I got a book in this book grab event: Here is the 3D photo:I got this book by following others. It is a bit difficult for me and I need to study hard for a while! ! ! I want to say that I followed oth...
CSP ( chip scale packaging ) technology is driving the development of packaging and printed circuit boards towards smaller size. Wafer-level CSP refers to silicon wafers with redistribution film layer...
Please help recommend a DC/DC suitable for the following parameters, thank you! [color=#000][backcolor=rgba(0, 0, 0, 0)][size=10.5pt] 1. Voltage: Input voltage is greater than about 40V (40V, 45V, 50V...
I recently looked at several circuit diagrams and found that the COM terminals of chips or module circuits are sometimes connected to GND. I also saw a GND marked as COM in RS232. I am not a professio...
I have been working on a UCOS ii program these days, which is based on IAR software. There is one thing I don't quite understand. At the beginning of the program, after stacking the various stacks, it...