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The intelligent driving community has its own rhythm. Some are busy pushing new versions and focusing on R&D, others are busy with publicity and promotion, and still others are immersed in mass pro...[Details]
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Flip-chip and ball grid array (BGA) are two widely used packaging technologies in the electronics industry. Each has its own advantages and limitations, and in some cases, they can complement each ...[Details]
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A vacuum eutectic furnace is a critical piece of equipment used in the manufacturing and processing of various materials, particularly in the fields of microelectronics and nanotechnology. One of t...[Details]
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New energy vehicles are increasingly popular with consumers due to policies and energy conservation. Once you've purchased your vehicle, maintenance is essential. However, due to the different powe...[Details]
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In recent years, with the application of the IEC61850 standard and the development and deployment of optoelectronic transformers, the concept of digital substations has been put into practical use ...[Details]
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1. Introduction
Electronic scales are gradually replacing traditional measuring tools like springs and balances in everyday life, such as electronic price computing scales and electronic weigh...[Details]
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According to foreign media reports, BMW has just been granted a patent for a screen that could cover the entire roof. BMW hopes to transform at least a portion of the vehicle's headliner into a dis...[Details]
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When discussing autonomous driving technology, there are often two extremes: on the one hand, there's the vision of "fully autonomous driving," while on the other, there's concern about potential s...[Details]
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According to foreign media reports, Nissan Motor has recently reached a cooperation with US battery technology company LiCAP Technologies to jointly promote the research and development of next-gen...[Details]
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The digital TV set-top box consists of a tuner, QAM demodulator, TS demultiplexer, MPEG-2 decoder, PAUNTSC video encoder, embedded CPU system and peripheral interfaces, CA module, and uplink data m...[Details]
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Through AI connection technology supported by Qualcomm X85 5G modem and RF and Qualcomm FastConnect 7900 mobile connection system, seamless switching can be achieved between cellular net...[Details]
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According to Nikkei, Japan has performed poorly in responding to China's power semiconductor challenges.
There are five major companies in Japan's power chip market: Mitsubishi Electric,...[Details]
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Plug-in hybrid vehicles (PHEVs) utilize two powertrains. Their pure electric range is typically inferior to that of pure electric vehicles, often reaching less than half that. Currently, mainstream...[Details]
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The drive shaft is the shaft in a universal joint that transmits power. As a high-speed, low-support rotating body, its dynamic balance is crucial. Generally, drive shafts undergo dynamic balancing...[Details]
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Munich, Germany, August 19, 2025 –
Infineon Technologies AG, a global semiconductor leader in power systems and the Internet of Things, announced today that its AIROC™ CYW20829 Bluetooth® low e...[Details]
Microcontroller MCU
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