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CY7C1577KV18-450BZXC

Description
72-Mbit DDR-II SRAM 2-Word Burst Architecture
File Size647KB,29 Pages
ManufacturerCypress Semiconductor
Download Datasheet View All

CY7C1577KV18-450BZXC Overview

72-Mbit DDR-II SRAM 2-Word Burst Architecture

CY7C1568KV18/CY7C1570KV18
72-Mbit DDR II+ SRAM Two-Word
Burst Architecture (2.5 Cycle Read Latency)
72-Mbit DDR II+ SRAM Two-Word Burst Architecture (2.5 Cycle Read Latency)
Features
Configurations
With Read Cycle Latency of 2.5 cycles:
CY7C1568KV18 – 4M × 18
CY7C1570KV18 – 2M × 36
72-Mbit density (4M × 18, 2M × 36)
550 MHz clock for high bandwidth
Two-word burst for reducing address bus frequency
Double data rate (DDR) interfaces (data transferred at
1100 MHz) at 550 MHz
Available in 2.5 clock cycle latency
Two input clocks (K and K) for precise DDR timing
SRAM uses rising edges only
Echo clocks (CQ and CQ) simplify data capture in high speed
systems
Data valid pin (QVLD) to indicate valid data on the output
Synchronous internally self-timed writes
DDR II+ operates with 2.5 cycle read latency when DOFF is
asserted HIGH
Operates similar to DDR I device with 1 cycle read latency when
DOFF is asserted LOW
Core V
DD
= 1.8 V ± 0.1 V; I/O V
DDQ
= 1.4 V to V
DD[1]
Supports both 1.5 V and 1.8 V I/O supply
HSTL inputs and variable drive HSTL output buffers
Available in 165-ball fine pitch ball grid array (FBGA) package
(13 × 15 × 1.4 mm)
Offered in both Pb-free and non Pb-free packages
JTAG 1149.1 compatible test access port
Phase-locked loop (PLL) for accurate data placement
Functional Description
The CY7C1568KV18 and CY7C1570KV18 are 1.8 V
synchronous pipelined SRAMs equipped with DDR II+
architecture. The DDR II+ consists of an SRAM core with
advanced synchronous peripheral circuitry. Addresses for read
and write are latched on alternate rising edges of the input (K)
clock. Write data is registered on the rising edges of both K and
K. Read data is driven on the rising edges of K and K. Each
address location is associated with two 18-bit words
(CY7C1568KV18), or 36-bit words (CY7C1570KV18) that burst
sequentially into or out of the device.
Asynchronous inputs include an output impedance matching
input (ZQ). Synchronous data outputs (Q, sharing the same
physical pins as the data inputs D) are tightly matched to the two
output echo clocks CQ/CQ, eliminating the need for separately
capturing data from each individual DDR SRAM in the system
design.
All synchronous inputs pass through input registers controlled by
the K or K input clocks. All data outputs pass through output
registers controlled by the K or K input clocks. Writes are
conducted with on-chip synchronous self-timed write circuitry.
For a complete list of related documentation, click
here.
Selection Guide
Description
Maximum operating frequency
Maximum operating current
× 18
× 36
550 MHz
550
760
970
500 MHz
500
700
890
450 MHz
450
650
820
400 MHz
400
590
750
Unit
MHz
mA
Note
1. The Cypress QDR II+ devices surpass the QDR consortium specification and can support V
DDQ
= 1.4 V to V
DD
.
Cypress Semiconductor Corporation
Document Number: 001-15880 Rev. *R
198 Champion Court
San Jose
,
CA 95134-1709
408-943-2600
Revised March 11, 2016
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