EQTB73E1E-10.000M-CE
REGULATORY COMPLIANCE
2011/65 +
2015/863
(Data Sheet downloaded on Sep 6, 2020)
191 SVHC
ITEM DESCRIPTION
Temperature Compensated Quartz Crystal Clock Oscillators TCXO LVCMOS (CMOS) 3.3Vdc 14-Pin DIP Metal Thru-Hole
10.000MHz 0°C to +50°C
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Stability
Frequency Stability vs. Frequency
Tolerance
Frequency Stability vs. Input Voltage
Frequency Stability vs. Load
Frequency Stability vs. Reflow
Aging at 25°C
Operating Temperature Range
Supply Voltage
Input Current
Output Voltage Logic High (Voh)
Output Voltage Logic Low (Vol)
Rise/Fall Time
Duty Cycle
Load Drive Capability
Output Logic Type
Phase Noise
Storage Temperature Range
10.000MHz
±3.0ppm Maximum (Inclusive of Operating Temperature Range, at Vdd=3.3Vdc)
±2.0ppm Maximum (At 25°C ±2°C, at Vdd=3.3Vdc)
±0.3ppm Maximum (±5%)
±0.3ppm Maximum (±2pF)
±1.0ppm Maximum (at 25°C, 1 hour after reflow, 1 times)
±1ppm/Year Maximum
0°C to +50°C
3.3Vdc ±5%
10mA Maximum
90% of Vdd Minimum IOL=-4mA
10% of Vdd Maximum IOL=+4mA
10nSec Maximum (Measured at 20% to 80% of waveform)
50 ±10(%) (Measured at 50% of waveform)
15pF Maximum
CMOS
-96dBc at 10Hz Offset, -122dBc at 100Hz Offset, -138dBc at 1kHz Offset, -145dBc at 10kHz Offset, -150dBc at 100kHz
Offset (Typical Values)
-40°C to +85°C
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test
Gross Leak Test
Lead Integrity
Mechanical Shock
Resistance to Soldering Heat
Resistance to Solvents
Solderability
Temperature Cycling
Vibration
MIL-STD-883, Method 1014 Condition A
MIL-STD-883, Method 1014 Condition C
MIL-STD-883, Method 2004
MIL-STD-202, Method 213 Condition C
MIL-STD-202, Method 210
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
MIL-STD-883, Method 1010
MIL-STD-883, Method 2007 Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Revision A 09/20/2013 | Page 1 of 5
Ecliptek, LLC
5458 Louie Lane, Reno, NV 89511
1-800-ECLIPTEK or 714.433.1200
EQTB73E1E-10.000M-CE
MECHANICAL DIMENSIONS (all dimensions in millimeters)
15.2
±0.1
7.6
±0.1
1
14
7
8
6.3 MAX
7.5 MAX
12.8
±0.2
MARKING
ORIENTATION
DIA 0.45
±0.10 (X4)
PIN
CONNECTION
No Connect
Case/Ground
Output
Supply Voltage
0.8 MAX
1
7
8
14
LINE MARKING
1
2
3
ECLIPTEK
10.000M
XXXXX
XXXXX=Ecliptek
Manufacturing Identifier
20.2 ±0.2
www.ecliptek.com | Specification Subject to Change Without Notice | Revision A 09/20/2013 | Page 2 of 5
Ecliptek, LLC
5458 Louie Lane, Reno, NV 89511
1-800-ECLIPTEK or 714.433.1200
EQTB73E1E-10.000M-CE
OUTPUT WAVEFORM
CLOCK OUTPUT
V
OH
80% of Waveform
50% of Waveform
20% of Waveform
V
OL
Fall
Time
Rise
Time
T
W
T
Duty Cycle (%) = T
W
/T x 100
www.ecliptek.com | Specification Subject to Change Without Notice | Revision A 09/20/2013 | Page 3 of 5
Ecliptek, LLC
5458 Louie Lane, Reno, NV 89511
1-800-ECLIPTEK or 714.433.1200
EQTB73E1E-10.000M-CE
Test Circuit for No Connect Option
Oscilloscope
Frequency
Counter
Current
Meter
Power
Supply
Voltage
Meter
0.01µF
(Note 1)
Supply
Voltage
(V
DD
)
Probe
(Note 2)
Output
0.1µF
(Note 1)
Ground
C
L
(Note 3)
No
Connect
Note 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency
ceramic bypass capacitor close (less than 2mm) to the package ground and supply voltage pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value C
L
includes sum of all probe and fixture capacitance.
Value Added Option - Cut Leads
4.445 ±0.500
All dimensions are in millimeters
www.ecliptek.com | Specification Subject to Change Without Notice | Revision A 09/20/2013 | Page 4 of 5
Ecliptek, LLC
5458 Louie Lane, Reno, NV 89511
1-800-ECLIPTEK or 714.433.1200
EQTB73E1E-10.000M-CE
Recommended Solder Reflow Methods
Low Temperature Solder Bath (Wave Solder)
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
5°C/Second Maximum
N/A
150°C
N/A
30 - 60 Seconds
5°C/Second Maximum
150°C
200 Seconds Maximum
245°C Maximum
245°C Maximum 1 Time / 235°C Maximum 2 Times
5 Seconds Maximum 1 Time / 15 Seconds Maximum 2 Times
5°C/Second Maximum
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 Seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 Seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Revision A 09/20/2013 | Page 5 of 5
Ecliptek, LLC
5458 Louie Lane, Reno, NV 89511
1-800-ECLIPTEK or 714.433.1200
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