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Q67100-Q2189

Description
3.3V 8M x 64-Bit EDO-DRAM Module 3.3V 8M x 72-Bit EDO-DRAM Module
File Size95KB,17 Pages
ManufacturerSIEMENS
Websitehttp://www.infineon.com/
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Q67100-Q2189 Overview

3.3V 8M x 64-Bit EDO-DRAM Module 3.3V 8M x 72-Bit EDO-DRAM Module

3.3V 8M
×
64-Bit EDO-DRAM Module
3.3V 8M x 72-Bit EDO-DRAM Module
168pin unbuffered DIMM Module
with serial presence detect
HYM64V8005GU-50/-60
HYM64V8045GU-50/-60
HYM72V8005GU-50/-60
HYM72V8045GU-50/-60
168 Pin JEDEC Standard, Unbuffered 8 Byte Dual In-Line Memory Module
for PC main memory applications
1 bank 8M x 64, 8M x 72 in 4k and 8k refresh organisation
Optimized for byte-write non-parity or ECC applications
Extended Data Out (EDO)
Performance:
-50
tRAC
tCAC
tAA
tRC
tHPC
RAS Access Time
CAS Access Time
Access Time from Address
Cycle Time
EDO Mode Cycle Time
50 ns
13 ns
25 ns
84 ns
20 ns
-60
60 ns
15 ns
30 ns
104 ns
25 ns
Single +3.3 V
±
0.3 V Power Supply
CAS-before-RAS refresh, RAS-only-refresh
Decoupling capacitors mounted on substrate
All inputs, outputs and clocks are fully LV-TTL compatible
Serial presence detects (optional)
Utilizes 8M
×
8 -DRAMs in TSOPII packages
4096 refresh cycles / 64 ms with 12 / 11 addressing (Row / Column) for HYM64/72V8005GU
8192 refresh cycles / 128 ms with 13 / 10 addressing (Row / Column) for HYM64/72V8045GU
Gold contact pad
Card Size: 133,35mm x 25,40 mm x 4,00 mm
This DRAM product module family is intended to be fully pin and architecture compatible
with the 168pin unbuffered SDRAM DIMM module family
Semiconductor Group
1
2.97

Q67100-Q2189 Related Products

Q67100-Q2189 Q67100-Q2188 HYM64V8005GU-50 HYM64V8005GU-60 HYM64V8045GU-50 HYM64V8045GU-60 HYM72V8005GU-50 HYM72V8005GU-60 HYM72V8045GU-50 HYM72V8045GU-60
Description 3.3V 8M x 64-Bit EDO-DRAM Module 3.3V 8M x 72-Bit EDO-DRAM Module 3.3V 8M x 64-Bit EDO-DRAM Module 3.3V 8M x 72-Bit EDO-DRAM Module 3.3V 8M x 64-Bit EDO-DRAM Module 3.3V 8M x 72-Bit EDO-DRAM Module 3.3V 8M x 64-Bit EDO-DRAM Module 3.3V 8M x 72-Bit EDO-DRAM Module 3.3V 8M x 64-Bit EDO-DRAM Module 3.3V 8M x 72-Bit EDO-DRAM Module 3.3V 8M x 64-Bit EDO-DRAM Module 3.3V 8M x 72-Bit EDO-DRAM Module 3.3V 8M x 64-Bit EDO-DRAM Module 3.3V 8M x 72-Bit EDO-DRAM Module 3.3V 8M x 64-Bit EDO-DRAM Module 3.3V 8M x 72-Bit EDO-DRAM Module 3.3V 8M x 64-Bit EDO-DRAM Module 3.3V 8M x 72-Bit EDO-DRAM Module 3.3V 8M x 64-Bit EDO-DRAM Module 3.3V 8M x 72-Bit EDO-DRAM Module
Maker - - SIEMENS SIEMENS SIEMENS SIEMENS SIEMENS SIEMENS SIEMENS SIEMENS
Parts packaging code - - DIMM DIMM DIMM DIMM DIMM DIMM DIMM DIMM
Contacts - - 168 168 168 168 168 168 168 168
Reach Compliance Code - - unknow unknow unknow unknow unknow unknow unknow unknow
ECCN code - - EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
access mode - - FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO
Maximum access time - - 50 ns 60 ns 50 ns 60 ns 50 ns 60 ns 50 ns 60 ns
Other features - - RAS ONLY/CAS BEFORE RAS/HIDDEELF REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEELF REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEELF REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEELF REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEELF REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEELF REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEELF REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEELF REFRESH
JESD-30 code - - R-XDMA-N168 R-XDMA-N168 R-XDMA-N168 R-XDMA-N168 R-XDMA-N168 R-XDMA-N168 R-XDMA-N168 R-XDMA-N168
memory density - - 536870912 bi 536870912 bi 536870912 bi 536870912 bi 603979776 bi 603979776 bi 603979776 bi 603979776 bi
Memory IC Type - - EDO DRAM MODULE EDO DRAM MODULE EDO DRAM MODULE EDO DRAM MODULE EDO DRAM MODULE EDO DRAM MODULE EDO DRAM MODULE EDO DRAM MODULE
memory width - - 64 64 64 64 72 72 72 72
Number of functions - - 1 1 1 1 1 1 1 1
Number of ports - - 1 1 1 1 1 1 1 1
Number of terminals - - 168 168 168 168 168 168 168 168
word count - - 8388608 words 8388608 words 8388608 words 8388608 words 8388608 words 8388608 words 8388608 words 8388608 words
character code - - 8000000 8000000 8000000 8000000 8000000 8000000 8000000 8000000
Operating mode - - ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature - - 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize - - 8MX64 8MX64 8MX64 8MX64 8MX72 8MX72 8MX72 8MX72
Output characteristics - - 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material - - UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
Package shape - - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form - - MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Certification status - - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
refresh cycle - - 4096 4096 8192 8192 4096 4096 8192 8192
Maximum supply voltage (Vsup) - - 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) - - 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V
Nominal supply voltage (Vsup) - - 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount - - NO NO NO NO NO NO NO NO
technology - - CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level - - COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form - - NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD
Terminal location - - DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
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