TLE 5216 G
Pin Definitions and Functions
Pin No.
3
4
5
6
7
8
9
1, 10, 11, 20
12
13
14
15
16
17
18
2, 19
Symbol
IN1
IN2
OUT1
Function
Input switch 1; active LOW; internal pull-up
Input switch 2; active LOW; internal pull-up
Output switch 1; overload and shorted load protected
Supply voltage
Output switch 2; overload and shorted load protected
Data-out of serial diagnostic interface;
open drain
Clock for serial diagnostic interface
Ground
Chip select for serial diagnostic interface; internal pull-up
Data-in of serial diagnostic interface; internal pull-up
Output switch 3; overload and shorted load protected
Reset; active LOW; shuts down all outputs and resets
the error flags
Output switch 4;
overload and shorted load protected
Input switch 3; active LOW; internal pull-up
Input switch 4; active LOW; internal pull-up
Not connected
V
S
OUT2
SEROUT
CLK
GND
CS
SERIN
OUT3
RESET
OUT4
IN3
IN4
N.C.
Semiconductor Group
3
1998-06-22
TLE 5216 G
Application Description
This IC is specially designed to drive inductive loads up to 2 A nominal current (valves,
relays, etc.). Integrated clamp-diodes limit the output voltage when inductive loads are
turned off.
For the detection of errors at the load there is a serial diagnostic interface, which
monitors the following errors for every output separately:
– open load in inactive mode
– shorted output (shorted to ground) in inactive mode
– overload or shorted load in active mode
Circuit Description
The block diagram shows the four independent power drivers with the referring logic
block and the serial diagnostic interface which stores and transfers the diagnostic
signals to the external circuit. Each power switch connects a high side load to ground
when a LOW signal applies at the inputs. To protect the IC against short circuit and over
load each output is provided with a current limitation and a delayed overload shutdown.
The slew rate of the switching process is limited internally.
The integrated clamp diodes limit the voltage at the output to
V
DS(AZ)
, when inductive
loads are switched off. The maximum power dissipation, which is given from the static
and dynamic thermal resistance, limits the allowable inductive energy. A diode in parallel
to every output clamps negative voltage.
All outputs, preferably the outputs 1 and 2 and the outputs 3 and 4 may be used in
parallel (no addition of max. freewheeling energy).
A curve of the output voltage is shown in
figure 6.
The diagnostic block monitors the voltages across the power switch. If in active mode
(LOW level input) there is a higher voltage than
V
DS(OV)
for a time longer than
t
VDS(OV)
, the
diagnostic block will show an overload in the error register and the affected power switch
will be shut off. The switch can only be reactivated if the corresponding input is switched
off and then on again.
In inactive mode (HIGH level at input) open load or shorted output (shorted load to
ground) is detected and signalled to the serial diagnostic interface. If the voltage across
the power switch is lower than
V
DS(OL)
for the time
t
VDS(OL)
(min. 50
µs)
open load is
identified. If the voltage is even lower than
V
DS(SH)
for the time
t
VDS(SH)
(min. 30
µs)
"shorted to ground" is detected. An internal voltage divider will pull the output to the
voltage
V
DS
if there is an open load.
A new error on the same output stage will over-write the old error report. The protocol of
the serial diagnostic interface includes independent error reports for each output driver.
As soon as an error is latched into the error register the serial data output (SEROUT) of
the interface will go LOW (while CS is still HIGH). If the chip select gets a LOW signal
Semiconductor Group
5
1998-06-22
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