|
MIC8013-02BN |
MIC8013-01BN |
MIC8013-01AL |
MIC8013-02AL |
| Description |
Liquid Crystal Driver, 30-Segment, CMOS, PDIP40, PLASTIC, DIP-40 |
Liquid Crystal Driver, 30-Segment, CMOS, PDIP40, PLASTIC, DIP-40 |
Liquid Crystal Driver, 30-Segment, CMOS, CQCC40, CERAMIC, LCC-40 |
Liquid Crystal Driver, 30-Segment, CMOS, CQCC40, CERAMIC, LCC-40 |
| Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
| Maker |
Microchip |
Microchip |
Microchip |
Microchip |
| Parts packaging code |
DIP |
DIP |
LCC |
LCC |
| package instruction |
DIP, DIP40,.6 |
DIP, DIP40,.6 |
QCCN, LCC40,.5SQ,40 |
QCCN, LCC40,.5SQ,40 |
| Contacts |
40 |
40 |
40 |
40 |
| Reach Compliance Code |
compli |
compliant |
compliant |
compli |
| ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
| data entry mode |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
| display mode |
DOT MATRIX |
DOT MATRIX |
DOT MATRIX |
DOT MATRIX |
| Input properties |
STANDARD |
STANDARD |
STANDARD |
STANDARD |
| Interface integrated circuit type |
LIQUID CRYSTAL DISPLAY DRIVER |
LIQUID CRYSTAL DISPLAY DRIVER |
LIQUID CRYSTAL DISPLAY DRIVER |
LIQUID CRYSTAL DISPLAY DRIVER |
| JESD-30 code |
R-PDIP-T40 |
R-PDIP-T40 |
S-CQCC-N40 |
S-CQCC-N40 |
| JESD-609 code |
e0 |
e0 |
e0 |
e0 |
| Multiplex display function |
NO |
NO |
NO |
NO |
| Number of base plates |
1-BP |
1-BP |
1-BP |
1-BP |
| Number of functions |
1 |
1 |
1 |
1 |
| Number of segments |
30 |
30 |
30 |
30 |
| Number of terminals |
40 |
40 |
40 |
40 |
| Maximum operating temperature |
85 °C |
85 °C |
125 °C |
125 °C |
| Minimum operating temperature |
-40 °C |
-40 °C |
-55 °C |
-55 °C |
| Output characteristics |
TOTEM-POLE |
TOTEM-POLE |
TOTEM-POLE |
TOTEM-POLE |
| Output polarity |
TRUE |
TRUE |
TRUE |
TRUE |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
| encapsulated code |
DIP |
DIP |
QCCN |
QCCN |
| Encapsulate equivalent code |
DIP40,.6 |
DIP40,.6 |
LCC40,.5SQ,40 |
LCC40,.5SQ,40 |
| Package shape |
RECTANGULAR |
RECTANGULAR |
SQUARE |
SQUARE |
| Package form |
IN-LINE |
IN-LINE |
CHIP CARRIER |
CHIP CARRIER |
| Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
240 |
240 |
| power supply |
3/16,-25 V |
3/16,-25 V |
3/16,-25 V |
3/16,-25 V |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum seat height |
4.318 mm |
4.318 mm |
1.7 mm |
1.7 mm |
| Maximum slew rate |
0.2 mA |
0.2 mA |
0.2 mA |
0.2 mA |
| Maximum supply voltage |
16 V |
16 V |
16 V |
16 V |
| Minimum supply voltage |
3 V |
3 V |
3 V |
3 V |
| Nominal supply voltage |
5 V |
5 V |
5 V |
5 V |
| Supply voltage 1-max |
11 V |
11 V |
11 V |
11 V |
| Mains voltage 1-minute |
-29 V |
-29 V |
-29 V |
-29 V |
| Supply voltage1-Nom |
-25 V |
-25 V |
-25 V |
-25 V |
| surface mount |
NO |
NO |
YES |
YES |
| technology |
CMOS |
CMOS |
CMOS |
CMOS |
| Temperature level |
INDUSTRIAL |
INDUSTRIAL |
MILITARY |
MILITARY |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal form |
THROUGH-HOLE |
THROUGH-HOLE |
NO LEAD |
NO LEAD |
| Terminal pitch |
2.54 mm |
2.54 mm |
1.016 mm |
1.016 mm |
| Terminal location |
DUAL |
DUAL |
QUAD |
QUAD |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
15.24 mm |
15.24 mm |
12.3 mm |
12.3 mm |
| minfmax |
2 MHz |
2 MHz |
2 MHz |
2 MHz |