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MTA41600/SS

Description
SPECIALTY MICROPROCESSOR CIRCUIT, PDSO20, 0.209 INCH, PLASTIC, SSOP-20
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size36KB,1 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Environmental Compliance  
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MTA41600/SS Overview

SPECIALTY MICROPROCESSOR CIRCUIT, PDSO20, 0.209 INCH, PLASTIC, SSOP-20

MTA41600/SS Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMicrochip
Parts packaging codeSSOP
package instruction0.209 INCH, PLASTIC, SSOP-20
Contacts20
Reach Compliance Codecompli
JESD-30 codeR-PDSO-G20
JESD-609 codee3
length7.2 mm
Humidity sensitivity level1
Number of terminals20
Package body materialPLASTIC/EPOXY
encapsulated codeSSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height2 mm
surface mountYES
technologyCMOS
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperature40
width5.3 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR CIRCUIT

MTA41600/SS Related Products

MTA41600/SS MTA41600/P MTA41600/SO
Description SPECIALTY MICROPROCESSOR CIRCUIT, PDSO20, 0.209 INCH, PLASTIC, SSOP-20 SPECIALTY MICROPROCESSOR CIRCUIT, PDIP18, 0.300 INCH, PLASTIC, DIP-18 SPECIALTY MICROPROCESSOR CIRCUIT, PDSO18, 0.300 INCH, PLASTIC, SOIC-18
Is it lead-free? Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to
Maker Microchip Microchip Microchip
Parts packaging code SSOP DIP SOIC
package instruction 0.209 INCH, PLASTIC, SSOP-20 DIP, SOP,
Contacts 20 18 18
Reach Compliance Code compli compliant compliant
JESD-30 code R-PDSO-G20 R-PDIP-T18 R-PDSO-G18
JESD-609 code e3 e3 e3
length 7.2 mm 22.987 mm 11.55 mm
Number of terminals 20 18 18
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SSOP DIP SOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, SHRINK PITCH IN-LINE SMALL OUTLINE
Peak Reflow Temperature (Celsius) 260 NOT SPECIFIED 260
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 2 mm 4.064 mm 2.65 mm
surface mount YES NO YES
technology CMOS CMOS CMOS
Terminal surface Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn)
Terminal form GULL WING THROUGH-HOLE GULL WING
Terminal pitch 0.65 mm 2.54 mm 1.27 mm
Terminal location DUAL DUAL DUAL
Maximum time at peak reflow temperature 40 NOT SPECIFIED 40
width 5.3 mm 7.62 mm 7.5 mm
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT
Humidity sensitivity level 1 - 1
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