5962-9669205HUX datasheet, PDF

Datasheet> All Categories > storage> storage> 5962-9669205HUX

5962-9669205HUX: DescriptionFlash, 512KX8, 60ns, CDFP32, CERAMIC, FP-32; Categorystorage storage; File Size153KB，24 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

Download Datasheet Parametric View All

5962-9669205HUX Overview

Flash, 512KX8, 60ns, CDFP32, CERAMIC, FP-32

5962-9669205HUX Parametric

Parameter Name	Attribute value
Objectid	1820276940
Parts packaging code	DFP
package instruction	CERAMIC, FP-32
Contacts	32
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Maximum access time	60 ns
JESD-30 code	R-CDFP-F32
length	20.828 mm
memory density	4194304 bit
Memory IC Type	FLASH
memory width	8
Number of functions	1
Number of terminals	32
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	512KX8
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DFP
Package shape	RECTANGULAR
Package form	FLATPACK
Parallel/Serial	PARALLEL
Programming voltage	5 V
Certification status	Not Qualified
Maximum seat height	3.18 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL
width	10.414 mm

Preview

Download Datasheet

View All

REVISIONS

LTR

DESCRIPTION

Changed figure 1; Removed note 3 for case outlines X and Y. Added

vendor cage 88379 for device types 01 through 04. -sld

Added device type 05. Updated drawing to the latest requirements of

MIL-PRF-38534. -sld

Figure 1; case outline X, changed the dimension "D" min from 1.654

inches to 1.6 inches. Added cage 0EU86 for device types 01 through

04. Editorial changes troughout. -sld

Added device type 06. Added case outline Z. Editorial changes

throughout. -sld

DATE (YR-MO-DA)

99-03-29

03-03-17

04-10-21

APPROVED

K. A. Cottongim

Raymond Monnin

05-02-18

Raymond Monnin

REV

SHEET

REV

SHEET

REV STATUS

OF SHEETS

PMIC N/A

REV

SHEET

PREPARED BY

Steve L. Duncan

CHECKED BY

Michael C. Jones

STANDARD

MICROCIRCUIT

DRAWING

THIS DRAWING IS

AVAILABLE

FOR USE BY ALL

DEPARTMENTS

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

AMSC N/A

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

http://www.dscc.dla.mil

APPROVED BY

Kendall A. Cottongim

DRAWING APPROVAL DATE

96-04-22

MICROCIRCUIT, MEMORY, DIGITAL, FLASH

EPROM, 512K x 8-BIT, MONOLITHIC SILICON

REVISION LEVEL

SIZE

SHEET

CAGE CODE

67268

1 OF

5962-96692

DSCC FORM 2233

APR 97

5962-E147-05

DEPARTMENT OF DEFENSE STANDARDS

MIL-STD-883 - Test Method Standard Microcircuits.

MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines.

DEPARTMENT OF DEFENSE HANDBOOKS

MIL-HDBK-103 - List of Standard Microcircuit Drawings.

MIL-HDBK-780 - Standard Microcircuit Drawings.

(Copies of these documents are available online at

http://assist.daps.dla.mil/quicksearch/

http://assist.daps.dla.mil

or from

the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of

this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a

specific exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in

accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 shall include the performance of all tests herein or as

designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class. The

manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as

defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not

affect the form, fit, or function of the device for the applicable device class.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in

MIL-PRF-38534 and herein.

3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.

3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.

3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 3.

3.2.4 Timing diagram(s). The timing diagram(s) shall be as specified on figures 4, 5, and 6 .

3.2.5 Block diagram. The block diagram shall be as specified on figure 7.

3.2.6 Output load circuit. The output load circuit shall be as specified on figure 8.

3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are

as specified in table I and shall apply over the full specified operating temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical

tests for each subgroup are defined in table I.

3.5 Programming procedure. The programming procedure shall be as specified by the manufacturer and shall be available

upon request.

3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with

the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked.

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

SIZE

REVISION LEVEL

5962-96692

SHEET

DSCC FORM 2234

APR 97

3.7 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described

herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample,

for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those

which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be

made available to the preparing activity (DSCC-VA) upon request.

3.8 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this

drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturer's product meets

the performance requirements of MIL-PRF-38534 and herein.

3.9 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of

microcircuits delivered to this drawing.

3.10 Endurance. A reprogrammability test shall be completed as part of the vendor's reliability monitors. This

reprogrammability test shall be done for the initial characterization and after any design process changes which may affect the

reprogrammability of the device. The methods and procedures may be vendor specific, but shall guarantee the number of

program/erase cycles listed in section 1.3 herein over the full military temperature range. The vendor's procedure shall be kept

under document control and shall be made available upon request of the acquiring or preparing activity.

3.11 Data retention. A data retention stress test shall be completed as part of the vendor's reliability monitors. This test shall

be done for initial characterization and after any design process change which may affect data retention. The methods and

procedures may be vendor specific, but shall guarantee the number of years listed in section 1.3 herein over the full military

temperature range. The vendor's procedure shall be kept under document control and shall be made available upon request of

the acquiring or preparing activity.

4. VERIFICATION

4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as

modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form,

fit, or function as described herein.

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

SIZE

REVISION LEVEL

5962-96692

SHEET

DSCC FORM 2234

APR 97

Recommended Resources

A starting circuit that reduces the voltage of the synchronous motor reactor and adds excitation according to the change of the stator current

"Electrical danger" voice warning receiver circuit

Plot MAM-F (S) (A) circuit with current transformer

AC timing switch circuit diagram

Computer motherboard circuit diagram 820 2_20

Oxygen inhalation machine circuit diagram

Solving High-Temperature Isolation Design Challenges Using Grade 0 Digital Isolators: Written by Neel Seshan As the automotive industry continues to adopt 48V systems in hybrid electric vehicles (HEVs), the need for signal isolation in vehicle networks becomes more important. Without r...; alan000345 TI Technology Forum

MSP430F5419: May I ask the master Fatal error: Failed to write memory at 0x5C00 Session aborted! What is the reason? I use MSP430F5419, its routines can be downloaded, but the errors occur when I write my own!...; 1121230101 Microcontroller MCU

Some avatars in the forum: Some of the avatars in the forum look so scary. It would be great if they were fresher and more beautiful. People's aesthetic tastes are so different....; wanghlady Talking

What is the minimum number of JTAG download ports for MSP430?: [font=宋体][size=3]What is the minimum number of JTAG download ports for MSP430?If I configure the minimum number of download PIN ports, which PIN ports should I use? [font=宋体][color=#000000][size=12pt]...; wgsxsm Microcontroller MCU

EEWORLD University Hall----Design Difficulties and Solutions of TI Isolated DC/DC Bias Power Supply: TI isolated DC/DC bias power supply design difficulties and solutions : https://training.eeworld.com.cn/course/3678...; wanglan123 Talking

stm32f103 stop low power consumption measurement value is too high: Please give me some advice: Set the IO interrupt input trigger mode to falling trigger; Circuit: Use ldo to generate 3.3V to power stm32f103rbt6, minimum system, reset circuit; boot0 is pulled down to...; hugo0chen stm32/stm8

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components