1.2 Description of this specification ........................................................................................................................... 1
1.3.1 Class K ........................................................................................................................................................... 1
1.3.2 Class H........................................................................................................................................................... 1
1.3.3 Class G .......................................................................................................................................................... 1
1.3.4 Class D........................................................................................................................................................... 2
1.3.5 Class E ........................................................................................................................................................... 2
1.3.6 Class L ........................................................................................................................................................... 2
1.3.7 Class F ........................................................................................................................................................... 2
2.1 General ............................................................................................................................................................... 2
2.2 Government documents ...................................................................................................................................... 2
2.2.1 Specification, standards, and handbooks ....................................................................................................... 2
2.2.2 Other Government documents, drawings, and publications ........................................................................... 2
2.4 Order of precedence ........................................................................................................................................... 3
3.7 Performance requirements for Class F non-hermetic devices............................................................................. 4
3.8 Performance requirements for Class L non-hermetic devices ............................................................................. 4
3.9 General ............................................................................................................................................................... 6
3.9.1 Implementation of this specification ............................................................................................................... 6
3.9.3 Design and construction ................................................................................................................................. 7
3.9.3.1 Lead finish ................................................................................................................................................. 7
3.9.5 Marking of devices ......................................................................................................................................... 8
3.9.5.1 Part or Identifying Number (PIN) ............................................................................................................... 8
3.9.5.1.1 Device type .......................................................................................................................................... 8
3.9.5.1.2 Device class designator ....................................................................................................................... 8
3.9.5.1.3 Case outline ......................................................................................................................................... 8
3.9.5.1.4 Lead finish ............................................................................................................................................ 9
3.9.5.2 Index point................................................................................................................................................. 9
3.9.5.3 Lot identification code (date code) ............................................................................................................ 9
3.9.5.5 Manufacturer’s designating symbol ........................................................................................................... 9
3.9.5.6 Country of manufacture ............................................................................................................................. 9
3.9.5.7.1 Class K and L serialization ................................................................................................................... 9
3.9.5.7.2 Class H, G, D and F ............................................................................................................................. 9
3.9.5.8 Special marking ......................................................................................................................................... 9
3.9.5.8.3 Certification mark ............................................................................................................................... 10
3.9.5.9 Marking option for controlled storage of Class H and G .......................................................................... 11
3.10.1 Certification of conformance....................................................................................................................... 11
ii
MIL-PRF-38534K
CONTENTS
PARAGRAPH
PAGE
3.11 Recycled, recovered, environmentally preferable, or biobased materials ....................................................... 12
4.1 General verification ........................................................................................................................................... 12
4.2 Quality Management (QM) Program ................................................................................................................. 12
4.3 Baseline process flows ...................................................................................................................................... 12
4.4 Quality management (QM) plan ........................................................................................................................ 13
4.4.1 Self-audit program ........................................................................................................................................ 13
4.4.2 Change control procedures .......................................................................................................................... 13
4.5 Verification for QML listing ................................................................................................................................ 13
4.5.1.3 Classes E, G, H, K, F, and L process flow audits .................................................................................... 13
4.5.1.4 Class D process flow audit ...................................................................................................................... 13
4.5.2.1 Class H and K QML listing ...................................................................................................................... 14
4.5.2.2 Class G, D, F and L QML listing .............................................................................................................. 14
4.5.2.3 Class E listing .......................................................................................................................................... 14
6.1 Intended use ..................................................................................................................................................... 14
6.4.4 Baseline index of documents ....................................................................................................................... 15
6.4.5 Baseline process flow................................................................................................................................... 15
6.4.6 Burn-in lot ..................................................................................................................................................... 15
6.4.8 Compound bond ........................................................................................................................................... 15
6.4.18 Element ...................................................................................................................................................... 16
6.4.19 Film microcircuit ......................................................................................................................................... 16
6.4.20 Final seal .................................................................................................................................................... 16
6.4.25 Inspection lot formation .............................................................................................................................. 17
iii
MIL-PRF-38534K
CONTENTS
PARAGRAPH
PAGE
6.4.26 Integral substrate/package ......................................................................................................................... 17
6.4.27 Known good die (KGD) .............................................................................................................................. 17
6.4.32 Non-continuous production ........................................................................................................................ 17
6.4.34 Package type ............................................................................................................................................. 17
6.4.35 Passive element ......................................................................................................................................... 17
6.4.38 Production lot ............................................................................................................................................. 17
6.4.39 Qualifying activity ....................................................................................................................................... 18
6.4.40 Quality function deployment (QFD) ............................................................................................................ 18
6.4.43 Similar devices ........................................................................................................................................... 18
6.4.44 Standard evaluation circuit (SEC) .............................................................................................................. 18
6.4.45 Statistical process control (SPC) ................................................................................................................ 18
6.7 Subject term (key work) listing .......................................................................................................................... 19
6.8 List of acronyms ................................................................................................................................................ 20
6.9 Change from previous issue.............................................................................................................................. 20
A.1.3 Description of appendix A .............................................................................................................................. 21
A.2.1 General .......................................................................................................................................................... 21
A.2.2 Government documents................................................................................................................................. 21
A.2.2.1 Specifications, standards, and handbooks................................................................................................ 21
A.2.4 Order of precedence ...................................................................................................................................... 22
A.3 QUALITY SYSTEM REQUIREMENTS ............................................................................................................... 22
A.3.2 Quality system ............................................................................................................................................... 22
A.3.2.1 QM plan .................................................................................................................................................... 22
A.3.2.1.5 Baseline index of documents ............................................................................................................... 23
A.3.2.5 QM program (TRB option) ........................................................................................................................ 24
iv
MIL-PRF-38534K
CONTENTS
PARAGRAPH
PAGE
A.3.2.5.1 General ................................................................................................................................................ 24
A.3.2.5.4 Alternative method correlation, confirmation, and implementation procedures .................................... 25
A.3.2.5.4.1 Correlation, confirmation, and implementation ................................................................................ 25
A.3.2.5.4.2 Alternative methods ........................................................................................................................ 26
A.3.2.5.4.2.1 Standard evaluation circuits (SEC) ............................................................................................ 26
A.3.2.5.4.2.2 Periodic assessment of alternative methods .............................................................................. 26
A.3.2.5.5 TRB records ......................................................................................................................................... 26
A.3.3 Conversion of customer requirements ........................................................................................................... 26
A.3.4.1 Changes in design, materials, or processing ............................................................................................ 27
A.3.5 Change control .............................................................................................................................................. 27
A.3.5.1 Configuration control ................................................................................................................................. 27
A.3.6 Control and acceptance of incoming materials .............................................................................................. 28
A.3.6.1 Supplier control program........................................................................................................................... 28
A.3.6.2 Incoming, in-process, and outgoing inventory control ............................................................................... 28
A.3.7 Customer supplied material ........................................................................................................................... 28
A.3.8.1 Material and element traceability .............................................................................................................. 28
A.3.8.3 Production lot traceability .......................................................................................................................... 28
A.3.8.4 Country of manufacture ............................................................................................................................ 28
A.3.8.5 Production lot identification ....................................................................................................................... 28
A.3.9 Process control .............................................................................................................................................. 29
A.3.9.1 Process and material controls................................................................................................................... 29
A.3.10 Inspection and testing .................................................................................................................................. 29
A.3.12 Examples of assembly and verification travelers ......................................................................................... 29
A.3.13 Failure and defect analysis and data feedback ............................................................................................ 30
A.3.13.1 Procedure in case of test equipment failure or operator error ................................................................. 30
A.3.13.1.1 Procedure for sample tests ................................................................................................................ 30
A.3.13.1.2 Procedure for screening tests ............................................................................................................ 30
A.3.13.2 Failure and corrective action reports ....................................................................................................... 30
A.3.14 Failure analysis and corrective action program............................................................................................ 30
A.3.14.1 Reports and analyses of defective devices and failure ........................................................................... 30
A.3.15 Atmospheric control and handling................................................................................................................ 30
A.3.15.1 ESD handling control program ................................................................................................................ 30
A.3.15.2 Cleanliness and atmosphere control in work areas ................................................................................ 31
A.3.16 Control of quality records ............................................................................................................................. 31
A.3.16.1 Records to be maintained ....................................................................................................................... 31
A.3.16.2 Altered records ....................................................................................................................................... 31
The cameras I have are all like this. When the light is a little dim, the frame rate drops to about 12, and there is also ghosting, which is quite annoying. I would like to know why this happens. Coul...
Hello everyone, I recently made a simple host computer program. The serial port keeps sending a string of data outward. At the same time, if the host computer receives data, P25 will light up and P36 ...
I have been busy for a long time. I have never done industrial wiring before. I hope you can give me some advice. All signals are isolated by optocouplers....
The 51 MCU cannot be programmed, and the display shows that it is still connecting. Please power on the MCU. What are the common reasons? Please help!...
Jiangshan Technology's latest JS-9500 memory tester (SD/DDR/DDR2/DDR3) is the industry's leading software and hardware testing system, using the most advanced automatic storage test program in the int...
1. Several nouns
ABI:
The specifications that an executable file must follow in order to run in a specific execution environment;
Separately generated relocatabl...[Details]
The intelligent driving community has its own rhythm. Some are busy pushing new versions and focusing on R&D, others are busy with publicity and promotion, and still others are immersed in mass pro...[Details]
New energy vehicles are increasingly popular with consumers due to policies and energy conservation. Once you've purchased your vehicle, maintenance is essential. However, due to the different powe...[Details]
When we travel in cities, we all find that electric vehicles have many advantages. As a means of transportation, they can also fulfill their mission well. Now, more and more residential communities...[Details]
Whether it is an electric car or an ordinary fuel car, for the vast majority of car buyers, the final cost of use is what they care about most. For fuel cars, how to save fuel is what drivers care ...[Details]
The digital TV set-top box consists of a tuner, QAM demodulator, TS demultiplexer, MPEG-2 decoder, PAUNTSC video encoder, embedded CPU system and peripheral interfaces, CA module, and uplink data m...[Details]
Coal mines typically contain gas and coal dust. When gas and coal dust reach a certain concentration, they can cause explosions. Electrical equipment generates arcs during normal operation or durin...[Details]
Bosch has released a new SoC series to support L2+ advanced driver assistance functions. The chip integrates high resolution and long-range detection capabilities, and has built-in support for neur...[Details]
To improve the lateral active safety of intelligent connected vehicles, the identification and definition of unexpected functional safety scenarios for the EPS (Electronic Steering System) ...[Details]
The practice of warming up a car originated with gasoline-powered vehicles. Warming up the engine allows it to enter a better working state and ensures good lubrication. This has become a habit for...[Details]
It’s a collaborative blueprint designed to address integration complexities and create scalable solutions through Arm’s automotive innovation ecosystem.
The transformation of future mo...[Details]
A transimpedance amplifier (TIA) is a front-end amplifier for optical sensors, such as photodiodes, converting the sensor's output current into a voltage. The concept of a transimpedance amplifier ...[Details]
Electronic scales are a product of modern electronics development. Due to their simplicity, convenience, and high precision, they are widely used in various fields of industry and daily life. Based...[Details]
Electronics Fan Network reported that on August 6th, Shanghai Fourier Co., Ltd. officially launched the GR-3, the third-generation intelligent humanoid Care-bot in its GRx series, in Beijing. This ...[Details]
On August 18, according to a report by Xinbang, China's leading EDA company HuaDa JiuTian will launch this month (August 2025) China's only full-process storage EDA solution that can support ultra-...[Details]
Embedded System
京公网安备 11010802033920号
EEWORLD
