BX80547PG3400EJ datasheet, PDF

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BX80547PG3400EJ: DescriptionRISC Microprocessor, 32-Bit, 3400MHz, CMOS, CBGA775; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，96 Pages; ManufacturerIntel; Websitehttp://www.intel.com/

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BX80547PG3400EJ Overview

RISC Microprocessor, 32-Bit, 3400MHz, CMOS, CBGA775

BX80547PG3400EJ Parametric

Parameter Name	Attribute value
Objectid	1167370401
package instruction	LGA, LGA775,30X33,46/43
Reach Compliance Code	compliant
ECCN code	3A991.A.1
bit size	32
JESD-30 code	R-XBGA-N775
Number of terminals	775
Package body material	CERAMIC
encapsulated code	LGA
Encapsulate equivalent code	LGA775,30X33,46/43
Package shape	RECTANGULAR
Package form	GRID ARRAY
power supply	1.3 V
Certification status	Not Qualified
speed	3400 MHz
Nominal supply voltage	1.3 V
surface mount	YES
technology	CMOS
Terminal form	NO LEAD
Terminal pitch	1.1 mm
Terminal location	BOTTOM
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC

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Intel

Pentium

4 Processors

570/571, 560/561, 550/551,

∆

540/541, 530/531 and 520/521

Supporting Hyper-Threading

Technology

Datasheet

On 90 nm Process in 775-land LGA Package and

supporting Intel

Extended Memory 64 Technology

May 2005

Document Number: 302351-004

Contents

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY

ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN

INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS

ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES

RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER

INTELLECTUAL PROPERTY RIGHT. INTEL PRODUCTS ARE NOT INTENDED FOR USE IN MEDICAL, LIFE SAVING, OR LIFE SUSTAINING

APPLICATIONS.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for

future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

The Intel

Pentium

4 processor in the 775-land package on 90 nm process may contain design defects or errors known as errata which may cause

the product to deviate from published specifications. Current characterized errata are available on request.

∆

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across

different processor families.

Hyper-Threading Technology requires a computer system with an Intel

Pentium

4 processor supporting Hyper-Threading Technology and an HT

Technology enabled chipset, BIOS and operating system. Performance will vary depending on the specific hardware and software you use. See

http:/

/www.intel.com/info/hyperthreading/

for more information including details on which processors support HT Technology.

Intel

Extended Memory 64 Technology (Intel

EM64T) requires a computer system with a processor, chipset, BIOS, operating system, device

drivers and applications enabled for Intel EM64T. Processor will not operate (including 32-bit operation) without an Intel EM64T-enabled BIOS.

Performance will vary depending on your hardware and software configurations. See

http://www.intel.com/info/em64t

for more information including

details on which processors support EM64T or consult with your system vendor for more information.

Enabling Execute Disable Bit functionality requires a PC with a processor with Execute Disable Bit capability and a supporting operating system.

Check with your PC manufacturer on whether your system delivers Execute Disable Bit functionality.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Intel, Pentium, Itanium, Intel Xeon, Intel NetBurst and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in

the United States and other countries.

*Other names and brands may be claimed as the property of others.

Datasheet

Contents

Introduction.................................................................................................................................... 11

1.1

1.2

2.1

2.2

2.3

Terminology ........................................................................................................................ 12

1.1.1 Processor Packaging Terminology ........................................................................ 12

References ......................................................................................................................... 13

FSB and GTLREF............................................................................................................... 15

Power and Ground Lands................................................................................................... 15

Decoupling Guidelines........................................................................................................ 15

2.3.1 VCC Decoupling .................................................................................................... 16

2.3.2 FSB GTL+ Decoupling........................................................................................... 16

2.3.3 FSB Clock (BCLK[1:0]) and Processor Clocking ................................................... 16

Voltage Identification .......................................................................................................... 17

2.4.1 Phase Lock Loop (PLL) Power and Filter .............................................................. 19

Reserved, Unused, FC and TESTHI Signals...................................................................... 20

FSB Signal Groups ............................................................................................................. 21

GTL+ Asynchronous Signals ..............................................................................................22

Test Access Port (TAP) Connection ................................................................................... 23

FSB Frequency Select Signals (BSEL[2:0]) ....................................................................... 23

Absolute Maximum and Minimum Ratings ......................................................................... 24

Processor DC Specifications ..............................................................................................24

VCC Overshoot Specification ............................................................................................. 33

2.12.1 Die Voltage Validation ........................................................................................... 33

GTL+ FSB Specifications....................................................................................................34

Package Mechanical Drawing ............................................................................................ 35

Processor Component Keep-Out Zones............................................................................. 39

Package Loading Specifications......................................................................................... 39

Package Handling Guidelines............................................................................................. 39

Package Insertion Specifications........................................................................................ 40

Processor Mass Specification............................................................................................. 40

Processor Materials ............................................................................................................ 40

Processor Markings ............................................................................................................ 40

Processor Land Coordinates ..............................................................................................41

Processor Land Assignments ............................................................................................. 43

Alphabetical Signals Reference .......................................................................................... 66

Processor Thermal Specifications ...................................................................................... 75

5.1.1 Thermal Specifications .......................................................................................... 75

5.1.2 Thermal Metrology ................................................................................................. 79

Processor Thermal Features ..............................................................................................79

5.2.1 Thermal Monitor..................................................................................................... 79

5.2.2 Thermal Monitor 2.................................................................................................. 80

Electrical Specifications ................................................................................................................. 15

2.4

2.5

2.6

2.7

2.8

2.9

2.10

2.11

2.12

2.13

3.1

3.2

3.3

3.4

3.5

3.6

3.7

3.8

3.9

4.1

4.2

5.1

Package Mechanical Specifications ..............................................................................................35

Land Listing and Signal Descriptions ............................................................................................ 43

Thermal Specifications and Design Considerations ...................................................................... 75

5.2

Datasheet

Contents

5.2.3

5.2.4

5.2.5

5.2.6

5.2.7

6.1

6.2

On-Demand Mode ................................................................................................. 81

PROCHOT# Signal................................................................................................ 82

THERMTRIP# Signal............................................................................................. 82

CONTROL

and Fan Speed Reduction.................................................................... 82

Thermal Diode ....................................................................................................... 83

Features ........................................................................................................................................ 85

Power-On Configuration Options........................................................................................ 85

Clock Control and Low Power States ................................................................................. 85

6.2.1 Normal State.......................................................................................................... 86

6.2.2 HALT and Enhanced HALT Powerdown States .................................................... 86

6.2.3 Stop-Grant State.................................................................................................... 87

6.2.4 Enhanced HALT Snoop or HALT Snoop State, Grant Snoop State ...................... 88

Mechanical Specifications .................................................................................................. 90

7.1.1 Boxed Processor Cooling Solution Dimensions .................................................... 90

7.1.2 Boxed Processor Fan Heatsink Weight ................................................................. 91

7.1.3 Boxed Processor Retention Mechanism and Heatsink

Attach Clip Assembly............................................................................................. 91

Electrical Requirements...................................................................................................... 91

7.2.1 Fan Heatsink Power Supply .................................................................................. 91

Thermal Specifications ....................................................................................................... 93

7.3.1 Boxed Processor Cooling Requirements............................................................... 93

7.3.2 Variable Speed Fan ............................................................................................... 95

Boxed Processor Specifications .................................................................................................... 89

7.1

7.2

7.3

Datasheet

Contents

Figures

2-1

2-2

2-3

2-4

3-1

3-2

3-3

3-4

3-5

3-6

3-7

4-1

4-2

5-1

5-2

5-3

5-4

6-1

7-1

7-2

7-3

7-4

7-5

7-6

7-7

7-8

7-9

Phase Lock Loop (PLL) Filter Requirements.............................................................................. 19

VCC Static and Transient Tolerance for 775_VR_CONFIG_04A............................................... 28

VCC Static and Transient Tolerance for 775_VR_CONFIG_04B............................................... 30

VCC Overshoot Example Waveform .......................................................................................... 33

Processor Package Assembly Sketch ........................................................................................ 35

Processor Package Drawing 1 ................................................................................................... 36

Processor Package Drawing 2 ................................................................................................... 37

Processor Package Drawing 3 ................................................................................................... 38

Processor Top-Side Marking Example ....................................................................................... 40

Processor Top-Side Marking Example for Processors Supporting Intel

EM64T ...................... 41

Processor Land Coordinates (Top View).................................................................................... 42

Landout Diagram (Top View – Left Side).................................................................................... 44

Landout Diagram (Top View – Right Side) ................................................................................. 45

Thermal Profile for Processors with PRB = 1 ............................................................................. 77

Thermal Profile for Processors with PRB = 0 ............................................................................. 78

Case Temperature (TC) Measurement Location ........................................................................ 79

Thermal Monitor 2 Frequency and Voltage Ordering .................................................................81

Processor Low Power State Machine......................................................................................... 87

Mechanical Representation of the Boxed Processor.................................................................. 89

Space Requirements for the Boxed Processor (Side View) ....................................................... 90

Space Requirements for the Boxed Processor (Top View) ........................................................ 90

Space Requirements for the Boxed Processor (Overall View) ................................................... 91

Boxed Processor Fan Heatsink Power Cable Connector Description ........................................ 92

Baseboard Power Header Placement Relative to Processor Socket ......................................... 93

Boxed Processor Fan Heatsink Airspace Keepout Requirements (Top View) ........................... 94

Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side View) .......................... 94

Boxed Processor Fan Heatsink Set Points................................................................................. 95

Datasheet

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