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MM74HCT244MTCX

Description
buffers & line drivers octal 3-state buffer
Categorylogic    logic   
File Size107KB,8 Pages
ManufacturerFairchild
Websitehttp://www.fairchildsemi.com/
Environmental Compliance
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MM74HCT244MTCX Overview

buffers & line drivers octal 3-state buffer

MM74HCT244MTCX Parametric

Parameter NameAttribute value
Brand NameFairchild Semiconduc
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerFairchild
Parts packaging codeTSSOP
package instructionTSSOP, TSSOP20,.25
Contacts20
Manufacturer packaging code20LD, TSSOP, JEDEC MO-153, 4.4MM WIDE
Reach Compliance Codecompli
ECCN codeEAR99
Control typeENABLE LOW
seriesHCT
JESD-30 codeR-PDSO-G20
JESD-609 codee4
length6.5 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeBUS DRIVER
MaximumI(ol)0.006 A
Humidity sensitivity level1
Number of digits4
Number of functions2
Number of ports2
Number of terminals20
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Output characteristics3-STATE
Output polarityTRUE
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP20,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packingTAPE AND REEL
Peak Reflow Temperature (Celsius)260
power supply5 V
Prop。Delay @ Nom-Su25 ns
propagation delay (tpd)35 ns
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width4.4 mm
MM74HCT240 • MM74HCT244 Inverting Octal 3-STATE Buffer • Octal 3-STATE Buffer
February 1984
Revised May 2005
MM74HCT240 • MM74HCT244
Inverting Octal 3-STATE Buffer • Octal 3-STATE Buffer
General Description
The MM74HCT240 and MM74HCT244 3-STATE buffers
utilize advanced silicon-gate CMOS technology and are
general purpose high speed inverting and non-inverting
buffers. They possess high drive current outputs which
enable high speed operation even when driving large bus
capacitances. These circuits achieve speeds comparable
to low power Schottky devices, while retaining the low
power consumption of CMOS. All three devices are TTL
input compatible and have a fanout of 15 LS-TTL equiva-
lent inputs.
MM74HCT devices are intended to interface between TTL
and NMOS components and standard CMOS devices.
These parts are also plug-in replacements for LS-TTL
devices and can be used to reduce power consumption in
existing designs.
The MM74HCT240 is an inverting buffer and the
MM74HCT244 is a non-inverting buffer. Each device has
two active low enables (1G and 2G), and each enable inde-
pendently controls 4 buffers.
All inputs are protected from damage due to static dis-
charge by diodes to V
CC
and Ground.
Features
s
TTL input compatible
s
Typical propagation delay: 14 ns
s
3-STATE outputs for connection to system buses
s
Low quiescent current: 80
P
A
s
High output drive current: 6 mA (min)
Ordering Code:
Order Number
MM74HCT240WM
MM74HCT240SJ
MM74HCT240MTC
MM74HCT240N
MM74HCT244WM
MM74HCT244SJ
MM74HCT244MTC
MM74HCT244N
Package Number
M20B
M20D
MTC20
N20A
M20B
M20D
MTC20
N20A
Package Description
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Connection Diagrams
Pin Assignments for DIP, SOIC, SOP and TSSOP
Top View
MM74HCT240
Top View
MM74HCT244
© 2005 Fairchild Semiconductor Corporation
DS005365
www.fairchildsemi.com

MM74HCT244MTCX Related Products

MM74HCT244MTCX MM74HCT244SJX_NL
Description buffers & line drivers octal 3-state buffer buffers and line drivers finished good
Is it Rohs certified? conform to conform to
Maker Fairchild Fairchild
Parts packaging code TSSOP SOIC
package instruction TSSOP, TSSOP20,.25 SOP, SOP20,.3
Contacts 20 20
Reach Compliance Code compli compli
Control type ENABLE LOW ENABLE LOW
series HCT HCT
JESD-30 code R-PDSO-G20 R-PDSO-G20
JESD-609 code e4 e3
length 6.5 mm 12.6 mm
Load capacitance (CL) 50 pF 50 pF
Logic integrated circuit type BUS DRIVER BUS DRIVER
MaximumI(ol) 0.006 A 0.006 A
Humidity sensitivity level 1 1
Number of digits 4 4
Number of functions 2 2
Number of ports 2 2
Number of terminals 20 20
Maximum operating temperature 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C
Output characteristics 3-STATE 3-STATE
Output polarity TRUE TRUE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP SOP
Encapsulate equivalent code TSSOP20,.25 SOP20,.3
Package shape RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
method of packing TAPE AND REEL TAPE AND REEL
Peak Reflow Temperature (Celsius) 260 260
power supply 5 V 5 V
Prop。Delay @ Nom-Su 25 ns 25 ns
propagation delay (tpd) 35 ns 35 ns
Certification status Not Qualified Not Qualified
Maximum seat height 1.2 mm 2.1 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V
surface mount YES YES
technology CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL
Terminal surface Nickel/Palladium/Gold (Ni/Pd/Au) Matte Tin (Sn)
Terminal form GULL WING GULL WING
Terminal pitch 0.65 mm 1.27 mm
Terminal location DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED
width 4.4 mm 5.3 mm
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