 mm |
| MIC4428AJB | MIC4428CY | MIC4427CY | MIC4427AJB | MIC4426AJB | |
|---|---|---|---|---|---|
| Description | Buffer/Inverter Based MOSFET Driver, 1.5A, BICMOS, CDIP8, CERDIP-8 | 1.5A 2 CHANNEL, BUF OR INV BASED MOSFET DRIVER, UUC6 | 1.5A 2 CHANNEL, BUF OR INV BASED MOSFET DRIVER, UUC6 | Buffer/Inverter Based MOSFET Driver, 1.5A, BICMOS, CDIP8, CERDIP-8 | Buffer/Inverter Based MOSFET Driver, 1.5A, BICMOS, CDIP8, CERDIP-8 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | DIP, DIP8,.3 | DIE-6 | DIE-6 | DIP, DIP8,.3 | DIP, DIP8,.3 |
| Reach Compliance Code | compli | compli | compliant | unknown | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maker | Microchip | Microchip | - | - | Microchip |
| Parts packaging code | DIP | - | - | DIP | DIP |
| Contacts | 8 | - | - | 8 | 8 |
| high side driver | NO | NO | NO | NO | - |
| Input properties | STANDARD | STANDARD | STANDARD | STANDARD | - |
| Interface integrated circuit type | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | - |
| JESD-30 code | R-GDIP-T8 | X-XUUC-N6 | X-XUUC-N6 | R-GDIP-T8 | - |
| JESD-609 code | e0 | e0 | e0 | e0 | - |
| Number of functions | 2 | 2 | 2 | 2 | - |
| Number of terminals | 8 | 6 | 6 | 8 | - |
| Maximum operating temperature | 125 °C | 70 °C | 70 °C | 125 °C | - |
| Output characteristics | TOTEM-POLE | TOTEM-POLE | TOTEM-POLE | TOTEM-POLE | - |
| Nominal output peak current | 1.5 A | 1.5 A | 1.5 A | 1.5 A | - |
| Output polarity | COMPLEMENTARY | TRUE AND INVERTED | TRUE | TRUE | - |
| Package body material | CERAMIC, GLASS-SEALED | UNSPECIFIED | UNSPECIFIED | CERAMIC, GLASS-SEALED | - |
| encapsulated code | DIP | DIE | DIE | DIP | - |
| Package shape | RECTANGULAR | UNSPECIFIED | UNSPECIFIED | RECTANGULAR | - |
| Package form | IN-LINE | UNCASED CHIP | UNCASED CHIP | IN-LINE | - |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | 240 | 240 | NOT SPECIFIED | - |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| Maximum slew rate | 8 mA | 4.5 mA | 4.5 mA | 8 mA | - |
| Maximum supply voltage | 18 V | 18 V | 18 V | 18 V | - |
| Minimum supply voltage | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | - |
| surface mount | NO | YES | YES | NO | - |
| technology | BICMOS | BICMOS | BICMOS | BICMOS | - |
| Temperature level | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | - |
| Terminal surface | Tin/Lead (Sn/Pb) | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) | - |
| Terminal form | THROUGH-HOLE | NO LEAD | NO LEAD | THROUGH-HOLE | - |
| Terminal location | DUAL | UPPER | UPPER | DUAL | - |
| Maximum time at peak reflow temperature | NOT SPECIFIED | 30 | 30 | NOT SPECIFIED | - |
| Disconnect time | 0.06 µs | 0.05 µs | 0.05 µs | 0.06 µs | - |
| connection time | 0.06 µs | 0.05 µs | 0.03 µs | 0.04 µs | - |
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