S2010CPZ226K30 datasheet, PDF - EEWORLD Datasheet

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S2010CPZ226K30: DescriptionFixed Resistor, Metal Glaze/thick Film, 1W, 22000000ohm, 150V, 10% +/-Tol, 300ppm/Cel, Surface Mount, 2010, CHIP, ROHS COMPLIANT; CategoryPassive components The resistor; File Size128KB，1 Pages; ManufacturerState of the Art Inc.; Environmental Compliance

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S2010CPZ226K30 Overview

Fixed Resistor, Metal Glaze/thick Film, 1W, 22000000ohm, 150V, 10% +/-Tol, 300ppm/Cel, Surface Mount, 2010, CHIP, ROHS COMPLIANT

S2010CPZ226K30 Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Objectid	1627366856
package instruction	CHIP, ROHS COMPLIANT
Reach Compliance Code	compliant
Country Of Origin	USA
ECCN code	EAR99
YTEOL	7.7
structure	Chip
JESD-609 code	e4
Manufacturer's serial number	2010
Installation features	SURFACE MOUNT
Number of terminals	2
Maximum operating temperature	150 °C
Minimum operating temperature	-65 °C
Package height	0.71 mm
Package length	5.13 mm
Package shape	RECTANGULAR PACKAGE
Package form	SMT
Package width	2.38 mm
method of packing	BULK
Rated power dissipation(P)	1 W
Rated temperature	70 °C
Guideline	MIL-PRF-55342
resistance	22000000 Ω
Resistor type	FIXED RESISTOR
series	2010(STD)-THICKFILM
size code	2010
surface mount	YES
technology	METAL GLAZE/THICK FILM
Temperature Coefficient	300 ppm/°C
Terminal surface	Gold (Au) - with Nickel (Ni) barrier
Terminal shape	WRAPAROUND
Tolerance	10%
Operating Voltage	150 V

S2010CPZ226K30 Preview

2010 Thick Film Chip Resistor

Standard Grade, Wraparound

PERFORMANCE CHARACTERISTICS

Resistance Range

Tolerances (1)

TCR

Thermal Resistance

Maximum Power

Maximum Voltage

(1)+/- 0.5% limited availability

W-40

0.5%,1%, 2%, 5%,10%

±100, ±200, ±300 ppm

48.4°C/W

1000 mW

150 Volts

GLASS

PASSIVATION

RESISTOR

FILM

96% ALUMINA CHIP

WRAPAROUND

TERMINATIONS

CURRENT NOISE

TEMPERATURE RISE (°C)

POWER DISSIPATION

fiber epoxy board

ceramic board

ENVIRONMENTAL PERFORMANCE (2)

Thermal Shock

Low Temperature Operation

Short-time Overload

Resistance to Bonding Exposure

Moisture Resistance

High Temperature Exposure

Life Test

±0.03%

±0.05%

See Chart

POWER DISSIPATION (WATTS)

LIFE TEST

POWER DERATING

(2)Typical resistance change, test methods and criteria

per MIL-PRF-55342.

PART NUMBERING

S 2010 C P X 150 J 20 - TR

PACKAGING CODE: - TR = Tape/Reel - W = Waffle Carrier (Default packaging is Bulk)

TEMPERATURE CHARACTERISTIC: 10: ±100 ppm 20: ±200 ppm 30: ±300 ppm

TOLERANCE: F: 1% G: 2% J: 5% K: 10% M: 20%

RESISTANCE VALUE:

Four digits are used for tolerances of 1% or lower, three digits are used above 1%. Leading digits are significant while the last digit

specifies the number of zeros to add. The letter "R" is used to represent the decimal for fractional ohmic values. Example: 5R6 is 5.6

ohms.

TERMINATION FINISH: X: Sn60 over Nickel (Solderable) C: Silver bearing (Epoxy bondable-RoHS) G: Gold (Epoxy bondable-RoHS)

Y: Silver over Nickel (Solderable -RoHS) Z: Gold over Nickel (Solderable-RoHS)

PRODUCT DESIGNATION: P: Thick film on alumina U: Untrimmed alumina (10% & 20% tolerance only)

TERMINATION TYPE: C: Wraparound termination

SIZE CODE

GRADE: S: Standard Production H: High Reliability (For Screening options, contact the factory)

MECHANICAL

INCHES

MILLIMETERS

.252

MINIMUM

RECOMMENDED

MOUNTING

PADS

(INCHES)

Length

Width

Thickness

Top Term

Bottom Term

Gap

Approx. Weight

.202 (.200 - .210)

.094 (.093 - .100)

.028 (.023 - .033)

.020 (.015 - .025)

.019 (.015 - .025)

.164 (.160 - .168)

.0323 grams

5.13

2.38

0.71

0.51

0.48

4.17

(5.08 - 5.33)

(2.36 - 2.54)

(0.58 - 0.84)

(0.38 - 0.64)

(4.06 - 4.27)

.100

.154

.049

“Specifications subject to change without notice.”

STATE OF THE ART, INC.

2470 Fox Hill Road, State College, PA 16803-1797

Phone (814) 355-8004

www.resistor.com

Fax (814) 355-2714

Toll Free 1-800-458-3401

02/08/08

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