EEWORLDEEWORLDEEWORLD

Part Number

Search

10091836-D0J-20B

Description
high speed / modular connectors xcede LT 4pvh4col WK
CategoryThe connector   
File Size1MB,4 Pages
ManufacturerFCI [First Components International]
Download Datasheet Parametric View All

10091836-D0J-20B Overview

high speed / modular connectors xcede LT 4pvh4col WK

10091836-D0J-20B Parametric

Parameter NameAttribute value
ManufactureFCI
Product CategoryHigh Speed / Modular Connectors
RoHSN
Factory Pack Quantity152
BAcKpAneL connectors
XCede
®
HigH-PerformanCe
BaCkPlane ConneCtor SyStem
Description
Fci’s Xcede
®
connector platform is designed for 25 Gb/s
performance to provide the headroom to support future
high-speed, serial data rate requirements demanded by
next-generation equipment in data centers and service
provider networks. the use of engineering polymers in a
resonance-damping shield enables very low crosstalk
across a wide frequency range.
Xcede connectors also address requirements for higher
linear signal density at the interface of backplane and
daughter card. signal connectors can be configured with
2, 4 or 6 differential pairs per column, providing up to 82.4
differential pairs/inch, suiting architectures with multiple
front or rear fabric slots and blade systems with cooling
straight through the backplane. complementary guidance
and power modules are also included in the product
range. A wafer organizer can be used to combine groups
of right-angle signal, guidance and power modules as an
integrated daughter-card connector.
the Xcede backplane header system provides the
ruggedness and long-term reliability required by today’s
systems. the wide ground contacts feature a stiffness-
enhancing rib and are advanced well ahead of the signals
for exceptional robustness and signal pin protection.
FeAtures & BeneFits
High-speed backplane system designed for 25 Gb/s
Use of engineering materials in the shield aids in
reduction of crosstalk resonances
1.85 mm column pitch offers high linear signal density
• Configurations with 6 differential pairs/column fit 36 mm
card slot pitch and provide 82.4 pairs/inch
• 4 pairs/column fit 25 mm slot pitch with 54.9 pairs/inch
• 2 pairs/column fit 15 mm slot pitch with 27.5 pairs/inch
Two ground vias between differential pairs allow elongated
antipads to further improve impedance
Optional short compliant pin permits deeper backdrilling and
dual diameter vias to enhance return loss performance
Wide ground contacts feature a stiffening rib and are
advanced well ahead of signals for exceptional robustness
and signal pin protection
Intermateable, electrically and mechanically interchangeable
licensed second source to Amphenol TCS
Xcede® is a registered trademark of Amphenol corporation
tArGet MArKets / AppLicAtions
Communications
Routers
Switches
Networking
Access
Transport
Wireless
Data
Servers
Storage Systems
Industrial
Medical
Test & Measurement
MCF52233_PIT
[align=center][font=function() { var id = (this._style >> 24) & 0xff; return this.FONTMAP.substring(2*(id-1), 2 * id); }][size=3][color=#000000]MCF52233_PIT—Programmable Interrupt Timers[/color][/size...
tjbbjiang NXP MCU
Pink noise 10mins
Pink noise 10mins...
bobyao Download Centre
dsp bootloader c5000
The most troublesome thing when you first learn DSP is the DSP bootload problem. When you were learning 51 before, you only needed to write the program and compile it, then you could use a burner to b...
fish001 DSP and ARM Processors
tinym0 hardware emulation shows warning
I have a TinyM0 development board by Zhou Ligong. The hardware simulation shows a warning: No device on the target board is found. Please check whether the target board is powered on, the simulation c...
maleisj NXP MCU
Urgent, urgent, urgent, urgent, urgent, urgent
Does anyone know if the Tyco T92S7D12-48 relay is in stock? 18858658644...
欧亿电器 PCB Design
MSP-EXP430FR5739 Experimental Board Kit Group Purchase Application
The MSP430 ultra-low power microcontroller is used to make a precision equipment transportation monitoring module to monitor and record the temperature, humidity, vibration and tilt of the transportat...
xscc Microcontroller MCU

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2460  1193  2610  144  2347  50  25  53  3  48 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号