EEWORLDEEWORLDEEWORLD

Part Number

Search

HCHP2010K2052DW131

Description
Fixed Resistor, Metal Glaze/thick Film, 1W, 20500ohm, 200V, 0.5% +/-Tol, -100,100ppm/Cel, 2010,
CategoryPassive components    The resistor   
File Size152KB,9 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Environmental Compliance
Download Datasheet Parametric View All

HCHP2010K2052DW131 Overview

Fixed Resistor, Metal Glaze/thick Film, 1W, 20500ohm, 200V, 0.5% +/-Tol, -100,100ppm/Cel, 2010,

HCHP2010K2052DW131 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid966328667
Reach Compliance Codecompliant
Country Of OriginFrance
ECCN codeEAR99
YTEOL7.8
structureChip
JESD-609 codee4
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package height0.5 mm
Package length5.08 mm
Package formSMT
Package width2.54 mm
method of packingWaffle Pack
Rated power dissipation(P)1 W
GuidelineMIL-R-55342D
resistance20500 Ω
Resistor typeFIXED RESISTOR
seriesHCHP HYBRID
size code2010
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient100 ppm/°C
Terminal surfaceGold (Au) - with Nickel (Ni) barrier
Tolerance0.5%
Operating Voltage200 V
CHP, HCHP
Vishay Sfernice
High Stability Resistor Chips (< 0.25 % at Pn at 70 °C during 1000 h)
Thick Film Technology
FEATURES
Vishay Sfernice thick film resistor chips are specially
designed to meet very stringent specifications in terms
of reliability, stability < 0.25 % at Pn at + 70 °C during
1000 h, homogeneity, reproducibility and quality.
They conform
MIL-R-55342 D.
to
specifications
NFC
83-240
and
Robust terminations
Large ohmic value range 0.1
Ω
to 100 MΩ
Tight tolerance to 0.5 %
CHP: Standard passivated version for
industrial, professional and military applications
HCHP: For high frequency applications
ESCC approved see CHPHR
SMD wraparound chip resistor
Halogen-free according to IEC 61249-2-21 definition
Compliant to RoHS directive 2002/95/0EC
Sputtered Thin Film terminations, with nickel barrier, are very
convenient for high operating conditions. They can withstand
thousands of very severe thermal shocks.
B (W/A), N (W/A) and F (one face) types are for solder reflow
assembly.
G (W/A) and W (one face) types are for wire bonding, gluing
and even high temperature solder reflow.
Evaluated to ESCC 4001/026 (see CHPHR datasheet).
DIMENSIONS
in millimeters (inches)
A
D
D
C
D
A
D
C
E
E
B
A
B
VALUE
TOL.
VALUE
TOL.
1.27
0.152
0.60
0502
0.127 (0.005)
(0.050)
(0.006)
(0.024)
1.27
0.152
1.27
0.127 (0.005)
0505
(0.050)
(0.006)
(0.050)
1.52
0.152
0.85
0603
0.127 (0.005)
(0.060)
(0.006)
(0.033)
0705/
1.91
0.152
1.27
0.127 (0.005)
0805
(0.075)
(0.006)
(0.050)
2.54
0.152
1.27
0.127 (0.005)
1005
(0.100)
(0.006)
(0.050)
3.05
0.152
1.60
1206
0.127 (0.005)
(0.120)
(0.006)
(0.063)
3.81
0.152
1505
1.32 (0.052)
0.127 (0.005)
(0.150)
(0.006)
5.08
0.152
2.54 (0.100)
0.127 (0.005)
2010
(0.200)
(0.006)
2.54
0.152
5.08 (0.200)
0.127 (0.005)
1020
(0.100)
(0.006)
5.58
0.152
2208
1.91 (0.075)
0.127 (0.005)
(0.220)
(0.006)
6.35
0.152
3.06 (0.120)
0.127 (0.005)
2512
(0.250)
(0.006)
2.54
0.152
2.54 (0.100)
0.127 (0.005)
1010
(0.100)
(0.006)
* Pb containing terminations are not RoHS compliant, exemptions may apply
CASE
SIZE
www.vishay.com
54
C
VALUE
0.5
(0.020)
0.5
(0.020)
0.5
(0.020)
0.5
(0.020)
0.5
(0.020)
0.5
(0.020)
0.5
(0.020)
0.5
(0.020)
0.5
(0.020)
0.5
(0.020)
0.5 (0.020)
0.5 (0.020)
TOL.
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
VALUE
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
D/E
TOL.
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
For technical questions, contact:
sfer@vishay.com
Document Number: 52023
Revision: 25-Aug-09
Industrial Control TCP/IP Protocol
[table][tr][td]Industrial control cannot be separated from communication, and most advanced controls are connected to the network. The background uses a 64-bit multi-core CPU such as X86, and uses a d...
西点 Industrial Control Electronics
Show the process of WEBENCH design + STM32 power supply
1. External input 12V, output 3.3v2. Overall design results3. Chart comparison4. Generate schematic diagram...
william228 Analogue and Mixed Signal
What issues should be considered in the hardware design of microcontroller application systems?
(1) Memory expansion: Capacity requirements. When selecting, the internal memory resources of the MCU should be considered. If the requirements can be met, there is no need to expand. When expansion i...
fish001 Microcontroller MCU
Who has the Linux version of QT creator 2.4.1?
Does anyone have a Linux version of QT creator 2.4.1? I can only find a Windows version online....
wnwolf ARM Technology
Let's dance at Christmas
...
硅步机器人 Talking
wince network communication
Problem description: Two wince devices are ready to communicate over a UDP network. After the program was written, it was tested and the phenomenon was as follows: The wince device and PC tested UDP n...
pj830520 Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2040  2842  608  630  1258  42  58  13  26  7 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号