S29AS008J70TFI030 datasheet, PDF

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S29AS008J70TFI030: Descriptionflash 8mb 1.8V 70ns parallel nor flash; Categorystorage storage; File Size1MB，55 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/; Environmental Compliance

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flash 8mb 1.8V 70ns parallel nor flash

S29AS008J70TFI030 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	SPANSION
Parts packaging code	TSOP1
package instruction	LEAD FREE, MO-142DDD, TSOP-48
Contacts	48
Reach Compliance Code	unknow
ECCN code	EAR99
Maximum access time	70 ns
Spare memory width	8
startup block	TOP
command user interface	YES
Universal Flash Interface	YES
Data polling	YES
JESD-30 code	R-PDSO-G48
length	18.4 mm
memory density	8388608 bi
Memory IC Type	FLASH
memory width	16
Number of functions	1
Number of departments/size	8,15
Number of terminals	48
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	512KX16
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Encapsulate equivalent code	TSSOP48,.8,20
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial	PARALLEL
power supply	1.8 V
Programming voltage	1.8 V
Certification status	Not Qualified
ready/busy	YES
Maximum seat height	1.2 mm
Department size	8K,64K
Maximum standby current	0.00003 A
Maximum slew rate	0.03 mA
Maximum supply voltage (Vsup)	1.95 V
Minimum supply voltage (Vsup)	1.65 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	DUAL
switch bit	YES
type	NOR TYPE
width	12 mm

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S29AS008J

8 Megabit (1M x 8-Bit / 512K x 16-Bit)

CMOS 1.8 Volt-Only Boot Sector Flash Memory

Data Sheet

S29AS008J Cover Sheet

Notice to Readers:

This document states the current technical specifications regarding the Spansion

product(s) described herein. Each product described herein may be designated as Advance Information,

Preliminary, or Full Production. See

Notice On Data Sheet Designations

for definitions.

Publication Number

S29AS008J_00

Revision

Issue Date

November 9, 2011

D at a

S hee t

Notice On Data Sheet Designations

Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise readers of

product information or intended specifications throughout the product life cycle, including development,

qualification, initial production, and full production. In all cases, however, readers are encouraged to verify

that they have the latest information before finalizing their design. The following descriptions of Spansion data

sheet designations are presented here to highlight their presence and definitions.

Advance Information

The Advance Information designation indicates that Spansion Inc. is developing one or more specific

products, but has not committed any design to production. Information presented in a document with this

designation is likely to change, and in some cases, development on the product may discontinue. Spansion

Inc. therefore places the following conditions upon Advance Information content:

“This document contains information on one or more products under development at Spansion Inc.

The information is intended to help you evaluate this product. Do not design in this product without

contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed

product without notice.”

Preliminary

The Preliminary designation indicates that the product development has progressed such that a commitment

to production has taken place. This designation covers several aspects of the product life cycle, including

product qualification, initial production, and the subsequent phases in the manufacturing process that occur

before full production is achieved. Changes to the technical specifications presented in a Preliminary

document should be expected while keeping these aspects of production under consideration. Spansion

places the following conditions upon Preliminary content:

“This document states the current technical specifications regarding the Spansion product(s)

described herein. The Preliminary status of this document indicates that product qualification has been

completed, and that initial production has begun. Due to the phases of the manufacturing process that

require maintaining efficiency and quality, this document may be revised by subsequent versions or

modifications due to changes in technical specifications.”

Combination

Some data sheets contain a combination of products with different designations (Advance Information,

Preliminary, or Full Production). This type of document distinguishes these products and their designations

wherever necessary, typically on the first page, the ordering information page, and pages with the DC

Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first

page refers the reader to the notice on this page.

Full Production (No Designation on Document)

When a product has been in production for a period of time such that no changes or only nominal changes

are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include

those affecting the number of ordering part numbers available, such as the addition or deletion of a speed

option, temperature range, package type, or V

range. Changes may also include those needed to clarify a

description or to correct a typographical error or incorrect specification. Spansion Inc. applies the following

conditions to documents in this category:

“This document states the current technical specifications regarding the Spansion product(s)

described herein. Spansion Inc. deems the products to have been in sufficient production volume such

that subsequent versions of this document are not expected to change. However, typographical or

specification corrections, or modifications to the valid combinations offered may occur.”

Questions regarding these document designations may be directed to your local sales office.

S29AS008J

S29AS008J_00_09 November 9, 2011

D at a

S hee t

General Description

The S29AS008J is a 8 Mbit, 1.8 Volt-only Flash memory organized as 1,048,576 bytes or 524,288 words with

a x8/x16 bus and either top or bottom boot sector architecture. The device is offered in 48-pin TSOP and 48-

ball FBGA packages. The word-wide data (x16) appears on DQ15–DQ0; the byte-wide (x8) data appears on

DQ7–DQ0. This device is designed to be programmed and erased in-system with the standard system 1.8

volt V

supply. A 12.0 V V

or 5.0 V

are not required for program or erase operations. The device can

also be programmed in standard EPROM programmers.

The device offers access time of 70 ns allowing high speed microprocessors to operate without wait states. To

eliminate bus contention the device has separate chip enable (CE#), write enable (WE#) and output enable

(OE#) controls.

The device requires only a

single 1.8 volt power supply

for both read and write functions. Internally

generated and regulated voltages are provided for the program and erase operations.

The S29AS008J is entirely command set compatible with the

JEDEC single-power-supply Flash standard.

Commands are written to the command register using standard microprocessor write timings. Register

contents serve as input to an internal state-machine that controls the erase and programming circuitry. Write

cycles also internally latch addresses and data needed for the programming and erase operations. Reading

data out of the device is similar to reading from other Flash or EPROM devices.

Device programming occurs by executing the program command sequence. This initiates the

Embedded

Program

algorithm—an internal algorithm that automatically times the program pulse widths and verifies

proper cell margin. The

Unlock Bypass

mode facilitates faster programming times by requiring only two write

cycles to program data instead of four.

Device erasure occurs by executing the erase command sequence. This initiates the

Embedded Erase

algorithm—an internal algorithm that automatically preprograms the array (if it is not already programmed)

before executing the erase operation. During erase, the device automatically times the erase pulse widths

and verifies proper cell margin.

The host system can detect whether a program or erase operation is complete by observing the RY/BY# pin,

or by reading the DQ7 (Data# Polling) and DQ6 (toggle)

status bits.

After a program or erase cycle has been

completed, the device is ready to read array data or accept another command.

The

sector erase architecture

allows memory sectors to be erased and reprogrammed without affecting the

data contents of other sectors. The device is fully erased when shipped from the factory.

Hardware data protection

measures include a low V

detector that automatically inhibits write operations

during power transitions. The

hardware sector group protection

feature disables both program and erase

operations in any combination of the sectors of memory. This can be achieved in-system or via programming

equipment.

The

Erase Suspend/Erase Resume

feature enables the user to put erase on hold for any period of time to

read data from, or program data to, any sector that is not selected for erasure. True background erase can

thus be achieved.

The

hardware RESET# pin

terminates any operation in progress and resets the internal state machine to

reading array data. The RESET# pin may be tied to the system reset circuitry. A system reset would thus also

reset the device, enabling the system microprocessor to read the boot-up firmware from the Flash memory.

The device offers two power-saving features. When addresses have been stable for a specified amount of

time, the device enters the

automatic sleep mode.

The system can also place the device into the

standby

mode.

Power consumption is greatly reduced in both these modes.

Spansion’s Flash technology combines years of Flash memory manufacturing experience to produce the

highest levels of quality, reliability and cost effectiveness. The device electrically erases all bits within a

sector simultaneously via Fowler-Nordheim tunneling. The data is programmed using hot electron

injection.

S29AS008J

S29AS008J_00_09 November 9, 2011

Data

She et

Table of Contents

Distinctive Characteristics

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

General Description

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Product Selector Guide

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Block Diagram

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Connection Diagrams

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.1

Standard TSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.2

FBGA Connection Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.3

Special Handling Instructions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Pin Configuration

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Logic Symbol

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Ordering Information

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

6.1

S29AS008J Standard Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Device Bus Operations

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.1

Word/Byte Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.2

Requirements for Reading Array Data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.3

Writing Commands/Command Sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.4

Program and Erase Operation Status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.5

Standby Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.6

Automatic Sleep Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.7

RESET#: Hardware Reset Pin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.8

Output Disable Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.9

Autoselect Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.10 Sector Address Tables. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.11 Sector Group Protection/Unprotection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.12 Temporary Sector Group Unprotect. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.13 Write Protect (WP#) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.14 Hardware Data Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Secured Silicon Sector Flash Memory Region

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

8.1

Factory Locked: Secured Silicon Sector Programmed

and Protected at the Factory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

8.2

Customer Lockable: Secured Silicon Sector NOT Programmed

or Protected at the Factory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Common Flash Memory Interface (CFI)

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Command Definitions

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

10.1 Reading Array Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

10.2 Reset Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

10.3 Autoselect Command Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

10.4 Enter Secured Silicon Sector/Exit Secured Silicon Sector Command Sequence . . . . . . . . .

10.5 Word/Byte Program Command Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

10.6 Unlock Bypass Command Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

10.7 Chip Erase Command Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

10.8 Sector Erase Command Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

10.9 Erase Suspend/Erase Resume Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

10.

11.

12.

Command Definitions

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Write Operation Status

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

12.1 DQ7: Data# Polling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

12.2 RY/BY#: Ready/Busy#. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

12.3 DQ6: Toggle Bit I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

12.4 DQ2: Toggle Bit II . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

12.5 Reading Toggle Bits DQ6/DQ2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

12.6 DQ5: Exceeded Timing Limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

12.7 DQ3: Sector Erase Timer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

November 9, 2011 S29AS008J_00_09

S29AS008J

S29AS008J70TFI030 Related Products

	S29AS008J70TFI030	S29AS008J70BFI030	S29AS008J70TFI040
Description	flash 8mb 1.8V 70ns parallel nor flash	flash 8mb 3V 70ns parallel nor flash	flash 8mb 1.8V 70ns parallel nor flash
Is it Rohs certified?	conform to	conform to	conform to
Maker	SPANSION	SPANSION	SPANSION
Parts packaging code	TSOP1	BGA	TSOP1
package instruction	LEAD FREE, MO-142DDD, TSOP-48	VFBGA, BGA48,6X8,32	LEAD FREE, MO-142DDD, TSOP-48
Contacts	48	48	48
Reach Compliance Code	unknow	compliant	unknow
ECCN code	EAR99	EAR99	EAR99
Maximum access time	70 ns	70 ns	70 ns
Spare memory width	8	8	8
startup block	TOP	TOP	BOTTOM
command user interface	YES	YES	YES
Universal Flash Interface	YES	YES	YES
Data polling	YES	YES	YES
JESD-30 code	R-PDSO-G48	R-PBGA-B48	R-PDSO-G48
length	18.4 mm	8.15 mm	18.4 mm
memory density	8388608 bi	8388608 bit	8388608 bi
Memory IC Type	FLASH	FLASH	FLASH
memory width	16	16	16
Number of functions	1	1	1
Number of departments/size	8,15	8,15	8,15
Number of terminals	48	48	48
word count	524288 words	524288 words	524288 words
character code	512000	512000	512000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C
organize	512KX16	512KX16	512KX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSSOP	VFBGA	TSSOP
Encapsulate equivalent code	TSSOP48,.8,20	BGA48,6X8,32	TSSOP48,.8,20
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	GRID ARRAY, VERY THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL
power supply	1.8 V	1.8 V	1.8 V
Programming voltage	1.8 V	1.8 V	1.8 V
Certification status	Not Qualified	Not Qualified	Not Qualified
ready/busy	YES	YES	YES
Maximum seat height	1.2 mm	0.8 mm	1.2 mm
Department size	8K,64K	8K,64K	8K,64K
Maximum standby current	0.00003 A	0.00003 A	0.00003 A
Maximum slew rate	0.03 mA	0.03 mA	0.03 mA
Maximum supply voltage (Vsup)	1.95 V	1.95 V	1.95 V
Minimum supply voltage (Vsup)	1.65 V	1.65 V	1.65 V
Nominal supply voltage (Vsup)	1.8 V	1.8 V	1.8 V
surface mount	YES	YES	YES
technology	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	GULL WING	BALL	GULL WING
Terminal pitch	0.5 mm	0.8 mm	0.5 mm
Terminal location	DUAL	BOTTOM	DUAL
switch bit	YES	YES	YES
type	NOR TYPE	NOR TYPE	NOR TYPE
width	12 mm	6.15 mm	12 mm

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