10091777-E0E-50DLF datasheet, PDF

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10091777-E0E-50DLF: Descriptionhigh speed / modular connectors xcede 6pr 6col RT pol guide W/ key; CategoryThe connector; File Size1MB，4 Pages; ManufacturerFCI [First Components International]; Environmental Compliance

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10091777-E0E-50DLF Overview

high speed / modular connectors xcede 6pr 6col RT pol guide W/ key

10091777-E0E-50DLF Parametric

Parameter Name	Attribute value
Manufacture	FCI
Product Category	High Speed / Modular Connectors
RoHS	Yes
Factory Pack Quantity	96

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BAcKpAneL connectors

XCede

HigH-PerformanCe

BaCkPlane ConneCtor SyStem

Description

Fci’s Xcede

connector platform is designed for 25 Gb/s

performance to provide the headroom to support future

high-speed, serial data rate requirements demanded by

next-generation equipment in data centers and service

provider networks. the use of engineering polymers in a

resonance-damping shield enables very low crosstalk

across a wide frequency range.

Xcede connectors also address requirements for higher

linear signal density at the interface of backplane and

daughter card. signal connectors can be configured with

2, 4 or 6 differential pairs per column, providing up to 82.4

differential pairs/inch, suiting architectures with multiple

front or rear fabric slots and blade systems with cooling

straight through the backplane. complementary guidance

and power modules are also included in the product

range. A wafer organizer can be used to combine groups

of right-angle signal, guidance and power modules as an

integrated daughter-card connector.

the Xcede backplane header system provides the

ruggedness and long-term reliability required by today’s

systems. the wide ground contacts feature a stiffness-

enhancing rib and are advanced well ahead of the signals

for exceptional robustness and signal pin protection.

FeAtures & BeneFits

High-speed backplane system designed for 25 Gb/s

Use of engineering materials in the shield aids in

reduction of crosstalk resonances

1.85 mm column pitch offers high linear signal density

• Configurations with 6 differential pairs/column fit 36 mm

card slot pitch and provide 82.4 pairs/inch

• 4 pairs/column fit 25 mm slot pitch with 54.9 pairs/inch

• 2 pairs/column fit 15 mm slot pitch with 27.5 pairs/inch

Two ground vias between differential pairs allow elongated

antipads to further improve impedance

Optional short compliant pin permits deeper backdrilling and

dual diameter vias to enhance return loss performance

Wide ground contacts feature a stiffening rib and are

advanced well ahead of signals for exceptional robustness

and signal pin protection

Intermateable, electrically and mechanically interchangeable

licensed second source to Amphenol TCS

Xcede® is a registered trademark of Amphenol corporation

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